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JP-7855733-B2 - Semiconductor equipment, power converters

JP7855733B2JP 7855733 B2JP7855733 B2JP 7855733B2JP-7855733-B2

Inventors

  • 高木 佑輔
  • 金子 裕二朗

Assignees

  • Ａｓｔｅｍｏ株式会社

Dates

Publication Date
20260508
Application Date
20230127

Claims (8)

  1. A semiconductor device having at least one semiconductor module on which semiconductor elements are mounted, The semiconductor module is provided with a first cooling member and a second cooling member, each positioned on both sides of the module and having a coolant circulating inside them. A connecting member that connects the first cooling member with the second cooling member, a first opening for inflowing and outflowing the refrigerant into the first cooling member, and a second opening for inflowing and outflowing the refrigerant into the second cooling member, The system comprises a sealing member positioned between the first cooling member and the second cooling member, and the sealing member positioned on the outer circumference of the connecting member, The connecting member has a connecting member end that extends into the interior of the second cooling member, The end of the connecting member includes a fixing portion formed by bending the end of the connecting member along the inner wall surface of the second cooling member.
  2. The semiconductor device according to claim 1, wherein the diameter of the third opening formed in the second cooling member at a position opposite to the fixed portion and for inflowing and outflowing the refrigerant is larger than the inner diameter of the tip of the fixed portion.
  3. The semiconductor device according to claim 1, wherein the second cooling member comprises an inclined portion that is inclined toward the first cooling member and a flat portion that extends from the inclined portion to the outer circumferential surface of the connecting member and makes contact with it.
  4. The semiconductor device according to claim 1, wherein the first cooling member and the second cooling member each include a base member joined to a heat dissipation fin, a frame member forming a space for housing the heat dissipation fin, and a flat plate member positioned opposite the base member with the frame member in between, and joined to the frame member, thereby forming a flow path inside the first cooling member and the second cooling member.
  5. The semiconductor device according to claim 4, wherein the flat plate member has a fourth opening for inflowing and discharging the refrigerant at a position opposite to the connecting member.
  6. The semiconductor device according to claim 5, wherein the diameter of the fourth opening is greater than the inner diameter of the tip of the fixed portion.
  7. The semiconductor device according to claim 1, wherein an adhesive member is disposed between the semiconductor module and the first cooling member, and between the semiconductor module and the second cooling member.
  8. A power conversion device comprising a semiconductor device according to any one of claims 1 to 6.

Description

This invention relates to a semiconductor device and a power conversion device. In power conversion devices that cool a power module by providing water channels above and below it, the seal portion at the connection point between the power module and the upper and lower water channels is subjected to a force that pulls the power module and the water channel apart due to the water pressure of the refrigerant flowing through the water channel. Therefore, it is common practice to ensure the reliability of the seal portion by fixing the water channel with a leaf spring, a leaf spring retaining member, and fastening members. For example, Patent Document 1 below discloses a cooling device configuration that can be manufactured at low cost by stacking fin-forming components to form a flow path. Japanese Patent Publication No. 2022-029977 Electrical circuit diagram of a power converter connected to a rotating electric machine.Electrical circuit diagram of a single-phase semiconductor moduleOverall perspective view of a semiconductor device according to the first embodiment of the present inventionFigure 3: Overall exploded view of the semiconductor device.Cross-sectional view of the connection between cooling members of a semiconductor device according to the first embodiment of the present invention (cross-sectional view along line A-A in Figure 3)Diagram illustrating the method for forming the first fixing part according to the first embodiment of the present invention.Cross-sectional view of the connection portion between cooling members of a semiconductor device according to a second embodiment of the present invention.Cross-sectional view of the connection portion between cooling members of a semiconductor device according to a third embodiment of the present invention.Cross-sectional view of the connection portion between cooling members of a semiconductor device according to the fourth embodiment of the present invention.Overall perspective view of a semiconductor device according to a fifth embodiment of the present inventionFigure 10 is a cross-sectional view of the connection between cooling members of a semiconductor device. Embodiments of the present invention will be described below with reference to the drawings. The following description and drawings are illustrative for illustrating the present invention, and have been omitted and simplified as appropriate for clarity of explanation. The present invention can also be carried out in various other forms. Unless otherwise specified, each component may be singular or plural. The positions, sizes, shapes, and ranges of the components shown in the drawings may not represent the actual positions, sizes, shapes, and ranges, in order to facilitate understanding of the invention. Therefore, the present invention is not necessarily limited to the positions, sizes, shapes, and ranges disclosed in the drawings. (First embodiment and overall configuration of the present invention) (Figure 1) The power converter 1 is a device that converts DC power input from a DC power source 2 (a battery) into AC power and outputs it to a motor 6. The power converter 1 includes a capacitor 3, a control device 4, an upper arm 300U, and a lower arm 300L. The capacitor 3 smooths the DC power output from the DC power source 2 to the switching element of the power converter 1. The control device 4 controls the switching operation of the upper arm 300U and lower arm 300L, which are switching elements, related to power conversion. (Figure 2) The semiconductor module 300, which has the function of a power module, is equipped with power semiconductor elements 321U, 321L, 322U, and 322L. Power semiconductor elements 321U and 321L are IGBTs (Insulated Gate Bipolar Transistors). Power semiconductor elements 322U and 322L are diodes. Note that power semiconductor elements 321U, 321L, 322U, and 322L can be replaced with FETs (Field Effect Transistors) or the like. The semiconductor module 300 consists of the upper arm 300U and the lower arm 300L described above. The upper arm 300U consists of a power semiconductor element 321U and a diode 322U. The lower arm 300L consists of a power semiconductor element 321L and a diode 322L. The upper arm 300U has a DC positive terminal 311 and a signal terminal 314. The lower arm 300L has a DC negative terminal 312 and a signal terminal 315. The DC positive terminal 311 and the DC negative terminal 312 are connected to the aforementioned capacitor 3 and other components, and supply power to the power semiconductor elements 321U, 321L, 322U, and 322L from outside the semiconductor module 300. The signal terminals 314 and 315 are connected to the control board equipped with the aforementioned control device 4, thereby controlling the switching operation of the power semiconductor elements 321U and 321L by the control device 4. The semiconductor module 300 is equipped with an AC terminal 313. The AC terminal 313 electrically connects the upper arm 300U and th