JP-7856156-B2 - Coolers and semiconductor devices

Inventors

• 佐野 大貴

Assignees

• 富士電機株式会社

Dates

Publication Date

20260511

Application Date

20230704

Priority Date

20220808

Claims (20)

1. A container having opposing first and second side walls, and equipped with a refrigerant inlet and outlet, Within the container, there is a first flow path arranged parallel to the first side wall and communicating with the inlet, Within the container, there is a second flow path arranged parallel to the second side wall and communicating with the outlet, A third channel is provided within the container and communicates with the first channel and the second channel, A first flow velocity adjustment unit is disposed between the first flow path and the third flow path within the container, A second flow velocity adjustment unit is provided within the container, located between the second flow path and the third flow path. It has, The first flow velocity adjustment unit includes a first region having a first aperture ratio and a second region having a second aperture ratio smaller than the first aperture ratio. The second flow velocity adjustment section includes a third region having a third aperture ratio and a fourth region having a fourth aperture ratio greater than the third aperture ratio. The width of the opening of the first region from the end on the first velocity adjustment section side toward the second velocity adjustment section to the end on the second velocity adjustment section side in the direction from the first velocity adjustment section toward the second velocity adjustment section is greater than the width of the opening of the second region from the end on the first velocity adjustment section side toward the second velocity adjustment section to the end on the second velocity adjustment section side in the direction from the first velocity adjustment section toward the second velocity adjustment section . A cooler in which the width of the opening in the third region from the end on the first velocity adjustment section side to the end on the second velocity adjustment section side in the direction from the first velocity adjustment section to the second velocity adjustment section is smaller than the width of the opening in the fourth region from the end on the first velocity adjustment section side to the end on the second velocity adjustment section side in the direction from the first velocity adjustment section to the second velocity adjustment section .
2. The cooler according to claim 1, wherein the first region is arranged opposite the third region.
3. The first region is located closer to the inlet communicating with the first flow path than the second region. The cooler according to claim 1, wherein the third region is located closer to the outlet communicating with the second flow path than the fourth region.
4. The opening in the first region is a first slit having a first width, The opening in the second region is a second slit having a second width that is narrower than the first width. The opening in the third region is a third slit having a third width, The cooler according to claim 1, wherein the opening in the fourth region is a fourth slit having a fourth width that is wider than the third width.
5. The opening in the first region is a first hole having a first diameter, The opening in the second region is a second hole having a second diameter smaller than the first diameter. The opening in the third region is a third hole having a third diameter, The cooler according to claim 1, wherein the opening in the fourth region is a fourth hole having a fourth diameter larger than the third diameter.
6. The openings in the first region and the second region are fifth slits that extend from the first region to the second region and narrow in width from the first region to the second region. The cooler according to claim 1, wherein the openings in the third region and the fourth region are sixth slits that extend from the third region to the fourth region and widen in width from the third region to the fourth region.
7. The first flow path is a first groove extending along the first side wall at the bottom between the first side wall and the second side wall of the container, The second flow channel is a second groove extending along the second side wall at the bottom, The cooler according to any one of claims 1 to 6, wherein the third flow path is an internal space of the container above the first groove and the second groove.
8. Of the three regions obtained by dividing the first flow path in the direction in which the first groove extends along the first side wall, one corresponds to the first region and the remaining two correspond to the second region. The cooler according to claim 7, wherein of the group of regions obtained by dividing the second flow path into three in the direction in which the second groove extends along the second side wall, one corresponds to the third region and the remaining two correspond to the fourth region.
9. The opening in the first region and the opening in the second region are arranged to be located at the end of the first channel on the first side wall side, The cooler according to claim 7, wherein the opening in the third region and the opening in the fourth region are arranged to be located at the end of the second flow path on the second side wall side.
10. The cooler according to claim 7, wherein the container includes a heat sink plate that covers the third channel and has fins positioned within the third channel.
