JP-7855746-B1 - Inductance element and method for manufacturing the same

JP7855746B1JP 7855746 B1JP7855746 B1JP 7855746B1JP-7855746-B1

Abstract

[Problem] To provide an inductance element and a method for manufacturing the same. [Solution] An inductance element comprising a magnetic package structure including a surface and two grooves provided on the surface, a coil body embedded in the magnetic package structure, a bent portion connected sequentially from the coil body, a pin portion, and a fixing portion, two extending line segments connected to both ends of the coil body, and two sealing materials provided inside the grooves and covering the fixing portion, wherein the bent portion extends from the coil body toward the surface of the magnetic package structure and penetrates the surface to be exposed to the outside of the magnetic package structure, the pin portion is provided on the surface of the magnetic package structure and extends from the bent portion toward the grooves, and the fixing portion extends from the pin portion toward the inside of the grooves and along the side walls of the grooves to the bottom surface of the grooves. [Selection Diagram] Figure 1

Inventors

曹守義
胡 ▲豐▼
肖林梅
鐘行

Assignees

奇力新電子股▲フン▼有限公司

Dates

Publication Date: 20260508
Application Date: 20250217
Priority Date: 20241211

Claims (13)

A magnetic package structure including a surface and two grooves provided on the surface, The coil body embedded in the aforementioned magnetic package structure, Each includes a bent portion connected to the coil body, extending from the coil body toward the surface of the magnetic package structure, and penetrating the surface to be exposed to the outside of the magnetic package structure; a pin portion connected to the bent portion and provided on the surface of the magnetic package structure, extending from the bent portion toward one of the grooves, and connected to the coil body via the bent portion; and a fixing portion connected to the pin portion and extending from the pin portion toward the interior of the groove, extending along the side wall of the groove adjacent to the surface to the bottom surface of the groove recessed in the surface, and each includes two extending line segments connected to both ends of the coil body, Two sealing materials are provided inside the grooves and cover the fixing portion, An inductance element equipped with the following features.
The inductance element according to claim 1, wherein the coil body is a flat wire coil.
The inductance element according to claim 1, wherein the end face of the sealing material is flush with the surface of the magnetic package structure.
The aforementioned magnetic package structure is The magnetic package structure further comprises two support portions provided on the surface thereof, each of which has a plane protruding from the surface thereof. Furthermore, the pin portion of the extending line segment covers the plane of the support portion, as described in claim 1.
The aforementioned pin portion is A first region connected to the support portion of the magnetic package structure, Two second regions are connected to the bending portion and the fixing portion, respectively, and are suspended in mid-air above the surface of the magnetic package structure, The inductance element according to claim 4, including the following:
The inductance element according to claim 4, further comprising two adhesive materials, each provided on the plane of the support portion and positioned between the support portion of the magnetic package structure and the pin portion of the extending line segment.
The inductance element according to claim 1, further comprising a protective layer that covers the outer surface of the magnetic package structure and exposes a part of the magnetic package structure and a part of the extending line segment.
The inductance element according to claim 1, wherein the magnetic package structure includes a magnetic material selected from iron, iron-nickel alloys, iron-cobalt alloys, iron-silicon alloys, iron-vanadium alloys, iron-silicon-chromium alloys, iron-silicon-aluminum alloys, iron-silicon-aluminum alloys, iron-cobalt-vanadium alloys, iron-based amorphous alloys, iron-based nanocrystalline alloys, nickel-zinc ferrites, nickel-copper-zinc ferrites, manganese-zinc ferrites, or combinations of the above materials.
The inductance element according to claim 1, wherein the sealing material comprises epoxy resin.
To provide a coil structure including a coil body and two extending wire segments connected to both ends of the coil body, A magnetic package structure is provided on the coil structure, which includes a surface and two grooves provided on the surface, and covers the coil body, and the extending line segment extends from the coil body toward the surface and penetrates the surface to be exposed to the outside of the magnetic package structure, After providing the magnetic package structure, the extending line segments are bent toward the surface and the interior of the grooves to form a bent portion, a pin portion, and a fixing portion in each of the extending line segments, the bent portion being connected to the coil body and the pin portion, the pin portion being connected to the bent portion and the fixing portion, and the pin portion being provided on the surface. After forming the bent portion, the pin portion, and the fixing portion, a sealing material is provided inside the groove so as to cover the fixing portion. A method for manufacturing an inductance element that includes [the specified element].
Bending the extending line segment toward the surface and the interior of the groove is, The pin portion is formed by bending a portion of the extending line segment along the side wall of the groove adjacent to the surface, The fixing portion is formed by bending a portion of the extending line segment along the bottom surface of the recessed groove in the surface, The method according to claim 10, including the method described in claim 10.
The method according to claim 10, further comprising: applying adhesive to the extending line segment before bending the extending line segment toward the surface and the interior of the groove; and positioning the adhesive between the surface and the pin portion of the magnetic package structure after bending the extending line segment toward the surface and the interior of the groove.
The method according to claim 10, which includes die-cast integral molding as an embodiment of the magnetic package structure.

