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JP-7855660-B2 - Reconfigurable mainframe with interchangeable interface plates

JP7855660B2JP 7855660 B2JP7855660 B2JP 7855660B2JP-7855660-B2

Inventors

  • ライス， マイケル アール．

Assignees

  • アプライド マテリアルズ インコーポレイテッド

Dates

Publication Date
20260508
Application Date
20241024
Priority Date
20200306

Claims (8)

  1. The mainframe of a device manufacturing system, Bass and, A plurality of facets on the base, wherein the first facet of the plurality of facets includes a first frame comprising a first column on the first side of the first facet, a second column on the second side of the first facet, and a beam connecting the first column and the second column, A lid on the plurality of facets, wherein the base, the lid, and the plurality of facets together define an internal space, A first replaceable interface plate sealed to the first frame of the first facet , A first channel provided in the first column of the first facet, the first channel fluidly connecting a first vacuum region associated with the first replaceable interface plate to a vacuum port, A first O-ring disposed on the outer surface of the first frame, wherein the inner surface of the first O-ring is exposed to the first vacuum region, A second O-ring disposed on the outer surface of the first frame, wherein the second O-ring is substantially concentric with the first O-ring and the outer surface of the second O-ring is exposed to the first vacuum region . Mainframe.
  2. The mainframe according to claim 1, further comprising a second channel that fluidly connects a second vacuum region to the first channel.
  3. The mainframe according to claim 2, wherein the second column includes a third channel that fluidly connects a third vacuum region associated with a second interchangeable interface plate to the second channel in the beam.
  4. The second facet of the plurality of facets includes a second frame comprising the second column on the first side of the second facet, a third column on the second side of the second facet, and a second beam connecting the second column to the third column. The main frame according to claim 3, further comprising a second replaceable interface plate sealed to the second frame of the second facet.
  5. The outer surface of the first O-ring is exposed to the external environment , and the inner surface of the second O-ring is exposed to the internal space . The mainframe according to claim 1, wherein the external environment has a first pressure, the first vacuum region maintains a second pressure lower than the first pressure, and the internal space maintains a third pressure lower than the second pressure.
  6. The mainframe according to claim 1, wherein the first replaceable interface plate includes at least one of a first substrate access port configured to provide a robot arm in the internal space with access to a first processing chamber, or a second substrate access port configured to provide the robot arm with access to a second processing chamber.
  7. The main frame according to claim 1, wherein the main frame is configured to operate under vacuum, the first frame of the first facet is not load-bearing, the first replaceable interface plate is load-bearing, and the first replaceable interface plate withstands a vertical force on the main frame caused by a pressure difference between the internal space of the main frame and the outside of the main frame.
  8. The mainframe of a device manufacturing system, Bass and, A plurality of facets on the base, wherein the first facet among the plurality of facets includes a plurality of facets including a first frame, A lid on the plurality of facets, wherein the base, the lid, and the plurality of facets define an internal space, A replaceable interface plate, attached to the first frame of the first facet, comprising a replaceable interface plate including one or more substrate access ports configured to provide a robot arm with access to one or more processing chambers, The main frame is configured to operate under vacuum, and the replaceable interface plate is load-bearing and can withstand the vertical forces on the main frame caused by the pressure difference between the internal space of the main frame and the outside of the main frame. The lid engages with the upper surface of the replaceable interface plate, such that there is a gap between the lid and the upper surface of the first frame of the first facet, so that the lid does not come into contact with the first frame of the first facet .

Description

[0001] Embodiments of this disclosure generally relate to electronic device manufacturing systems, and more specifically to a reconfigurable mainframe of an electronic device manufacturing system including interchangeable interface plates. Embodiments also relate to interchangeable interface plates for the mainframe. [0002] Conventional electronic device manufacturing systems (also referred to as device manufacturing systems) may include a mainframe with a plurality of processing chambers and load lock chambers arranged around it. The mainframe may have several side walls (generally referred to as "facets") to which the processing chambers and/or load lock chambers are connected. The facets of a conventional mainframe are machined to have a predetermined configuration having substrate access ports of a predetermined size, position, etc. Once a conventional mainframe is manufactured, the type, size, arrangement, and position of the substrate access ports are fixed to that mainframe. If the owner of the mainframe desires a new configuration, a new mainframe with the new configuration is purchased. [0003] According to a first aspect of the present disclosure, the main frame of a device manufacturing system includes a base, a plurality of facets on the base, and a lid on the plurality of facets. The first facet of the plurality of facets includes a first frame. The base, the lid, and the plurality of facets together define an internal space including a robotic arm. A first replaceable interface plate is mounted on the first frame of the first facet. The first replaceable interface plate includes a plurality of substrate access ports. The first substrate access port of the plurality of substrate access ports is configured to allow the robotic arm to access a first processing chamber. The second substrate access port of the plurality of substrate access ports is configured to allow the robotic arm to access a second processing chamber. In one embodiment, the first replaceable interface plate is load-bearing, and the frame is not load-bearing. [0004] According to a second aspect of the present disclosure, the replaceable interface plate is configured to be mounted on a facet of the main frame. The replaceable interface plate includes a plurality of board access ports. A first board access port among the plurality of board access ports is configured to provide access from the main frame to a first processing chamber. A second board access port among the plurality of board access ports is configured to provide access from the main frame to a second processing chamber. The replaceable interface plate is load-bearing against the main frame. Therefore, the replaceable interface plate is configured to withstand vertical forces on the main frame caused by the pressure difference between the internal space of the main frame and the outside of the main frame. [0005] According to a third aspect of the present disclosure, a method for configuring a mainframe includes determining a first set of processing chambers connected to a first facet of the mainframe, determining the locations of a set of substrate access ports on the facet housing the first set of processing chambers, determining the configuration of a first interchangeable interface plate having one of the substrate access ports at each location, and manufacturing the first interchangeable interface plate. This method further includes mounting the first interchangeable interface plate to the first facet of the mainframe and mounting the processing chambers to the first interchangeable interface plate, wherein each of the processing chambers is accessible from the mainframe via the substrate access ports of the set of substrate access ports. This method may be performed after the mainframe has been manufactured (for example, to change the configuration of the mainframe). [0006] Although similar elements are shown with similar reference numerals in the accompanying drawings, these are examples only and not limiting. It should be noted that various references to “an” or “one” embodiments in this disclosure do not necessarily refer to the same embodiment, but rather mean at least one. A schematic top view of an electronic device manufacturing system having a reconfigurable mainframe having a first configuration, according to one embodiment of the present disclosure, is shown.A schematic top view of an electronic device manufacturing system having a reconfigurable mainframe having a second configuration, according to one embodiment of the present disclosure, is shown.A schematic top view of an electronic device manufacturing system having a reconfigurable mainframe with a third configuration, according to one embodiment of the present disclosure, is shown.This is a perspective view showing a reconfigurable mainframe according to one embodiment of the present disclosure.This is a side view of a first exemplary interchangeable interface plate according to one embodiment of