11. Cooler and The semiconductor module mounted on the aforementioned cooler, Equipped with, The aforementioned cooler is, A container having opposing first and second side walls, and equipped with a refrigerant inlet and outlet, Within the container, there is a first flow path arranged parallel to the first side wall and communicating with the inlet, Within the container, there is a second flow path arranged parallel to the second side wall and communicating with the outlet, A third channel is provided within the container and communicates with the first channel and the second channel, A first flow velocity adjustment unit is disposed between the first flow path and the third flow path within the container, A second flow velocity adjustment unit is provided within the container, located between the second flow path and the third flow path. It has, The first flow velocity adjustment unit includes a first region having a first aperture ratio and a second region having a second aperture ratio smaller than the first aperture ratio. The second flow velocity adjustment section includes a third region having a third aperture ratio and a fourth region having a fourth aperture ratio greater than the third aperture ratio. The width of the opening of the first region from the end on the first velocity adjustment section side toward the second velocity adjustment section to the end on the second velocity adjustment section side in the direction from the first velocity adjustment section toward the second velocity adjustment section is greater than the width of the opening of the second region from the end on the first velocity adjustment section side toward the second velocity adjustment section to the end on the second velocity adjustment section side in the direction from the first velocity adjustment section toward the second velocity adjustment section . The width of the opening in the third region from the end on the first velocity adjustment section side to the end on the second velocity adjustment section side in the direction from the first velocity adjustment section to the second velocity adjustment section is smaller than the width of the opening in the fourth region from the end on the first velocity adjustment section side to the end on the second velocity adjustment section side in the direction from the first velocity adjustment section to the second velocity adjustment section . The semiconductor module is a semiconductor device mounted in a position opposite the third flow path of the cooler.
12. The semiconductor device according to claim 11, wherein the first region is arranged opposite the third region.
13. The first region is located closer to the inlet communicating with the first flow path than the second region. The semiconductor device according to claim 11, wherein the third region is located closer to the outlet communicating with the second flow path than the fourth region.
14. The opening in the first region is a first slit having a first width, The opening in the second region is a second slit having a second width that is narrower than the first width. The opening in the third region is a third slit having a third width, The semiconductor device according to claim 11, wherein the opening in the fourth region is a fourth slit having a fourth width wider than the third width.
15. The opening in the first region is a first hole having a first diameter, The opening in the second region is a second hole having a second diameter smaller than the first diameter. The opening in the third region is a third hole having a third diameter, The semiconductor device according to claim 11, wherein the opening of the fourth region is a fourth hole having a fourth diameter larger than the third diameter.
16. The openings in the first region and the second region are fifth slits that extend from the first region to the second region and narrow in width from the first region to the second region. The semiconductor device according to claim 11, wherein the openings in the third region and the fourth region are sixth slits that extend from the third region to the fourth region and widen in width from the third region to the fourth region.
17. The first flow path is a first groove extending along the first side wall at the bottom between the first side wall and the second side wall of the container, The second flow channel is a second groove extending along the second side wall at the bottom, The semiconductor device according to any one of claims 11 to 16, wherein the third channel is an internal space of the container above the first groove and the second groove.
18. Of the three regions obtained by dividing the first flow path in the direction in which the first groove extends along the first side wall, one corresponds to the first region and the remaining two correspond to the second region. The semiconductor device according to claim 17, wherein one of the three regions obtained by dividing the second flow channel in the direction in which the second groove extends along the second side wall corresponds to the third region and the remaining two correspond to the fourth region.
19. The opening in the first region and the opening in the second region are arranged to be located at the end of the first channel on the first side wall side, The semiconductor device according to claim 17, wherein the opening in the third region and the opening in the fourth region are arranged to be located at the end of the second channel on the second side wall side.
20. The container includes a heat sink plate that covers the third channel and has fins positioned within the third channel, The semiconductor device according to claim 17, wherein the heat sink is disposed between the opposing semiconductor module and the third channel.