Description

This disclosure relates to inductance elements, and more particularly to inductance elements containing magnetic materials and methods for manufacturing the same. Inductors are passive components widely used in circuit design, and their structural designs vary depending on different application needs. Conventional inductance structures utilize a T-core and a coil wound around it, with the core and coil enclosed in a package structure. The electrodes of such inductors are formed by plating on the package structure and connected to a coil embedded within the package structure. However, because the continuity of the plating layers is difficult to control, the internal stress between the plating layers becomes too large, leading to peeling of the electrode plating layers. Therefore, improving the manufacturing yield of this type of inductor is difficult, putting companies at a disadvantage in mass production and market competition. This is a perspective view of an inductance element according to one embodiment of the present disclosure.This is a cross-sectional view along cross-section C of the inductance element in the embodiment shown in Figure 1.This is a perspective view of a method for manufacturing an inductance element according to one embodiment of the present disclosure.This is a perspective view of a method for manufacturing an inductance element according to one embodiment of the present disclosure.This is a flowchart of a method for manufacturing an inductance element according to one embodiment of the present disclosure. This disclosure describes the following embodiments in detail. The descriptions of the embodiments in this disclosure below are for illustrative purposes only and are not intended to comprehensively disclose all embodiments or limit the specific embodiments of this disclosure. For example, the phrase "the first feature is formed on the second feature" in the description includes multiple embodiments in which the first and second features are in direct contact, and in which additional features are formed between the first and second features so that they are not in direct contact. Furthermore, the same reference numerals used in the drawings and specification represent the same or similar elements as much as possible. In the following description, to clearly illustrate the technical features of this disclosure, the sizes (e.g., length, width, thickness, and depth) of elements (e.g., layers, films, substrates, and regions) in the drawings are magnified by different proportions. Therefore, the following description and interpretation of the embodiments should not be limited to the sizes and shapes of the elements shown in the drawings, but should include the sizes, shapes, and deviations thereof due to the actual process and/or tolerances. For example, a flat surface shown in the drawings may have roughness and/or nonlinear characteristics, and an acute angle shown in the drawings may be a rounded angle. Therefore, the elements shown in the drawings of this disclosure are primarily schematic and are not intended to accurately depict the actual shapes of the elements, nor are they intended to limit the scope of the claims of this disclosure. Please refer to Figures 1 and 2. Figure 1 is an inductance element 100 of at least one embodiment of the present disclosure, and Figure 2 is a cross-sectional view of the inductance element 100 along the cross section CS. The inductance element 100 includes a magnetic package structure 120, a coil body 140, two extending line segments 160, a sealing material 180a, and a sealing material 180b. The magnetic package structure 120 includes a surface 120s and two grooves 122 provided on the surface 120s. In various embodiments of the present disclosure, the magnetic package structure 120 may be composed of a magnetic material and an adhesive material, and the magnetic material may include at least one of crystalline magnetic metal powder and amorphous magnetic metal powder. Specifically, the magnetic material may be selected from iron, iron-nickel alloys, iron-cobalt alloys, iron-silicon alloys, iron-vanadium alloys, iron-silicon-chromium alloys, iron-silicon-aluminum alloys, iron-silicon-aluminum alloys, iron-cobalt-vanadium alloys, iron-based amorphous alloys, iron-based nanocrystalline alloys, nickel-zinc ferrite, nickel-copper-zinc ferrite, manganese-zinc ferrite, or combinations of the above materials. The adhesive material may be selected from epoxy resin, silicone resin, acrylic resin, phenolic resin, polyvinyl alcohol, or combinations of the above materials. In particular, by mixing magnetic material powders of different particle sizes, the relative permeability and saturation magnetic field strength of the magnetic package structure 120 can be adjusted. The coil body 140 is embedded in the magnetic package structure 120, and the two extending wire segments 160 are connected to both ends of the coil body 140. More specifically, the coil body 140