JP-7856165-B2 - Multilayer ceramic capacitor

JP7856165B2JP 7856165 B2JP7856165 B2JP 7856165B2JP-7856165-B2

Inventors

西村亮

Assignees

株式会社村田製作所

Dates

Publication Date: 20260511
Application Date: 20230827
Priority Date: 20221004

Claims (16)

A ceramic body comprising multiple ceramic layers, multiple first internal electrodes, and multiple second internal electrodes stacked in the height direction, having a first main surface and a second main surface facing each other in the height direction, a first end surface and a second end surface facing each other in the length direction perpendicular to the height direction, and a first side surface and a second side surface facing each other in the width direction perpendicular to the height direction and the length direction, The ceramic body comprises a first external electrode and a second external electrode formed on its outer surface, The first internal electrode is drawn out to the first end face and electrically connected to the first external electrode. The multilayer ceramic capacitor is characterized in that the second internal electrode is drawn out to the second end face and electrically connected to the second external electrode, When viewing a cross-section parallel to the first and second sides, The first external electrode is formed in an L-shape on the first end face and the first main face, The second external electrode is formed in an L-shape on the second end face and the first main face, Multiple embossed holes are formed on the second main surface . The first main surface does not have the plurality of embossed holes formed on it. Multilayer ceramic capacitor.
The radius (R) of the ridge where the first main surface and the first end surface, second end surface, first side surface, and second side surface meet is, The radius of the ridge where the second main surface and the first end surface, the second end surface, the first side surface, and the second side surface meet is larger than the radius of the ridge. A multilayer ceramic capacitor as described in claim 1.
The radius (R) of the ridge where the first main surface and the first end surface, second end surface, first side surface, and second side surface meet is, It is between 1 μm and 10 μm. A multilayer ceramic capacitor according to claim 1 or 2.
The first external electrode and the second external electrode are, Substrate exterior electrode and Including at least one plated external electrode layer formed on the outside of the aforementioned underlayment external electrode, A multilayer ceramic capacitor according to claim 1 or 2.
The aforementioned external electrode for the substrate, A dummy internal electrode having a smaller length dimension than the first internal electrode and the second internal electrode, and exposed on the first main surface of the ceramic body, A multilayer ceramic capacitor as described in claim 4.
The dummy internal electrode, the first internal electrode, and the second internal electrode are formed of the same material. A multilayer ceramic capacitor as described in claim 5.
The dummy internal electrode is composed mainly of Ni, A multilayer ceramic capacitor as described in claim 5.
The aforementioned external electrode of the substrate is a thin film. A multilayer ceramic capacitor as described in claim 4.
The thin film is mainly composed of NiCr, A multilayer ceramic capacitor as described in claim 8.
The aforementioned plated external electrode layer It includes at least one selected from a Cu-plated external electrode layer, a Ni-plated external electrode layer, and an Au-plated external electrode layer. A multilayer ceramic capacitor as described in claim 4.
The aforementioned plated external electrode layer A Ni-plated external electrode layer formed on the outside of the aforementioned base external electrode, Including an Au-plated external electrode layer formed on the outside of the Ni-plated external electrode layer, A multilayer ceramic capacitor as described in claim 10.
The aforementioned plated external electrode layer The Cu plated outer electrode layer formed on the outside of the aforementioned base outer electrode, A Ni-plated external electrode layer formed on the outside of the Cu-plated external electrode layer, Including an Au-plated external electrode layer formed on the outside of the Ni-plated external electrode layer, A multilayer ceramic capacitor as described in claim 10.
The Ni-plated external electrode layer contains P, A multilayer ceramic capacitor as described in claim 10.
The Cu-plated external electrode layer contains Ni, A multilayer ceramic capacitor as described in claim 10.
The lengthwise dimension and the widthwise dimension are 1.0 mm or less, and the other is 0.5 mm or less. A multilayer ceramic capacitor according to claim 1 or 2.
The aforementioned height dimension is 0.1 mm or less. A multilayer ceramic capacitor according to claim 1 or 2.