Description

This invention relates to a cooler and a semiconductor device. A cooler integrated into the housing of a power converter is known, in which a refrigerant passage and a recess whose opening is sealed by a heating element are connected at a connection point, and a cooler in which the opening area and shape of the connection point are varied according to the distance from the inlet of the refrigerant passage (Patent Document 1). Furthermore, a cooler is known in which a plurality of plate-shaped fins are provided at the lower part of the upper plate on which semiconductor chips are placed, each forming a flow path for cooling water. Connecting bars having a plurality of comb-shaped teeth protruding into the flow path are connected to these plate-shaped fins, and the plurality of comb-shaped teeth and the plurality of plate-shaped fins define a plurality of openings of a size based on the position of the semiconductor chips, etc. (Patent Document 2). Furthermore, a semiconductor device is known that includes a fin section with multiple protrusions connected to the lower surface of a heat-transferring base plate, and a cooling component that covers the fin section and is connected to a refrigerant inlet and outlet, and is provided with a header which is a water reservoir and a water flow control plate so that the refrigerant can flow between the inlet and outlet and the fin section (Patent Document 3). Furthermore, a semiconductor cooler is known that comprises a cooling plate on which multiple semiconductor modules with different heat generation amounts are arranged on one side and multiple heat dissipation fins erected on the other side, and a housing portion positioned opposite the cooling plate, wherein the flow path height of the refrigerant flow path formed between the gaps between adjacent heat dissipation fins and the walls of the cooling plate and the housing portion is varied depending on the region facing the semiconductor modules with different heat generation amounts (Patent Document 4). Furthermore, a liquid-cooled cooler is known in which a cooling container with a heat sink having heat dissipation fins as one side wall is divided into two regions by a first partition wall, a heat dissipation region in which the heat dissipation fins are exposed is formed in one region, and an inlet header region and an outlet header region are formed in the other region separated by a second partition wall, an inlet-side connecting passage and an outlet-side connecting passage are provided in the first partition wall, the heat dissipation region and the inlet header region are connected by the inlet-side connecting passage, and the heat dissipation region and the outlet header region are connected by the outlet-side connecting passage, thereby forming a cooling liquid passage (Patent Document 5). Furthermore, a semiconductor device is known in which a base plate on which a semiconductor element is mounted is arranged on the lower surface, and a plurality of cooling fins and a jacket surrounding them are arranged on the lower surface, and a partition wall is provided below the plurality of cooling fins in the jacket, allowing refrigerant from the refrigerant inlet of the jacket to flow to the plurality of cooling fins and out to the refrigerant outlet of the jacket, and an inlet opening is provided at a position corresponding to the semiconductor element in the partition wall for allowing refrigerant to flow from the refrigerant inlet to the plurality of cooling fins (Patent Document 6). Furthermore, an electrical device is known in which a cooling jacket has multiple upstream connecting passages in the connection area between the main flow path that guides the cooling medium and the introduction passage upstream of it, and multiple downstream connecting passages in the connection area between the main flow path and the discharge passage downstream of it, and an electrical element is installed on the ceiling wall of the main flow path of the cooling jacket (Patent Document 7). Furthermore, a cooler for semiconductor modules is known, comprising a tray-shaped cooling jacket provided with refrigerant introduction channels and refrigerant discharge channels extending parallel to each other and a cooling channel between them; a heat sink in which the channels are perpendicular to the refrigerant introduction channels and refrigerant discharge channels and a flow velocity adjustment plate fixed to one side extends to the boundary position with the refrigerant discharge channel; and a heat dissipation plate on which semiconductor elements are bonded to the outer surface and which closes the opening of the cooling jacket (Patent Document 8). Furthermore, a cooler for semiconductor modules is known, comprising a water jacket having a first flow path extending from a refrigerant inlet, a second flow path arranged parallel to and spaced apart from the first flow path and extending toward a refrigerant outlet, and a third fl