JP-7855642-B2 - Manufacturing method for image acquisition modules

JP7855642B2JP 7855642 B2JP7855642 B2JP 7855642B2JP-7855642-B2

Inventors

廖志豪
曾 ▲テ▼旺

Assignees

海華科技股▲分▼有限公司

Dates

Publication Date: 20260508
Application Date: 20240614
Priority Date: 20240416

Claims (10)

A step of bringing a circuit board and a temporary carrier board close together so that the circuit board is placed on the temporary carrier board, wherein the circuit board has an upper surface, a lower surface and a through-hole connecting the upper surface and the lower surface, and the bottom end of the through-hole of the circuit board is sealed by the temporary carrier board, The steps include: installing the image sensing chip on the temporary carrier board so as to house it within the through-hole of the circuit board; A step of performing steps (1) and (2) in order or in reverse, wherein step (1) is to form an insulating connection structure within the through-hole of the circuit board to connect the image sensing chip and the circuit board, and step (2) is to electrically connect the image sensing chip to the circuit board through a plurality of metal wires. A method for manufacturing an image imaging module to reduce the overall thickness, comprising the step of installing a lens assembly on the circuit board, The lens assembly includes a lens carrier installed on the circuit board and a lens module supported by the lens carrier. The upper surface of the image sensing chip has an image sensing area corresponding to the lens module. The lower surface of the image sensing chip is exposed to the outside and is not covered by the insulating connection structure. The method for manufacturing the image acquisition module further includes mounting a filter element above the image sensing chip with the support of a plurality of supports or surrounding supports. A method for manufacturing an image acquisition module, characterized by the above.
The upper surface of the circuit board has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and each of the plurality of chip conductive pads of the image sensing chip is electrically connected to each of the plurality of substrate conductive pads of the circuit board via a plurality of metal wires. The insulating connection structure is tightly connected to the outer surface of the image sensing chip and the inner surface of the through-hole of the circuit board. The inner surface of the through-hole in the circuit board is arranged as a roughened surface, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. The entire or a portion of the outer surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the adhesive force or contact area between the insulating connection structure and the image sensing chip. The thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit board. The insulating connection structure has an exposed and unshielded lower enclosure, and the lower enclosure of the insulating connection structure, the lower surface of the circuit board, and the lower surface of the image sensing chip are configured to be aligned with each other. The lower enclosure surface of the insulating connection structure has gel detachment traces generated after separation from the temporary carrier substrate. The lower enclosure surface of the insulating connection structure has gel deformation traces generated after heating by the heat source generated by the heating module. The insulating connection structure has an extended connection portion that extends to the upper surface of the circuit board, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. A method for manufacturing an image acquisition module according to claim 1, further comprising the steps of: forming the insulating connection structure within the through-hole of the circuit board; electrically connecting the image sensing chip to the circuit board through a plurality of metal wires; or installing the lens assembly on the circuit board; heating the insulating connection structure using a heat source generated by the heating module, thereby removing the temporary carrier board from the circuit board.
The step of forming the insulating connection structure within the through-hole of the circuit board further includes: The steps include forming a bottom-edge surrounding insulating layer within the through-hole of the circuit board so as to connect the image sensing chip and the circuit board, The steps include forming a top-edge surrounding insulating layer within the through-hole of the circuit board so as to connect the image sensing chip and the circuit board, Includes, The bottom-edge insulating layer and the top-edge insulating layer are connected to each other , and both the bottom-edge insulating layer and the top-edge insulating layer are positioned within the through-hole of the circuit board and connected between the image sensing chip and the circuit board. The thickness of the bottom-surrounding insulating layer is thinner than the thickness of the top-surrounding insulating layer, the viscosity of the bottom-surrounding insulating layer is lower than the viscosity of the top-surrounding insulating layer, and the melting point of the bottom-surrounding insulating layer is lower than the melting point of the top-surrounding insulating layer. The adhesive force between the bottom edge insulating layer and the image sensing chip is weaker than the adhesive force between the top edge insulating layer and the image sensing chip, and the adhesive force between the bottom edge insulating layer and the circuit board is weaker than the adhesive force between the top edge insulating layer and the circuit board. The inner surface of the through-hole of the circuit board is arranged as a roughened surface so as to contact the top-edge surrounding insulating