JP-7855919-B2 - Photosensitive composition, cured film using the same, optical filter, image display device, solid-state image sensor, and infrared sensor

Inventors

• 吉田 寛之

Assignees

• ａｒｔｉｅｎｃｅ株式会社
• 東洋ビジュアルソリューションズ株式会社

Dates

Publication Date

20260511

Application Date

20220517

Priority Date

20210616

Claims (10)

1. A photosensitive composition comprising a near-infrared absorbing dye (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photopolymerization initiator (D), The alkali-soluble resin (B) comprises an alkali-soluble resin (B1) having a glass transition temperature of -10 to 37 °C, and an alkali-soluble resin (B2) having a glass transition temperature of 60 to 150 °C . The alkali-soluble resin (B1) is a resin containing polymerizable unsaturated groups and hydroxyl groups. A photosensitive composition in which the content of the alkali-soluble resin (B1) is 30 to 70% by mass of 100% by mass of the alkali-soluble resin (B) .
2. Furthermore, the photosensitive composition according to claim 1, further comprising a coloring agent (F).
3. The photosensitive composition according to claim 1 or 2, wherein the alkali-soluble resin (B2) is a resin that does not contain polymerizable unsaturated groups.
4. Furthermore, the photosensitive composition according to claim 1 or 2, comprising a sensitizer (E).
5. The photosensitive composition according to claim 4 , wherein the content of the sensitizer (E) is 150 to 400 parts by mass per 100 parts by mass of the photopolymerization initiator (D).
6. A cured film obtained by curing the photosensitive composition according to claim 1 or 2.
7. An optical filter having the cured film described in claim 6 .
8. An image display device having the cured film according to claim 6 .
9. A solid-state image sensor having the cured film described in claim 6 .
10. An infrared sensor having a cured film as described in claim 6 .

Description

This invention relates to a photosensitive composition and its uses. Video cameras, digital cameras, and portable devices with camera functions utilize CCDs (charge-coupled devices) and CMOS (complementary metal-oxide-semiconductor) solid-state image sensors for color images. Because these solid-state image sensors use silicon photodiodes, which are sensitive to infrared light, it is necessary to perform luminous sensitivity correction, and infrared cut filters are placed accordingly. Infrared cut filters are manufactured, for example, using compositions containing near-infrared absorbing dyes. Traditionally, infrared cut filters were used as flat films, but in recent years, the use of photolithography to form patterns in infrared cut filters has been explored. Infrared cut filters have traditionally used highly heat-resistant resins. However, these resins suffer from poor adhesion to the substrate, leading to problems such as peeling and chipping during the development process (adhesion), and low solubility in the developer solution, resulting in residue (developability). Furthermore, other issues included peeling and cracking due to temperature differences in the environment (heat cycle resistance) and poor resistance to solvents (solvent resistance). To solve the above problems, for example, Patent Document 1 discloses a photosensitive resin composition for near-infrared absorbers comprising a phthalocyanine compound having an absorption maximum wavelength in the near-infrared region, a binder resin, a photopolymerizable compound, a photopolymerization initiator, and a solvent. Furthermore, Patent Document 2 discloses a pattern-forming composition comprising an infrared-absorbing dye and a resin having a glass transition temperature of 150 to 300°C. Japanese Patent Publication No. 2010-160380International Publication No. 2019/058882 Figure 1 shows a schematic cross-sectional view of an image display device equipped with the cured film of the present invention.Figure 2 shows a schematic cross-sectional view of a solid-state image sensor equipped with the cured film of the present invention.Figure 3 shows a schematic cross-sectional view of an infrared sensor equipped with the cured film of the present invention. The following describes in detail embodiments for carrying out the photosensitive composition of the present invention. However, the present invention is not limited to the following embodiments and can be modified and implemented within the scope of solving the problem. In the present invention, unless otherwise specified, "(meth)acryloyl,""(meth)acrylic,""(meth)acrylicacid,""(meth)acrylate," or "(meth)acrylamide" means "acryloyl and/or methacryloyl,""acrylic and/or methacrylic,""acrylic acid and/or methacrylic acid,""acrylate and/or methacrylate," or "acrylamide and/or methacrylamide," respectively. Also, "C.I." means Color Index (C.I.; issued by The Society of Dyers and Colourists). A polymerizable unsaturated group is an ethylenically unsaturated double bond. Regarding the molecular weight of the compounds in this invention, for low molecular weight compounds whose molecular weight can be determined, the value is calculated or measured by ESI-MS (electrospray ionization mass spectrometry). For compounds with a molecular weight distribution, the weight-average molecular weight in polystyrene terms is measured by gel permeation chromatography using tetrahydrofuran as the solvent. A monomer is a compound that forms a resin through polymerization. A monomer is in an unreacted state, while a monomer unit is the state in which the monomer has polymerized and formed a resin. <Photosensitive composition> One embodiment of the present invention relates to a photosensitive composition. The photosensitive composition of the present invention comprises a near-infrared absorbing dye (A), an alkali-soluble resin (B), a polymerizable compound (C), and a photopolymerization initiator (D), The alkali-soluble resin (B) is characterized by comprising an alkali-soluble resin (B1) having a glass transition temperature of -10 to 40°C, and an alkali-soluble resin (B2) having a glass transition temperature of 60 to 150°C. The mechanism by which the above-described photosensitive composition can solve the problems of the present invention is not clear, but we speculate as follows. By using resins with low and high glass transition temperatures in combination, the coating film contains areas with low glass transition temperatures (flexible areas) and areas with high glass transition temperatures (rigid areas). Therefore, compared to a uniform coating film using a single type of resin, it is presumed that external or internal stresses can be effectively relieved, resulting in a coating film with excellent developability, adhesion, heat cycle resistance, and solvent resistance. The following describes in detail the components included in, or potentially included in, the photosensitive composition of one embodiment. [Near