Description

This invention relates to a multilayer ceramic capacitor. Multilayer ceramic capacitors are widely used in various devices, including electronic and electrical equipment (hereinafter referred to as "electronic devices, etc."). For example, Patent Document 1 (Japanese Patent Application Publication No. 2000-100647) discloses a multilayer ceramic capacitor with a typical structure. Recently, electronic devices have been rapidly becoming smaller and more sophisticated. This miniaturization has resulted in extremely small internal volumes (spatial volumes) for housing electronic circuits composed of electronic components. Furthermore, the increased functionality of electronic devices has led to a dramatic increase in the number of electronic components required to form electronic circuits. Therefore, with the miniaturization and increased functionality of electronic devices, there is a demand for miniaturization of electronic components that make up electronic circuits. For example, in the case of multilayer ceramic capacitors, extremely thin products with a ceramic base thickness of several tens of micrometers have been put into practical use. Japanese Patent Publication No. 2000-100647 Figures 1(A) and 1(B) are perspective views of a multilayer ceramic capacitor 100 according to the first embodiment, with Figure 1(A) showing the multilayer ceramic capacitor 100 from the first main surface 1A side and Figure 1(B) showing the multilayer ceramic capacitor 100 from the second main surface 1B side.This is a cross-sectional view of the multilayer ceramic capacitor 100, showing the cross-section of the X-X portion indicated by the dashed-dotted arrow in Figure 1(A).This is a cross-sectional view of the main part of the multilayer ceramic capacitor 100.Figures 4(A) to 4(D) are explanatory diagrams showing the steps in an example of a manufacturing method for a multilayer ceramic capacitor 100.Figures 5(E) to 5(J) are a continuation of Figure 4(D) and are explanatory diagrams showing the steps in an example of a manufacturing method for a multilayer ceramic capacitor 100.This is a cross-sectional view of a multilayer ceramic capacitor 200 according to a second embodiment.Figures 7(A) to 7(D) are explanatory diagrams showing the steps in an example of a manufacturing method for a multilayer ceramic capacitor 200.Figures 8(E) to 8(I) are a continuation of Figure 7(D) and are explanatory diagrams showing the steps in an example of a manufacturing method for a multilayer ceramic capacitor 200. The following describes embodiments for carrying out the present invention, along with the drawings. Furthermore, each embodiment is illustrative in illustrating embodiments of the present invention, and the present invention is not limited to the contents of these embodiments. It is also possible to combine the contents described in different embodiments, and such implementations are also included in the present invention. Additionally, the drawings are intended to aid in understanding the specification and may be schematic representations; the proportions of the dimensions of the depicted components or between components may not match the proportions of those dimensions described in the specification. Furthermore, components described in the specification may be omitted in the drawings, or their quantities may be omitted. [First Embodiment] Figures 1(A), 1(B), 2, and 3 show a multilayer ceramic capacitor 100 according to the first embodiment, respectively. However, Figures 1(A) and 1(B) are perspective views of the multilayer ceramic capacitor 100, with Figure 1(A) showing the capacitor from the first main surface 1A side and Figure 1(B) showing the capacitor from the second main surface 1B side. Figure 2 is a cross-sectional view of the multilayer ceramic capacitor 100, showing the cross-section of the X-X portion indicated by the dashed-dotted arrow in Figure 1(A). Figure 3 is a cross-sectional view of the main part of the multilayer ceramic capacitor 100. The drawings show the height direction T, length direction L, and width direction W of the multilayer ceramic capacitor 100, and these directions may be referred to in the following description. In this embodiment, the stacking direction of the ceramic layer 1a, which will be described later, is defined as the height direction T of the multilayer ceramic capacitor 100. The multilayer ceramic capacitor 100 comprises a ceramic element 1. The ceramic element 1 is a rectangular parallelepiped and has a first main surface 1A and a second main surface 1B facing each other in the height direction T, a first end surface 1C and a second end surface 1D facing each other in the length direction L, and a first side surface 1E and a second side surface 1F facing each other in the width direction W. The dimensions of the ceramic body 1 are arbitrary, but it is preferable that, for example, one of the dimensions in the length direction L and the width direction W is 1.0 mm or less, and the o