layer , thereby increasing the adhesive force or contact area between the top-edge surrounding insulating layer and the circuit board. The insulating connection structure has an exposed and unshielded lower enclosure, and the lower enclosure of the insulating connection structure, the lower surface of the circuit board, and the lower surface of the image sensing chip are configured to be aligned with each other . The lower surface of the bottom-edge insulating layer has traces of gel separation generated after separation from the temporary carrier substrate. The lower surface of the bottom-edge insulating layer has gel deformation traces that were formed after heating with a heat source generated by the heating module. The top-surrounding insulating layer of the insulating connection structure has an extended connecting portion that extends to the upper surface of the circuit board, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. A method for manufacturing an image imaging module according to claim 1, further comprising the steps of: forming the insulating connection structure in the through-hole of the circuit board; electrically connecting the image sensing chip to the circuit board via a plurality of metal wires; or arranging the lens assembly on the circuit board; heating the bottom edge surrounding insulating layer using a heat source generated by the heating module, thereby removing the temporary carrier substrate from the circuit board.
The insulating connection structure has an exposed and unshielded lower enclosure, and there is a predetermined vertical height between the lower enclosure of the insulating connection structure and the lower surface of the circuit board, thereby forming an enclosed space between the circuit board, the image sensing chip and the insulating connection structure. The insulating connection structure is tightly connected between the outer surface of the image sensing chip and the inner surface of the through-hole of the circuit board, and the lower surface of the insulating connection structure, a portion of the inner surface of the through-hole of the circuit board, and a portion of the outer surface of the image sensing chip are exposed from the bottom edge of the through-hole of the circuit board. The method for manufacturing an image acquisition module according to claim 1, wherein the insulating connection structure has an extended connection portion that extends to the upper surface of the circuit board, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board.
A method for manufacturing an image acquisition module according to claim 1, further comprising the steps of: forming the insulating connection structure within the through-hole of the circuit board; electrically connecting the image sensing chip to the circuit board via a plurality of metal wires; arranging the lens assembly on the circuit board; and removing the temporary carrier board from the circuit board.
A step of bringing a circuit board and a temporary carrier board close together so that the circuit board is placed on the temporary carrier board, wherein the circuit board has an upper surface, a lower surface, and a through-hole connecting the upper surface and the lower surface, and the bottom end of the through-hole of the circuit board is sealed by the temporary carrier board. The steps include: placing the image sensing chip in the through-hole of the circuit board and installing it on the temporary carrier board; A step of performing steps (1) and (2) in order or in reverse order, wherein step (1) is to form an insulating connection structure within the through-hole of the circuit board and connect it between the image sensing chip and the circuit board, and step (2) is to electrically connect the image sensing chip to the circuit board through a plurality of metal wires, A method for manufacturing an image imaging module to reduce the overall thickness, comprising the steps of: installing a lens assembly on a circuit board, wherein the lens assembly includes a lens carrier on which the lens assembly is installed on the circuit board, and a lens module mounted on the lens carrier, The upper surface of the image sensing chip has an image sensing area corresponding to the lens module. A method for manufacturing an image acquisition module, characterized in that the lower surface of the image sensing chip is exposed and not covered by the insulating connection structure.
The upper surface of the circuit board has a plurality of substrate conductive pads, the upper surface of the image sensing chip has a plurality of chip conductive pads, and each of the plurality of chip conductive pads of the image sensing chip is electrically connected to each of the plurality of substrate conductive pads of the circuit board via a plurality of metal wires. The insulating connection structure is tightly connected between the outer surface of the image sensing chip and the inner surface of the through-hole of the circuit board. The inner surface of the through-hole of the circuit board is configured as a roughened surface, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. The entire or a portion of the outer surface of the image sensing chip is covered by the insulating connection structure, thereby adjusting the adhesive force or contact area between the insulating connection structure and the image sensing chip. The thickness of the insulating connection structure is less than or equal to the thickness of the image sensing chip and less than or equal to the thickness of the circuit board. The insulating connection structure has an exposed and unshielded lower enclosure, and the lower enclosure of the insulating connection structure, the lower surface of the circuit board, and the lower surface of the image sensing chip