JP-7856163-B2 - Use of modifiers, resin compositions, and rosin-based resins for thermoplastic resins

Inventors

• 伊藤 翼
• 川端 昭寛
• 柴地 功基
• 柏原 徹也
• 芝原 遼
• 中谷 隆

Assignees

• 荒川化学工業株式会社

Dates

Publication Date

20260511

Application Date

20231026

Priority Date

20221101

Claims (8)

1. The mass residue rate after heating at 300°C for 2 hours is 40% by mass or more. The mixed methylcyclohexaneaniline cloud point (MMAP) is -10 to 20°C. The acid value is 200 mg KOH/g or less. Contains rosin-based resins, It is a modifier for thermoplastic resins, The thermoplastic resin comprises at least one selected from the group consisting of polyamide, polyphenylene ether, and polyolefin resin. Modifier for thermoplastic resins.
2. The modifier and thermoplastic resin described in claim 1 are included, The thermoplastic resin comprises at least one selected from the group consisting of polyamide, polyphenylene ether, and polyolefin resin. Resin composition.
3. Furthermore, the resin composition according to claim 2 , further comprising a filler.
4. The resin composition according to claim 3 , wherein the filler comprises at least one selected from the group consisting of glass fibers, carbon powder, calcium carbonate, cellulose powder, and cellulose fibers.
5. The use of the rosin-based resin described in claim 1 as a modifier for thermoplastic resins is as follows: The thermoplastic resin comprises at least one selected from the group consisting of polyamide, polyphenylene ether, and polyolefin resin. Use of rosin-based resin.
6. The use according to claim 5 , wherein the thermoplastic resin further comprises a filler.
7. The use of the rosin-based resin according to claim 1 for producing a resin composition containing a thermoplastic resin , The thermoplastic resin comprises at least one selected from the group consisting of polyamide, polyphenylene ether, and polyolefin resin. Use of rosin-based resin.
8. The use according to claim 7 , wherein the resin composition further comprises a filler.

Description

This invention relates to modifiers for thermoplastic resins, resin compositions, and the use of rosin-based resins. Thermoplastic resins are used industrially in a wide range of fields, and among them, engineering plastics and super engineering plastics are widely used as automotive materials, electrical and electronic equipment materials, and housing and building materials due to their excellent balance of heat resistance and strength. On the other hand, because the above thermoplastic resins, especially engineering plastics and super engineering plastics, have high molding temperatures and poor melt fluidity, additives such as lubricants are usually added to the thermoplastic resin to reduce the apparent flow viscosity during melting and improve moldability (Patent Documents 1 and 2). Japanese Patent Publication No. 2012-009754Japanese Patent Publication No. 2004-137423 However, even when conventional lubricants are used with thermoplastic resins, the fluidity during melting is still insufficient, resulting in poor moldability. Furthermore, thermoplastic resins, especially engineering plastics and super engineering plastics, have high melting points of approximately 200°C or higher, and are melted at high temperatures (250°C or higher). Adding conventional lubricants can sometimes cause smoke to be generated during melting. Therefore, the present invention aims to provide a novel modifier for thermoplastic resins that can suppress smoke generation during the melting of thermoplastic resins and improve the moldability of thermoplastic resins. As a result of diligent research, the inventors have found that the above problem can be solved by a modifier for thermoplastic resins containing a rosin-based resin that has a high mass retention rate after heating at 300°C for 2 hours and has a specific mixed methylcyclohexaneaniline cloud point (MMAP). Furthermore, the present invention has been made to solve at least some of the above-mentioned problems and can be realized in the following embodiments or application examples. (Item 1) The mass residue rate after heating at 300°C for 2 hours is 40% by mass or more. The rosin-based resin contains a mixed methylcyclohexaneaniline cloud point (MMAP) of -10 to 20°C. Modifier for thermoplastic resins. (Item 2) A resin composition comprising the modifier and thermoplastic resin described in item 1. (Item 3) The resin composition according to item 2, wherein the thermoplastic resin comprises at least one selected from the group consisting of polyamide, polycarbonate, polyphenylene ether, and polyolefin resin. (Item 4) Furthermore, the resin composition according to item 2 or 3, further comprising a filler. (Item 5) The resin composition according to item 4, wherein the filler comprises at least one selected from the group consisting of glass fibers, carbon powder, calcium carbonate, cellulose powder, and cellulose fibers. (Item 6) Use of rosin-based resins as modifiers for thermoplastic resins, as described in item 1. (Item 7) The use described in item 6, wherein the thermoplastic resin further comprises a filler. (Item 8) Use of the rosin-based resin described in item 1 for producing a resin composition containing a thermoplastic resin. (Item 9) The use according to item 8, wherein the resin composition further comprises a filler. Throughout this disclosure, the ranges of numerical values such as physical properties and content may be set as appropriate (for example, by selecting from the values listed in each item below). Specifically, if the examples of numerical value α are A3, A2, and A1 (A3 > A2 > A1), the range of numerical value α may include, for example, A3 or less, A2 or less, less than A3, less than A2, A1 or more, A2 or more, greater than A1, greater than A2, A1 to A2 (A1 or more and A2 or less), A1 to A3, A2 to A3, A1 or more and less than A3, A1 or more and less than A2, A2 or more and less than A3, greater than A1 and less than A3, greater than A1 and less than A2, greater than A2 and less than A3, greater than A1 and A3 or less, greater than A1 and A2 or less, greater than A2 and A3 or less, etc. In this disclosure, "~" is used to mean that the numerical values listed before and after it are included as the lower and upper limits. The components and manufacturing methods of this disclosure will be described in detail below. [Modifier for thermoplastic resins] This disclosure relates to a modifier for thermoplastic resins (hereinafter also referred to as the modifier), which includes a rosin-based resin (hereinafter also referred to as the rosin-based resin) having a mass residue rate (hereinafter also referred to as mass residue rate) of 40% by mass or more after heating at 300°C for 2 hours, and a mixed methylcyclohexaneaniline cloud point (MMAP) (hereinafter also referred to as MMAP) of -10 to 20°C. The above-mentioned modifier, when used in thermoplastic resins, functions to improve the fluidity of the thermoplastic resin during melting (as a fluidity