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JP-7855839-B2 - Packaging materials, packaging bodies, and articles with packaging bodies

JP7855839B2JP 7855839 B2JP7855839 B2JP 7855839B2JP-7855839-B2

Inventors

  • 近 禅

Assignees

  • 大日本印刷株式会社

Dates

Publication Date
20260511
Application Date
20210825

Claims (9)

  1. A package that covers at least a part of an article, Substrate and The first base layer formed by the antenna and printing , The second sublayer and the following are layered on top of each other. The antenna and the first underlayment and the second underlayment are each arranged on one side of the substrate. The first base layer is arranged to surround the antenna, either in contact with or separated by a gap from the outer contour of the antenna, and is provided to such an extent that it completely encloses the outer contour of the antenna .
  2. The packaging according to claim 1 , wherein the color difference ΔE*ab between the antenna and the first underlayer is 25 or less.
  3. The packaging according to claim 1 or claim 2 , wherein the color difference ΔE*ab between the second underlayer superimposed on the antenna and the second underlayer not superimposed on the antenna in a plan view is 13 or less.
  4. The packaging according to any one of claims 1 to 3, wherein the surface resistivity values of the first and second substrate layers are 100 times or more the surface resistivity value of the antenna.
  5. The packaging according to any one of claims 1 to 4, wherein a printing layer is further laminated on the side of the second base layer opposite to the antenna or the first base layer.
  6. The packaging according to any one of claims 1 to 5, wherein an IC chip is electrically connected to the antenna, and the antenna and the IC chip constitute a communication circuit capable of wireless communication with external devices.
  7. The packaging according to any one of claims 1 to 6, wherein the second underlayer overlaps the entire area of the antenna in a plan view.
  8. An article with packaging, wherein the packaging according to any one of claims 1 to 7 covers at least a portion of the article.
  9. A packaging material capable of assembling a package equipped with an antenna that covers at least a portion of an article, Substrate and The conductive pattern and the first underlayer formed by printing that constitute the antenna, The second sublayer and the following are layered on top of each other. The conductive pattern and the first underlayer and the second underlayer are each arranged on one side of the substrate. The first base layer is a packaging material that is arranged to surround the antenna, either in contact with or separated from the outer contour of the antenna , and to such an extent that it completely encloses the outer contour of the antenna .

Description

This invention relates to packaging materials, packaging bodies, and articles with packaging bodies that can cover at least a portion of an article and can be used for wireless communication. In recent years, IC tags utilizing RFID technology have been used as a form of contactless short-range communication using radio waves. For example, IC tags are attached to various items and their packaging materials, and these items are then transported, sold, and distributed. In this case, by holding the item over an external device (reader/writer) as needed, the item information recorded on the IC chip of the IC tag can be read via contactless communication, and various information can be written to the IC chip. This enables efficient logistics management. An IC tag attached to an item primarily consists of an IC chip and an antenna electrically connected to the IC chip. The predetermined information generated by the IC chip is transmitted to the antenna as a voltage change pattern. This pattern is then converted by the antenna into radio waves or magnetic fields of a predetermined frequency and transmitted to an external device. Conversely, radio waves or magnetic fields of a predetermined frequency transmitted from an external device are received by the antenna, converted into voltage change patterns, and then input into the IC chip as predetermined information. This allows the IC tag attached to the item to communicate wirelessly directly with an external device. One method for attaching IC tags to items is to form an antenna on a base material, then mount an IC chip on the antenna to form a label-like IC tag, and then attach this to the item or container. Alternatively, one method involves pre-printing only the antenna portion onto the container of the item before assembly, and then mounting the IC chip in a predetermined position on the antenna after assembly. Patent Document 1 describes an IC tag fixed to the outer surface of a bottle container via an adhesive layer, with a shrink film wrapped around the outside. The IC tag consists of a base material, an antenna formed on the base material, an IC chip connected to the antenna (an inlet section), and protective materials positioned on the upper and lower surfaces of the inlet section to protect it. Furthermore, Patent Document 2 describes a package with an IC tag for containing an article, which is assembled with multiple folded sections. Specifically, the package is made of cardboard for packaging, comprising at least two layers. One layer includes a printed antenna pattern, and the other layer includes a bonded RFIC element. The two layers are bonded together to form a laminate. This laminate contains an RFIC device in which the RFIC element and antenna pattern are sandwiched between the two layers, and the RFIC element and antenna pattern are electrically connected. Japanese Patent Publication No. 2010-49410International Publication WO2018/216686 This is a schematic diagram illustrating the structure of the packaging material, package, and article with package according to the first embodiment.This is a schematic diagram illustrating the structure of an IC tag.This is an explanatory diagram of the manufacturing method for the packaging material and packaging body according to the first embodiment.This is a cross-sectional view illustrating the structure of a packaging material and a packaging body according to a modified example of the first embodiment.This is a cross-sectional view illustrating the structure of a packaging material and a packaging body according to a modified example of the first embodiment.This is a schematic diagram illustrating the structure of the packaging material, packaging body, and article with packaging body according to the second embodiment.This is a cross-sectional view illustrating the structure of a packaging material according to a second embodiment and a modified version thereof.This is a schematic diagram illustrating the structure of a packaging material, a package, and an article with a package according to a modified example of the second embodiment. Examples of packaging materials, packaging bodies, and articles with packaging bodies of this disclosure will be described below with reference to the drawings and other illustrations. However, the packaging materials, etc. of this disclosure are not limited to the embodiments and examples described below. The following figures are schematic representations. Therefore, the size and shape of each part have been exaggerated as appropriate for ease of understanding. Furthermore, hatching indicating cross-sections of members has been omitted in some figures. The dimensions and other numerical values, as well as material names, of each member described herein are examples of embodiments and are not limiting; they can be selected and used as appropriate. In this specification, terms specifying shape and geometric conditions, such as parallel, orthogonal, and perpendicular, are u