coincide with each other. The lower enclosure surface of the insulating connection structure has traces of gel detachment that occurred after separation from the temporary carrier substrate. The lower enclosure of the insulating connection structure has gel deformation traces that occur after being heated by a heat source generated by the heating module. The insulating connection structure has an extended connection portion that extends to the upper surface of the circuit board, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. A method for manufacturing an image acquisition module according to claim 6, further comprising the steps of: forming the insulating connection structure within the through-hole of the circuit board; electrically connecting the image sensing chip to the circuit board through a plurality of metal wires; or installing the lens assembly on the circuit board; and then heating the insulating connection structure using a heat source generated by the heating module, thereby removing the temporary carrier board from the circuit board.
The step of forming the insulating connection structure within the through-hole of the circuit board further includes the step of forming a bottom-edge surrounding insulating layer within the through-hole of the circuit board to connect between the image sensing chip and the circuit board, The steps include forming a top-edge surrounding insulating layer within the through-hole of the circuit board so as to connect the image sensing chip and the circuit board, Includes, The bottom edge insulating layer and the top edge insulating layer are connected to each other , and the bottom edge insulating layer and the top edge insulating layer are installed within the through-hole of the circuit board and connected between the image sensing chip and the circuit board. The thickness of the bottom-surrounding insulating layer is smaller than the thickness of the top-surrounding insulating layer, the viscosity of the bottom-surrounding insulating layer is smaller than the viscosity of the top-surrounding insulating layer, and the melting point of the bottom-surrounding insulating layer is lower than the melting point of the top-surrounding insulating layer. The adhesive force between the bottom edge surrounding insulating layer and the image sensing chip is smaller than the adhesive force between the top edge surrounding insulating layer and the image sensing chip, and the adhesive force between the bottom edge surrounding insulating layer and the circuit board is smaller than the adhesive force between the top edge surrounding insulating layer and the circuit board. The inner surface of the through-hole of the circuit board is configured as a roughened surface so as to contact the top-edge surrounding insulating layer , thereby increasing the adhesive force or contact area between the top-edge surrounding insulating layer and the circuit board. The insulating connection structure has an exposed and unshielded lower enclosure, and the lower enclosure of the insulating connection structure, the lower surface of the circuit board, and the lower surface of the image sensing chip are configured to be aligned with each other. The lower surface of the bottom-edge insulating layer has traces of gel separation that occurred after separation from the temporary carrier substrate. The lower surface of the bottom-edge insulating layer has gel deformation traces caused by heating by the heat source generated by the heating module. The top-surrounding insulating layer of the insulating connection structure has an extended connecting portion that extends to the upper surface of the circuit board, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board. A method for manufacturing an image imaging module according to claim 6, further comprising the steps of: forming the insulating connection structure in the through-hole of the circuit board; electrically connecting the image sensing chip to the circuit board via a plurality of metal wires; or arranging the lens assembly on the circuit board; heating the bottom edge surrounding insulating layer using a heat source generated by the heating module, thereby removing the temporary carrier substrate from the circuit board.
The insulating connection structure has an exposed and unshielded lower enclosure, and there is a predetermined vertical height between the lower enclosure of the insulating connection structure and the lower surface of the circuit board, thereby forming a surrounding empty space between the circuit board, the image sensing chip, and the insulating connection structure. The insulating connection structure is tightly connected between the outer surface of the image sensing chip and the inner surface of the through-hole of the circuit board, and the lower surface of the insulating connection structure, a portion of the inner surface of the through-hole of the circuit board, and a portion of the outer surface of the image sensing chip are exposed from the bottom edge of the through-hole of the circuit board. The method for manufacturing an image acquisition module according to claim 6, wherein the insulating connection structure has an extended connection portion that extends to the upper surface of the circuit board, thereby increasing the adhesive force or contact area between the insulating connection structure and the circuit board.
A method for manufacturing an image acquisition module according to claim 6, further comprising the steps of: forming the insulating connection structure within the through-hole of the circuit board; electrically connecting the image sensing chip to the circuit board via a plurality of metal wires; arranging the lens assembly on the circuit board; and removing the temporary carrier board from the circuit board.

