JP-7855730-B2 - Plasma processing apparatus, positional displacement detection apparatus, and positional displacement correction method

Inventors

• 高崎 晃一
• 横川 賢悦
• 及川 裕
• 朝倉 涼次

Assignees

• 株式会社日立ハイテク

Dates

Publication Date

20260508

Application Date

20240111

Claims (17)

1. A sample stand having a mounting section on which the sample is placed, The system includes a positional displacement detection device for detecting the amount of positional displacement of the sample relative to the mounting section, A plasma processing apparatus characterized in that the positional displacement amount detection device performs difference processing between a first image including the outer periphery of the sample and a second image including the outer periphery of the aforementioned placement area, and detects the amount of positional displacement of the sample relative to the aforementioned placement area based on the difference-processed image.
2. A sample stand having a mounting section on which the sample is placed, The device includes a positional displacement detection device that detects the amount of positional displacement of the sample relative to the aforementioned placement area based on a first image including the outer periphery of the sample and a second image including the outer periphery of the aforementioned placement area. A plasma processing apparatus characterized in that, by the positional displacement detection device, a correction amount for correcting the position of the sample or the imaging device that images the above-mentioned mounting area is calculated using the second image, and after the position of the imaging device is corrected by the calculated correction amount, the positional displacement amount of the sample with respect to the above-mentioned mounting area is detected.
3. A sample stand having a mounting section on which the sample is placed, A positional displacement detection device for detecting the amount of positional displacement of the sample relative to the mounting section, An imaging device for imaging the sample or the aforementioned mounting area, The system comprises a transparent structure positioned between the mounting section and the imaging device, A plasma processing apparatus characterized in that the positional displacement amount detection device calculates the influence of the structure on a first image including the outer periphery of the sample or a second image including the outer periphery of the aforementioned placement area, and after the calculated influence of the structure is corrected, the positional displacement amount of the sample with respect to the aforementioned placement area is detected.
4. In the plasma processing apparatus according to any one of claims 1 to 3 , The plasma processing apparatus is characterized in that the first image is an image including the outer periphery of the sample positioned above the aforementioned mounting section.
5. In the plasma processing apparatus according to any one of claims 1 to 3 , The system further includes a transport mechanism for transporting the aforementioned sample, The plasma processing apparatus is characterized in that the sample is held above the aforementioned storage unit by the transport mechanism.
6. In the plasma processing apparatus according to any one of claims 1 to 3 , The plasma processing apparatus is characterized in that the sample is placed on the aforementioned mounting section.
7. In the plasma processing apparatus according to any one of claims 1 to 3 , The first image is an image that includes the entire sample. The plasma processing apparatus is characterized in that the second image is an image including the entire mounting portion described above.
8. In the plasma processing apparatus according to claim 7 , A plasma processing apparatus characterized in that the positional displacement amount of the sample relative to the aforementioned mounting part is detected by the positional displacement amount detection device based on the centroid position of the sample calculated using the first image and the centroid position of the aforementioned mounting part calculated using the second image.
9. In the plasma processing apparatus according to any one of claims 1 to 3 , A plasma processing apparatus further comprising a plurality of imaging devices arranged above the mounting section for imaging the sample or the mounting section.
10. In a plasma processing apparatus equipped with a sample stage having a mounting section on which a sample is placed, a positional displacement detection device for detecting the amount of positional displacement of the sample relative to the mounting section described above, A positional displacement detection device characterized in that a difference processing is performed between a first image including the outer periphery of the sample and a second image including the outer periphery of the aforementioned placement area, and the amount of positional displacement of the sample relative to the aforementioned placement area is detected based on the difference processed image .
11. In a plasma processing apparatus equipped with a sample stage having a mounting section on which a sample is placed, a positional displacement detection device detects the amount of positional displacement of the sample relative to the mounting section based on a first image including the outer periphery of the sample and a second image including the outer periphery of the mounting section, A positional displacement detection device characterized in that a correction amount for correcting the position of the imaging device that images the sample or the aforementioned mounting area is calculated using the second image, and after the calculated correction amount is applied to the position of the imaging device, the amount of positional displacement of the sample with respect to the aforementioned mounting area is detected.
12. In a plasma processing apparatus comprising a sample stage having a mounting section on which a sample is placed, an imaging device for imaging the sample or the mounting section, and a transparent structure disposed between the mounting section and the imaging device, a positional displacement detection device for detecting the amount of positional displacement of the sample relative to the mounting section , A positional displacement detection device characterized in that the influence of the structure on a first image including the outer periphery of the sample or a second image including the outer periphery of the aforementioned placement area is calculated, and after the calculated influence of the structure is corrected, the amount of positional displacement of the sample relative to the aforementioned placement area is detected.
13. In the positional displacement detection device according to any one of claims 10 to 12 , The positional displacement detection device is characterized in that the first image is an image that includes the outer periphery of the sample placed above the aforementioned mounting part.
14. In a plasma processing apparatus equipped with a sample stage having a mounting section on which a sample is placed, a method for correcting positional displacement of the sample relative to the mounting section and correcting the detected positional displacement of the sample relative to the mounting section, The process involves performing a difference operation between a first image including the outer periphery of the sample and a second image including the outer periphery of the aforementioned mounting area, and detecting the amount of positional displacement of the sample relative to the aforementioned mounting area based on the difference-processed image . A method for correcting misalignment, characterized by comprising the step of correcting the amount of misalignment of the sample relative to the detected mounting portion.
15. In a plasma processing apparatus equipped with a sample stage having a mounting section on which a sample is placed, a positional displacement correction method is provided for detecting the amount of positional displacement of the sample relative to the mounting section based on a first image including the outer periphery of the sample and a second image including the outer periphery of the mounting section, and correcting the detected amount of positional displacement of the sample relative to the mounting section, A step of calculating a correction amount for correcting the position of the imaging device that images the sample or the aforementioned mounting area using the second image, and after correcting the position of the imaging device by the calculated correction amount, detecting the amount of positional displacement of the sample relative to the aforementioned mounting area, A method for correcting misalignment, characterized by comprising the step of correcting the amount of misalignment of the sample relative to the detected mounting portion.
16. A plasma processing apparatus comprising a sample stage having a mounting section on which a sample is placed, an imaging device for imaging the sample or the mounting section, and a transparent structure disposed between the mounting section and the imaging device, wherein a positional displacement correction method is used to detect the amount of positional displacement of the sample relative to the mounting section and to correct the detected amount of positional displacement of the sample relative to the mounting section, A step of calculating the influence of the structure on a first image including the outer periphery of the sample or a second image including the outer periphery of the aforementioned mounting area, correcting the calculated influence of the structure, and then detecting the amount of positional displacement of the sample relative to the aforementioned mounting area. A method for correcting misalignment, characterized by comprising the step of correcting the amount of misalignment of the sample relative to the detected mounting portion.
17. In the positional displacement correction method described in claim 16 , A method for correcting positional misalignment, further comprising the steps of calculating a correction amount for correcting the position of the imaging device using the second image, and performing a difference processing between the first image reflecting the calculated correction amount and the second image reflecting the calculated correction amount.

