JP-7855956-B2 - Adhesive resin composition, single-layer film made from the adhesive resin composition, and laminate

Inventors

• 原 憲一
• 赤木 太亮
• 山口 浩史
• 山田 智紀

Assignees

• ａｒｔｉｅｎｃｅ株式会社
• トーヨーケム株式会社

Dates

Publication Date

20260511

Application Date

20220713

Claims (4)

1. The adhesive resin composition contains 60 to 90 % by mass of acid-modified polyolefin (A) and 10 to 40 % by mass of polyester resin (B) in 100% by mass. The melting peak temperature in DSC of acid-modified polyolefin (A) is between 85°C and 130°C. The polyester resin (B) is characterized in that its melting peak temperature in DSC is 70°C or higher and 210°C or lower. Adhesive resin composition.
2. The adhesive resin composition according to claim 1, wherein the melt mass flow rate, measured in accordance with JIS K 7210-1 at a temperature of 190°C and a load of 2.16 kg, is in the range of 1 to 100 g/10 min.
3. A single-layer film comprising the adhesive resin composition described in claim 1 or 2.
4. A laminate having an adhesive layer made of the adhesive resin composition described in claim 1 or 2 on a substrate.

Description

This invention relates to an adhesive resin composition having excellent adhesion not only to metallic materials such as stainless steel (SUS), aluminum, and copper, but also to organic materials such as polyethylene, polypropylene, and polyethylene terephthalate; a single-layer film made from the adhesive resin composition; and a laminate having an adhesive layer made from the adhesive resin composition on a substrate. In recent years, metal-based materials and organic-based materials are sometimes used in combination in solar cell components, automotive components, and building materials. Examples of metal-based materials include stainless steel (SUS), aluminum, copper, and tinplate, while examples of organic-based materials include polyethylene, polypropylene, polyethylene terephthalate, and polyethylene naphthalate. Patent Document 1 discloses a laminated film in which a sealant layer is laminated on at least one side of a polypropylene film via an adhesive layer, wherein the adhesive layer comprises a mixture of an acid-modified polyolefin resin (A) containing a (meth)acrylic acid ester component and having an unsaturated carboxylic acid component content of 0.01 to 5.0% by weight, and a thermoplastic resin (B) having a glass transition temperature of 5°C or lower, and the mass ratio (A)/(B) is in the range of 99/1 to 20/80. Patent Document 2 discloses an adhesive resin composition comprising an acid-modified polyolefin resin (A) and a gas-barrier resin (B) as essential components, wherein the density of the acid-modified polyolefin resin (A) is in the range of 0.8 to 1.0 g/ cm³ , the density of the gas-barrier resin (B) is in the range of 1.1 to 1.5 g/ cm³ , and the adhesive resin composition contains 10 to 40 parts by weight of the gas-barrier resin (B) per 100 parts by weight of total solids. However, the adhesive resin compositions proposed in Patent Documents 1 and 2 had problems with heat resistance and adhesion. Japanese Patent Publication No. 2009-226870Japanese Patent Publication No. 2021-143283 The present invention will now be described in detail. It goes without saying that other embodiments are also included within the scope of the present invention, as long as they are consistent with the spirit of the invention. In this specification, a numerical range specified using "~" includes the numbers before and after "~" as the lower and upper limits. In this specification, "neck-in" refers to the phenomenon in which the width of the adhesive resin composition film extruded from the die in an extrusion laminator becomes narrower than the width of the die, and a larger neck-in indicates poorer extrusion lamination suitability. <Acid-modified polyolefin (A)> Acid-modified polyolefin (A) has a melting peak temperature of 85°C to 130°C in DSC. Keeping the melting peak temperature of the acid-modified polyolefin within a predetermined range is necessary to exhibit adhesiveness, heat-resistant adhesion, and cold-resistant adhesion; if it is outside this range, the above effects cannot be achieved. The melting peak temperature in DSC of acid-modified polyolefin (A) is preferably in the range of 90°C to 125°C, more preferably in the range of 100°C to 120°C, and particularly preferably in the range of 105°C to 115°C. In this specification, the melting peak temperature is the temperature at the peak of the endothermic peak measured at a heating rate of 10°C/min, in accordance with JIS K 7121:1987. The method for producing acid-modified polyolefins is not particularly limited. For example, one method is described in Japanese Patent Application Publication No. 11-335427, in which an α,β-unsaturated carboxylic acid or its anhydride is grafted onto a polyolefin base polymer in a molten state in the presence of a radical initiator. These acid-modified polyolefins (A) may be used individually or in combination of two or more types. The types of monomers constituting the acid-modified polyolefin (A) are not particularly limited, but examples include ethylene, propylene, 1-butene, 1-octene, 4-methylpentene-1, (meth)acrylic acid, methyl (meth)acrylate, ethyl (meth)acrylate, isobutyl (meth)acrylate, n-butyl (meth)acrylate, isooctyl (meth)acrylate, glycidyl (meth)acrylate, dimethyl maleate, diethyl maleate, vinyl acetate, vinyl propionate, and tetracyclododecene. It may be a single-component polymer composed of a single element from these, or a multi-component polymer composed of multiple elements. The acid component of acid-modified polyolefins is not particularly limited, but examples include maleic acid, acrylic acid, methacrylic acid, and itaconic acid. Among these, maleic acid is preferably used. Furthermore, derivatives of these, such as acid anhydrides, acid esters, acid amides, and acid halides, are also examples. Among these, acid anhydrides are preferred. The density of the acid-modified polyolefin (A) is preferably in the range of 0.85 to 1.0 g/ cm³ , more preferably in the range of 0.86 to 0.98 g/ cm³ ,