JP-7856110-B2 - Method for manufacturing photosensitive paste and electronic components

Inventors

• 佐野 力也

Assignees

• 株式会社村田製作所

Dates

Publication Date

20260511

Application Date

20220825

Priority Date

20211005

Claims (15)

1. It contains an inorganic powder containing elements that become polyvalent metal ions, an alkali-soluble polymer, a photosensitive monomer, and a photopolymerization initiator. At least a portion of the surface of the inorganic powder containing the element that becomes the polyvalent metal ion is covered with a ceramic coating. 95% or more by mass of the aforementioned ceramic coating is SiO₂ , A photosensitive paste characterized in that the conductivity of a dispersion liquid obtained by dispersing an inorganic powder containing the element that becomes a polyvalent metal ion in pure water at a concentration of 1% by weight is 170 mS/m or less 10 minutes after dispersion.
2. The photosensitive paste according to claim 1, wherein the content of the element that becomes a polyvalent metal ion on the surface of the inorganic powder containing the element that becomes a polyvalent metal ion is less than 2.0 atomic percent.
3. The photosensitive paste according to claim 1 , wherein the difference between the refractive index N1 of the ceramic coating and the refractive index N2 of the mixture of the alkali-soluble polymer, the photosensitive monomer, and the photopolymerization initiator is |N1-N2| ≤ 0.3.
4. The photosensitive paste according to claim 1, wherein the inorganic powder containing the element that becomes a polyvalent metal ion is an insulator mainly composed of metal oxide crystals or an amorphous insulator mainly composed of SiO2 .
5. The photosensitive paste according to claim 4, wherein the element that forms the polyvalent metal ion is at least one element selected from the group consisting of alkaline earth metals, lanthanides, Ni, Cu, Pd, Al, Ti, Zr, Zn, Ga, Pb, Nb, Fe, Co, and V.
6. The inorganic powder containing the element that becomes the polyvalent metal ion is SiO 2 The photosensitive paste according to claim 1, wherein the photosensitive paste is an amorphous insulator mainly composed of [the specified substance].
7. SiO 2 An amorphous insulator whose main component is SiO 2 -B 2 O 3 -Na 2 OK 2 O-CaO-Al 2 O 3 Glass powder or SiO 2 -B 2 O 3 -Na 2 OK 2 O-Al 2 O 3 A photosensitive paste according to claim 6, comprising a glass powder.
8. The photosensitive paste according to claim 1 , wherein the inorganic powder containing the element that becomes a polyvalent metal ion is a glass powder having a crystallization point.
9. The glass powder having the aforementioned crystallization point is SiO 2 -B 2 O 3 - Al 2 O 3 - CaO-based glass powder, SiO 2 -B 2 O 3 -BaO-ZnO-Al 2 O 3 -MgO-La 2 O 3 Glass powder or SiO 2 -B 2 O 3 -CaO-Al 2 O 3 -Na 2 OK 2 The photosensitive paste according to claim 8, comprising O-type glass powder.
10. The inorganic powder containing the element that becomes the polyvalent metal ion is SiO 2 -B 2 O 3 - Al 2 O 3 - The photosensitive paste according to claim 1, wherein the glass powder has CaO as its main component.
11. The aforementioned ceramic coating is SiO 2 The photosensitive paste according to claim 1, which is a film containing an organic substance.
12. The photosensitive paste according to claim 11, wherein the organic substance is poly(2-methyloxazoline), poly(N,N-dimethylacrylamide), or polyvinylpyrrolidone having an amide carbonyl group.
13. The photosensitive paste according to claim 11, wherein the organic substance is polyvinylpyrrolidone.
14. The photosensitive paste according to claim 1, wherein the particle size of the inorganic powder containing the element that becomes a polyvalent metal ion is 0.1 μm or more and 5.0 μm or less.
15. A process of forming an insulating layer using insulating paste, The process includes the step of forming a conductive layer on the insulating layer using a conductive paste, A method for manufacturing an electronic component, characterized in that the insulating paste is the photosensitive paste described in any one of claims 1 to 14 .