Description

This disclosure relates to a plasma processing apparatus, a positional displacement detection apparatus, and a positional displacement correction method. In recent years, the market has increasingly demanded lower power consumption and higher speeds for semiconductor devices, leading to a noticeable trend towards more complex and highly integrated device structures. Consequently, the precision required for wafer placement during processing, from the perspective of yield and reproducibility, is also increasing year by year. On the other hand, imaging equipment that captures images is improving year by year, and examples of using imaging equipment for positioning transported objects have also been proposed. For example, Patent Document 1 proposes a positional displacement detection device that calculates the amount of positional displacement of an object being transported relative to a transport mechanism based on an image captured by an image sensor. Japanese Patent Publication No. 2022-77966 Figure 1 shows an example of a detection method for detecting wafer misalignment relative to the wafer mounting section, which is a first embodiment.Figure 2 shows an example of a detection method for detecting wafer misalignment relative to the wafer mounting section, which is the first embodiment.Figure 3 shows an example of a detection method for detecting wafer misalignment relative to the wafer mounting section, which is the first embodiment.Figure 4 shows an example of a detection method for detecting positional displacement of a wafer on a transport mechanism relative to the wafer placement section, which is a second embodiment.Figure 5 shows an example of a detection method for detecting positional displacement of a wafer on a transport mechanism relative to the wafer placement section, which is a second embodiment.Figure 6 shows an example of a detection method for detecting positional displacement of a wafer on a wafer mounting section, which is a third embodiment.Figure 7 shows an example of a detection method for detecting misalignment of a wafer on a wafer mounting section relative to the wafer mounting section, which is a third embodiment.Figure 8 shows an example of a detection method, which is a fourth embodiment, for detecting the positional displacement of a wafer relative to the wafer mounting section using image difference processing.Figure 9 shows an example of a detection method, which is a fifth embodiment, for detecting the positional displacement of a wafer relative to the wafer mounting section using image centroid position calculation processing.Figure 10 shows an example of a detection method, which is the sixth embodiment, for detecting wafer misalignment relative to the wafer mounting section by correcting the position of the imaging device.Figure 11 shows an example of a detection method for detecting wafer misalignment relative to the wafer mounting section, which is the seventh embodiment, using multiple imaging devices.Figure 12 shows an example of a detection method for detecting wafer misalignment relative to the wafer mounting section, which is the eighth embodiment, by correcting for the influence of a structure that is transparent to visible light.Figure 13 shows an example of a detection method for detecting wafer misalignment relative to the wafer mounting section, which is the eighth embodiment, by correcting for the influence of a structure that is transparent to visible light.Figure 14 shows an example of a correction method for correcting the positional misalignment of a wafer relative to the wafer mounting section, which is the ninth embodiment.Figure 15 shows an example of a correction method for correcting the positional misalignment of a wafer relative to the wafer mounting section, which is the tenth embodiment. The embodiments will be described below with reference to the drawings. However, in the following description, the same reference numerals will be used for the same components, and repeated explanations may be omitted. In addition, the drawings may be more schematic than the actual embodiments in order to make the explanation clearer, but they are merely examples and do not limit the interpretation of the present invention. [First Embodiment] Figures 1, 2, and 3 show an example of a detection method for detecting wafer misalignment relative to a wafer mounting section, which is a first embodiment of the present disclosure. An example of a plasma processing apparatus using this detection method is shown in Figure 1(a). The plasma processing apparatus 100 of this embodiment comprises a plasma processing chamber 101 and a wafer mounting section 102. The wafer mounting section 102 is a mounting section on which a wafer, which is a sample, is placed, and this mounting section 102 is provided on a sample stage. An exhaust device 109 for vacuum evacuation is connected to the plasma processing chamber 101. The sample stage having the wafer mounting section 102 is made of