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JP-7855821-B2 - Fuse and method for manufacturing the same

JP7855821B2JP 7855821 B2JP7855821 B2JP 7855821B2JP-7855821-B2

Inventors

  • リー、チャン ボグ
  • ジュン、サン エウン
  • キム、スン ギュ

Assignees

  • エルジー エナジー ソリューション リミテッド

Dates

Publication Date
20260511
Application Date
20221011
Priority Date
20211029

Claims (12)

  1. Printed circuit board and A conductive pattern arranged on the printed circuit board, A film is placed on top of the conductive pattern such that a portion of the upper part of the conductive pattern is open, A conductive pattern in which a portion of the aforementioned area is open, and a coating agent disposed on the upper part of the film, Includes, The aforementioned coating agent is A fuse in which the bonding force between the conductive pattern and the coating agent is set so that they can be physically separated when gas is filled between the conductive pattern and the coating agent.
  2. Printed circuit board and A conductive pattern arranged on the printed circuit board, A film is placed on top of the conductive pattern such that a portion of the upper part of the conductive pattern is open, A conductive pattern in which a portion of the aforementioned area is open, and a coating agent disposed on the upper part of the film, A fuse that includes, A fuse further comprising a dummy region positioned on top of the film to limit heat dissipation from the conductive pattern.
  3. The fuse according to claim 2 , wherein the dummy region comprises copper.
  4. The aforementioned dummy area is, The fuse according to claim 2 , wherein the conductive pattern is arranged excluding the upper part of the fused portion.
  5. The fuse according to any one of claims 1 to 4 , wherein the coating agent includes a flame-retardant material.
  6. The aforementioned flame-retardant material is The fuse according to claim 5 , comprising a flame retardant of V0 grade.
  7. The fuse according to any one of claims 1 to 4 , wherein the shape of at least a portion of the open area is rectangular or circular.
  8. The fuse according to any one of claims 1 to 4 , wherein the conductive pattern has a meandering shape on the printed circuit board so as to allow heat to accumulate.
  9. The aforementioned film is The fuse according to any one of claims 1 to 4 , wherein the fuse is arranged to cover at least a portion of both sides of the upper part of the conductive pattern.
  10. The aforementioned printed circuit board is A fuse according to any one of claims 1 to 4 , comprising a PCB (Printed Circuit Board) or an FPCB (Flexible Printed Circuit Board).
  11. The steps include forming a conductive pattern on a printed circuit board, The steps include forming a film to be placed on top of the conductive pattern such that a portion of the upper part of the conductive pattern is open, The steps include forming a conductive pattern in which a portion of the aforementioned area is open and a coating agent to be placed on top of the film, Includes, The aforementioned coating agent is A method for manufacturing a fuse , wherein the bonding force between the conductive pattern and the coating agent is set so that they can be physically separated when gas is filled between the conductive pattern and the coating agent .
  12. The steps include forming a conductive pattern on a printed circuit board, The steps include forming a film to be placed on top of the conductive pattern such that a portion of the upper part of the conductive pattern is open, The steps include forming a conductive pattern in which a portion of the aforementioned area is open and a coating agent to be placed on top of the film, The steps include: forming a dummy region positioned on top of the film to limit heat dissipation from the conductive pattern; A method for manufacturing fuses, including the manufacturing method itself.

Description

This invention claims priority under Korean Patent Application No. 10-2021-0147220 dated October 29, 2021, and all content disclosed in the said Korean Patent Application is incorporated herein by reference. The embodiments disclosed herein relate to fuses and methods for manufacturing the same. In recent years, research and development on rechargeable batteries has been actively pursued. Here, "rechargeable battery" refers to a battery capable of recharging and discharging, encompassing both conventional Ni/Cd batteries, Ni/MH batteries, and the more recent lithium-ion batteries. Among rechargeable batteries, lithium-ion batteries have the advantage of significantly higher energy density compared to conventional Ni/Cd and Ni/MH batteries. Furthermore, because lithium-ion batteries can be manufactured to be small and lightweight, they are used as power sources for mobile devices, and in recent years, their range of use has expanded to include electric vehicles, attracting attention as a next-generation energy storage medium. In the case of battery sensing lines, high voltage can cause problems such as fires, so fuses must be used to prevent such problems. When conductive patterns are used in a way that allows heat to accumulate on the sensing line on the PCB, burning may occur on the upper film when the conductive pattern reaches its operating temperature, and sufficient insulation resistance may not be ensured after the conductive pattern breaks. This figure shows a fuse according to one embodiment disclosed in this document.This is a block diagram showing a cross-section of a fuse according to one embodiment disclosed in this document.This figure shows an example of a fuse with an open top according to one embodiment disclosed in this document.This figure shows an example of a fuse with an open top according to one embodiment disclosed in this document.This figure shows an example of a fuse with an open top according to one embodiment disclosed in this document.This figure shows a dummy region of a fuse according to one embodiment disclosed in this document.This figure shows a cross-section of a fuse according to another embodiment disclosed in this document.This is a flowchart showing a method for manufacturing a fuse according to one embodiment disclosed in this document. The embodiments disclosed in this document will be described in detail below with reference to illustrative drawings. It should be noted that, when assigning reference numerals to components in each drawing, the same reference numerals will be used for the same components whenever possible when they appear in other drawings. Furthermore, when describing the embodiments disclosed in this document, if a detailed explanation of a related known configuration or function is deemed to hinder understanding of the embodiments disclosed in this document, such detailed explanation will be omitted. In describing the components of the embodiments disclosed herein, terms such as First, Second, A, B, (a), (b), etc., may be used. Such terms are merely for distinguishing a component from other components and do not limit the nature, order, or procedure of that component. Furthermore, unless otherwise defined, all terms used herein, including technical or scientific terms, have the same meaning as those generally understood by a person of ordinary skill in the art to which the embodiments disclosed herein belong. Terms defined in commonly used dictionaries should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and not as ideally or excessively formal unless explicitly defined in this application. Figure 1 shows a fuse according to one embodiment disclosed in this document. Referring to Figure 1, a fuse 100 according to one embodiment disclosed in this document may include a printed circuit board (PCB) 110, a conductive pattern 120, a film 130, and a coating agent 140. The printed circuit board 110 may include a PCB or an FPCB. The conductive pattern 120 can be placed on the printed circuit board 110. For example, the conductive pattern 120 can be implemented in a meandering shape on the printed circuit board 110 so that heat can be accumulated. In another example, the conductive pattern 120 may include copper. In this case, the conductive pattern 120 can operate at temperatures above 1040°C. In yet another example, the conductive pattern 120 can melt at temperatures above a set temperature. The film 130 can be positioned on both sides of the conductive pattern 120 or on top of the conductive pattern 120. The film 130 can be positioned such that at least a portion of the upper area of the conductive pattern 120 is open. For example, the film 130 can be positioned on both sides of the conductive pattern 120 at a distance from the conductive pattern 120. In one embodiment, since the film 130 is positioned such that at least a portion of the upper area of the conductive pattern 120 is open, burning does n