Description

This invention relates to a method for manufacturing a photosensitive paste and electronic components. A method is known for using a photosensitive paste containing inorganic and organic components to form insulating layers and wiring conductors in electronic components and printed circuit boards. For example, Patent Document 1 discloses a photosensitive glass paste comprising an inorganic component containing glass powder and ceramic filler, and a photosensitive organic component. The photosensitive organic component includes alkali-soluble polymers, photosensitive monomers, photopolymerization initiators, and solvents, and examples of alkali-soluble polymers include polymers having carboxyl groups in their side chains, such as methacrylate-methyl methacrylate copolymers. International Publication No. 2018/037729International Publication No. 2012/067016 Figure 1 is a graph showing the conductivity of a dispersion of inorganic powder in pure water at a concentration of 1% by weight.Figure 2 is a graph showing the Brookfield viscosity measurement results for the photosensitive pastes prepared in the examples.Figure 3A is a photograph showing the planar shapes of various patterns formed by photolithography using a photosensitive paste containing glass frit coated with 3% by weight of tetraethoxysilane.Figure 3B is a photograph showing the cross-sectional shape of the pattern in Figure 3A.Figure 4 is a photograph showing the planar shapes of various patterns formed by photolithography using a photosensitive paste containing glass frit coated with 3% by weight of tetraethoxysilane and polyvinylpyrrolidone.Figure 5 is a photograph showing the planar shapes of various patterns formed by photolithography using a photosensitive paste containing glass frit coated with 6% by weight of tetraethoxysilane and polyvinylpyrrolidone.Figure 6A is a photograph showing the planar shapes of various patterns formed by photolithography using a photosensitive paste containing glass frit coated with malonic acid.Figure 6B is a photograph showing the cross-sectional shape of the pattern in Figure 6A. The photosensitive paste of the present invention, the method for manufacturing the first electronic component of the present invention, and the method for manufacturing the second electronic component of the present invention will be described below. However, the present invention is not limited to the following configurations and may be modified as appropriate without departing from the spirit of the invention. Furthermore, a combination of several of the preferred configurations described below also constitutes the present invention. <Photosensitive paste> The photosensitive paste of the present invention contains an inorganic powder containing an element that becomes a polyvalent metal ion, an alkali-soluble polymer, a photosensitive monomer, and a photopolymerization initiator. The photosensitive paste of the present invention includes a photosensitive insulating paste used for forming an insulating layer, or a photosensitive conductive paste used for forming a conductive layer. First, we will describe the case where the photosensitive paste of the present invention is a photosensitive insulating paste. [Photosensitive insulating paste] (Inorganic powder containing elements that form polyvalent metal ions) In the inorganic powder containing the element that becomes a polyvalent metal ion, the "element that becomes a polyvalent metal ion" is not particularly limited as long as it is an element that becomes a metal ion with a valency of 2 or higher, and examples include alkaline earth metals and metal elements from group 3 to group 14. In the present invention, it is preferable that the element that becomes a polyvalent metal ion is at least one element selected from the group consisting of alkaline earth metals, lanthanides, Ni, Cu, Pd, Al, Ti, Zr, Zn, Ga, Pb, Nb, Fe, Co, and V. In the photosensitive insulating paste of the present invention, the inorganic powder containing the element that becomes the polyvalent metal ion is preferably an insulator mainly composed of metal oxide crystals or an amorphous insulator mainly composed of SiO2 . By firing the photosensitive paste containing an insulator mainly composed of metal oxide crystals or an amorphous insulator mainly composed of SiO2 , an insulating material with high strength can be obtained. Examples of insulators whose main component is metal oxide crystals include TiO₂ , BaTiO, and NiO. Examples of amorphous insulators mainly composed of SiO₂ include SiO₂ - B₂O₃ - Na₂O - K₂O -CaO- Al₂O₃ - based glass powder and SiO₂- B₂O₃ - Na₂O -K₂O - Al₂O₃ - based glass powder. In the photosensitive insulating paste of the present invention, glass powder having a crystallization point is preferred as the inorganic powder containing the element that becomes the polyvalent metal ion. This is because a more powerful insulating material can be obtained by firing the photosensitive paste contain