JP-7856125-B2 - Photosensitive resin composition, photosensitive element, printed circuit board, and method for manufacturing a printed circuit board.

Inventors

• 山下 俊貴
• 代島 雄汰
• 平原 真菜
• 新川 太一

Assignees

• 株式会社レゾナック

Dates

Publication Date

20260511

Application Date

20240627

Claims (10)

1. (A) Acid-modified vinyl group-containing resin, (B) Thermosetting resin, (C) Photopolymerizable compound, (D) Photopolymerization initiator , ( E) Secondary thiol compound, (F) Inorganic filler, and (H) Elastomer are included. The aforementioned component (B) comprises a first polyfunctional epoxy resin having a molecular weight of less than 380 and a second polyfunctional epoxy resin having a molecular weight of 380 or more. A photosensitive resin composition in which the mass ratio of the content of the first polyfunctional epoxy resin to the content of the second polyfunctional epoxy resin is 1.0 to 5.0.
2. The photosensitive resin composition according to claim 1, wherein the content of component (E) is 0.05% by mass or more, based on the total solid content of the photosensitive resin composition.
3. The photosensitive resin composition according to claim 1, wherein the content of component (E) is 0.05 to 3.0% by mass, based on the total solid content of the photosensitive resin composition.
4. The photosensitive resin composition according to claim 1, wherein the number of functional groups of component (E) is 2 to 6.
5. The photosensitive resin composition according to claim 1, wherein the mass ratio of the content of component (E) to the content of the second polyfunctional epoxy resin is 0.005 to 0.5.
6. (G) The photosensitive resin composition according to claim 1, further comprising a photosensitizer.
7. The device comprises a support film and a photosensitive layer formed on the support film, A photosensitive element wherein the photosensitive layer comprises the photosensitive resin composition described in any one of claims 1 to 6 .
8. A printed circuit board comprising a permanent resist containing a cured product of a photosensitive resin composition according to any one of claims 1 to 6 .
9. A step of forming a photosensitive layer on a substrate using the photosensitive resin composition described in any one of claims 1 to 6 , The process of exposing and developing the photosensitive layer to form a resist pattern, A step of curing the aforementioned resist pattern to form a permanent resist, A method for manufacturing printed circuit boards, comprising:
10. A step of forming a photosensitive layer on a substrate using the photosensitive element described in claim 7 , The process of exposing and developing the photosensitive layer to form a resist pattern, A step of curing the aforementioned resist pattern to form a permanent resist, A method for manufacturing printed circuit boards, comprising:

Description

This disclosure relates to a photosensitive resin composition, a photosensitive element, a printed circuit board, and a method for manufacturing a printed circuit board. In the field of printed circuit boards (PCBs), permanent resist is formed on the PCB. Permanent resist plays a role in preventing corrosion of the conductor layer and maintaining electrical insulation between conductor layers during the use of the PCB. In recent years, permanent resist has also served as a solder resist film in processes such as flip-chip mounting and wire bonding of semiconductor devices onto the PCB via solder, preventing solder from adhering to unwanted areas of the conductor layer. Conventionally, permanent resists have been manufactured by screen printing using a thermosetting resin composition or by photographic methods using a photosensitive resin composition. For example, in flexible wiring boards using mounting methods such as FC (Flip Chip), TAB (Tape Automated Bonding), and COF (Chip On Film), a thermosetting resin paste is screen printed and then heat-cured to form a permanent resist, excluding the connection wiring patterns for IC chips, electronic components, or LCD (liquid crystal display) panels (see, for example, Patent Document 1). In semiconductor package substrates such as BGA (Ball Grid Array) and CSP (Chip Size Package) mounted on electronic components, it is necessary to remove the permanent resist from the bonding area for the following purposes: (1) to flip-chip mounting of semiconductor elements via solder onto the semiconductor package substrate, (2) to wire-bond the semiconductor elements to the semiconductor package substrate, and (3) to solder the semiconductor package substrate to the motherboard substrate. For image formation of the permanent resist, a photographic method is used in which a photosensitive resin composition is applied, dried, and then selectively irradiated with active light such as ultraviolet light to cure it, and only the unirradiated areas are removed by development to form the image. Because of its ease of use, the photographic method is suitable for mass production and is widely used in the electronic materials industry for image formation of photosensitive materials (see, for example, Patent Document 2). Japanese Patent Publication No. 2003-198105Japanese Patent Publication No. 2011-133851 This is a schematic cross-sectional view showing a photosensitive element according to this embodiment. The following describes this disclosure in detail. In this specification, the term "process" includes not only independent processes but also processes that are indistinguishable from other processes as long as their intended function is achieved. The term "layer" includes not only structures formed on the entire surface when viewed in a plan view, but also structures formed on only a portion of the surface. Numerical ranges indicated using "~" represent a range that includes the numbers before and after "~" as the minimum and maximum values, respectively. In numerical ranges described stepwise in this specification, the upper or lower limit of a numerical range in one step may be replaced with the upper or lower limit of a numerical range in another step. In numerical ranges described in this specification, the upper or lower limit of a numerical range may be replaced with the values shown in the examples. In this specification, when referring to the amount of each component in a composition, if there are multiple substances corresponding to each component in the composition, unless otherwise specified, it refers to the total amount of those multiple substances present in the composition. In this specification, "(meth)acrylate" means at least one of "acrylate" and its corresponding "methacrylate," and the same applies to other similar expressions such as (meth)acrylic acid and (meth)acryloyl. In this specification, "solids" refers to the non-volatile components of a photosensitive resin composition, excluding volatile substances (water, solvents, etc.), and includes components that are liquid, syrup-like, or waxy at room temperature (around 25°C). [Photosensitive resin composition] The photosensitive resin composition according to this embodiment contains (A) an acid-modified vinyl group-containing resin, (B) a thermosetting resin, (C) a photopolymerizable compound, (D) a photopolymerization initiator, and (E) a secondary thiol compound. The photosensitive resin composition according to this embodiment is a negative-type photosensitive resin composition, and the cured film of the photosensitive resin composition can be suitably used as a permanent resist. The components used in the photosensitive resin composition of this embodiment will be described in more detail below. (Component (A): Acid-modified vinyl group-containing resin) The photosensitive resin composition according to this embodiment contains an acid-modified vinyl group-containing resin as component (A). The acid-modif