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JP-7855557-B2 - Processing apparatus and processing method

JP7855557B2JP 7855557 B2JP7855557 B2JP 7855557B2JP-7855557-B2

Inventors

  • 柴崎 祐一

Assignees

  • 株式会社ニコン

Dates

Publication Date
20260508
Application Date
20230831

Claims (14)

  1. A mounting device on which the workpiece is placed, A beam irradiation system that irradiates the surface of the workpiece with a beam from a focusing optical system and removes at least a portion of the workpiece while scanning the beam and the workpiece relative to each other , A measuring device that receives a beam emitted from the aforementioned focusing optical system with a light receiving unit, The device comprises a control device that controls the focusing position of the beam based on at least one of the following: the intensity of the beam measured by the measuring device, the material of the workpiece, and the relative scanning speed between the beam and the workpiece. The control device controls the focusing position to focus the beam at a focusing position that is shifted parallel to the direction from which the beam is irradiated, based on at least one of the intensity, the material of the workpiece, and the relative scanning speed between the beam and the workpiece.
  2. The processing apparatus according to claim 1, wherein the surface of the workpiece is located between the focusing position and the beam irradiation system.
  3. The processing apparatus according to claim 2, wherein the removal process is performed by aligning the surface of the workpiece after the removal process with the light-gathering position using the control device.
  4. The processing apparatus according to any one of claims 1 to 3, wherein the control device controls the relative movement between the previously described mounting device and the beam irradiation position.
  5. The processing apparatus according to claim 4, wherein the control device controls the relative movement by the movement of the previously described mounting device.
  6. The processing apparatus according to claim 5, wherein the control device determines the light-gathering position based on the movement speed of the previously described mounting device.
  7. The processing apparatus according to any one of claims 1 to 6, wherein the control device determines the focusing position based on the properties of the beam.
  8. The processing apparatus according to claim 7, wherein the properties of the beam include at least one of the beam intensity and the beam scanning speed.
  9. The processing apparatus according to any one of claims 1 to 8, wherein the control device determines the focusing position based on the characteristics of the workpiece.
  10. The processing apparatus according to any one of claims 1 to 9, wherein the focusing position is changed by the optical system of the beam irradiation system.
  11. The processing apparatus according to any one of claims 1 to 10, wherein the mounting device comprises a mechanism for holding the workpiece.
  12. The processing apparatus according to any one of claims 1 to 11, wherein the light-receiving unit of the measuring device is provided in the aforementioned mounting device.
  13. A machining method comprising irradiating a workpiece placed on a mounting device with a beam and machining the workpiece while scanning the beam and the workpiece relative to each other , Receiving the beam irradiated onto the aforementioned workpiece, Based on at least one of the following: the intensity of the beam, the material of the workpiece, and the relative scanning speed between the beam and the workpiece , the focusing position of the beam irradiating the workpiece is set to a position offset from the surface of the workpiece in the direction of beam irradiation. A processing method comprising irradiating the surface of the workpiece with the beam so as to focus it at the set focusing position, thereby removing at least a portion of the workpiece.
  14. The processing method according to claim 13, wherein the setting includes setting the focusing position to be located inside the workpiece rather than on the surface of the workpiece before processing.

Description

This invention relates to a processing apparatus and a processing method, and more particularly to a processing apparatus and a processing method for processing a workpiece by irradiating it with a beam. In the field of machine tools, there is a strong desire for improved convenience and performance of processing devices that use laser light or the like (see, for example, Patent Document 1) as machine tools. U.S. Patent Application Publication No. 2002/0017509 According to a first aspect of the present invention, a processing apparatus for processing a workpiece by irradiating it with a beam is provided, comprising: a first holding system having a first holding member on which the workpiece is placed, and for moving the workpiece held by the first holding member; a beam irradiation system including a focusing optical system for emitting the beam; and a control device for controlling the first holding system and the irradiation system, wherein the control device controls the first holding system and the irradiation system so that predetermined processing is performed on a target portion of the workpiece while relatively moving the first holding member and the beam from the focusing optical system, and the processing apparatus is provided in which at least one of the beam intensity distribution on a first surface on the emission surface side of the focusing optical system and the beam intensity distribution on a second surface where the optical axis position of the focusing optical system is different from that of the first surface can be changed. Here, the first surface may be a virtual surface where the target area of the workpiece should be aligned during machining. This predetermined surface may, for example, be a surface perpendicular to the optical axis of the focusing optical system. This predetermined surface may also be the image plane or a nearby surface of the focusing optical system, or the rear focal plane or a nearby surface. According to a second aspect of the present invention, a processing apparatus for processing a workpiece by irradiating it with a beam is provided, comprising: a first holding system having a first holding member on which the workpiece is placed, and a beam irradiation system including a focusing optical system for emitting the beam; and a control device for controlling the first holding system and the irradiation system, wherein the control device controls the first holding system and the irradiation system so that predetermined processing is performed on a target portion of the workpiece while relatively moving the beam irradiated from the focusing optical system to a first surface and the first holding member, and the beam irradiation system has an optical device capable of changing the cross-sectional intensity distribution of the beam emitted from the focusing optical system at the pupil plane of the focusing optical system. According to a third aspect of the present invention, a processing apparatus for processing a workpiece by irradiating it with a beam is provided, comprising: a first holding system having a first holding member on which the workpiece is placed, and for moving the workpiece held by the first holding member; a beam irradiation system including a focusing optical system for emitting the beam; and a control device for controlling the first holding system and the irradiation system, wherein the control device controls the first holding system and the irradiation system so that predetermined processing is performed on a target portion of the workpiece while relatively moving the beam irradiated from the focusing optical system onto a first surface and the first holding member, and the intensity distribution in the cross-section of the beam emitted from the focusing optical system is rotationally symmetrical once. According to a fourth aspect of the present invention, a processing method for processing a workpiece by irradiating it with a beam is provided, comprising: holding the workpiece in a first holding member; and controlling the movement of the first holding member and the beam irradiation operation from the beam irradiation unit so that predetermined processing is performed on a target portion of the workpiece while relatively moving the beam emitted from a beam irradiation unit including a focusing optical system and the first holding member holding the workpiece, wherein during the processing, at least one of the beam intensity distribution on the first surface on the emission surface side of the focusing optical system and the beam intensity distribution on the second surface, where the optical axis position of the focusing optical system is different from that of the first surface, is changed. According to a fifth aspect of the present invention, a processing method for processing a workpiece by irradiating it with a beam is provided, comprising: holding the workpiece in a first holding member; and controlling the movement of the first holdin