Description

This invention relates to an image acquisition module, and more particularly to a method for manufacturing an image acquisition module to reduce its overall thickness. In existing technologies, the image sensing chip of an image acquisition module is sometimes mounted on the top edge of a circuit board without an opening using wire bonding. Alternatively, the image sensing chip may be mounted on the bottom edge of a circuit board with an opening using flip-chip bonding. However, there is still room for improvement in existing image acquisition modules. This is a flowchart of a manufacturing method for an image acquisition module provided by the present invention, which reduces the overall thickness.This is a schematic diagram of step S100 of a method for manufacturing an image acquisition module to reduce the overall thickness, provided by a first embodiment of the present invention.This is a schematic diagram of steps S102 and S104 relating to a method for manufacturing an image acquisition module to reduce the overall thickness, as provided by a first embodiment of the present invention.This is a schematic diagram of step S106 of a method for manufacturing an image acquisition module to reduce the overall thickness, provided by a first embodiment of the present invention.This is a schematic diagram of step S108 in a method for manufacturing an image acquisition module to reduce the overall thickness, provided by a first embodiment of the present invention.This is a schematic diagram of an image acquisition module for reducing overall thickness, provided by a first embodiment of the present invention.This is a schematic diagram of one executable embodiment of a method for manufacturing an image acquisition module to reduce overall thickness, provided by a first embodiment of the present invention (the step of electrically connecting an image sensing chip to a circuit board and then removing the temporary carrier board from the circuit board).This is a schematic diagram of another executable embodiment of a manufacturing method for an image acquisition module to reduce overall thickness, provided by the first embodiment of the present invention (the step of removing the temporary carrier substrate from the circuit board after the lens assembly has been placed on the circuit board).This is a schematic diagram of an executable embodiment of a method for manufacturing an image acquisition module to reduce the overall thickness, provided by a second embodiment of the present invention.This is a schematic diagram of an image acquisition module for reducing overall thickness, provided by a second embodiment of the present invention.This is a schematic diagram of an image acquisition module for reducing overall thickness, provided by a third embodiment of the present invention.This is a schematic diagram of steps S200 and S202 relating to a method for manufacturing an image acquisition module for reducing the overall thickness, as provided by a fourth embodiment of the present invention.This is a schematic diagram of step S204 of a method for manufacturing an image acquisition module to reduce the overall thickness, provided by a fourth embodiment of the present invention.This is a schematic diagram of step S206 in a method for manufacturing an image acquisition module to reduce the overall thickness, provided by a fourth embodiment of the present invention.This is a functional block diagram of a portable electronic device using an image acquisition module, provided by a fifth embodiment of the present invention. The following describes embodiments of the "Method for Manufacturing an Image Acquisition Module" disclosed in this invention, using specific examples. Those skilled in the art will understand the merits and effects of this invention from the published content. This invention can be implemented or applied in other different embodiments. Each section in this specification can also be modified and altered in equal measure, based on various viewpoints or applications, without departing from the spirit of the invention. Furthermore, the drawings of this invention are for simple and schematic purposes only and do not represent actual dimensions. The following embodiments further describe technical matters related to the invention, but the published content does not limit the invention. Also, the term "or" used in this specification may include any one or more combinations of the relevant items, depending on the actual situation. [First Embodiment] As shown in Figures 1 to 6, a first embodiment of the present invention provides a method for manufacturing an image acquisition module that reduces the overall thickness. The method includes a number of steps as described below. First, in step 100, as shown in Figures 1 and 2, the circuit board 1 and the temporary carrier board C (also called a movable board, separable board, or removable board) are brought closer together to position the circuit board 1 on the temp