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JP-7856180-B2 - resin composition

JP7856180B2JP 7856180 B2JP7856180 B2JP 7856180B2JP-7856180-B2

Inventors

  • 奥山 英恵

Assignees

  • 味の素株式会社

Dates

Publication Date
20260511
Application Date
20250225

Claims (14)

  1. (A) epoxy resin, (B) inorganic filler, and (C) elastomer, (A) The epoxy resin includes (A-1) an epoxy resin containing an epoxy group and a structure having chelating ability, (A) The amount of component is 10% by mass or more and 50% by mass or less, relative to 100% by mass of the resin component of the resin composition. (B) The amount of component is 60% by mass or more and 95% by mass or less, relative to 100% by mass of the nonvolatile components of the resin composition. The amount of component (C) is 1% by mass or more and 20% by mass or less, relative to 100% by mass of the nonvolatile components of the resin composition. (C) A resin composition in which the elastomer is selected from the group consisting of resins containing a polybutadiene structure, and resins containing an imide structure, a urethane structure, and a polycarbonate structure in the molecule.
  2. The resin composition according to claim 1, wherein the chelate modification amount of component (A-1) is 0.3% to 10% by mass.
  3. The resin composition according to claim 1 or 2, wherein the ratio W(A-1)/W(C) of the mass of component (A-1) to the mass of component (C) is 0.01 to 1.0.
  4. The resin composition according to any one of claims 1 to 3, wherein the amount of component (A-1) is 0.1% by mass or more and 40% by mass or less, relative to 100% by mass of the resin components of the resin composition.
  5. The resin composition according to any one of claims 1 to 4, wherein component (C) has a number average molecular weight of 1000 or more.
  6. (D) The resin composition according to any one of claims 1 to 5, further comprising a curing agent.
  7. (E) The resin composition according to any one of claims 1 to 6, further comprising a curing accelerator.
  8. A resin composition for use as a sealing layer, according to any one of claims 1 to 7.
  9. A resin composition according to any one of claims 1 to 8, having a minimum melt viscosity of 9000 poise or less.
  10. A cured product of the resin composition according to any one of claims 1 to 9.
  11. A resin sheet comprising a support and a resin composition layer formed on the support, the resin composition layer comprising the resin composition according to any one of claims 1 to 9.
  12. A circuit board comprising a cured product of the resin composition described in any one of claims 1 to 9.
  13. A semiconductor chip package comprising a cured product of the resin composition described in any one of claims 1 to 9.
  14. A semiconductor device comprising the circuit board described in claim 12 or the semiconductor chip package described in claim 13.

Description

This invention relates to a resin composition, and to cured products, resin sheets, circuit boards, semiconductor chip packages, and semiconductor devices using the resin composition. In recent years, demand for small, high-performance electronic devices such as smartphones and tablet devices has increased, and consequently, there is a growing need for even higher performance encapsulants for semiconductor chip packages used in these small electronic devices. One such encapsulant known to be formed by curing a resin composition is one such example. On the other hand, as technologies for applications different from sealing materials, there are the technologies described in Patent Documents 1 and 2. Japanese Patent Publication No. 2018-80221Patent No. 5491276 Figure 1 is a schematic cross-sectional view showing a fan-out type WLP as an example of a semiconductor chip package according to one embodiment of the present invention. The present invention will be described below with reference to embodiments and examples. However, the present invention is not limited to the embodiments and examples shown below, and may be implemented with modifications as appropriate without departing from the scope of the claims and their equivalents. [1. Overview of the resin composition] A resin composition according to one embodiment of the present invention comprises (A) an epoxy resin, (B) an inorganic filler, and (C) an elastomer in combination. The epoxy resin (A) includes an epoxy resin containing (A-1) epoxy groups and a structure having chelating ability. In the following description, "(A-1) epoxy resin containing epoxy groups and a structure having chelating ability" may be referred to as "(A-1) chelate-type epoxy resin." Also, in the following description, "a structure having chelating ability" may be referred to as "chelate-capable structure." The resin composition according to this embodiment can be cured by heat curing. The resulting cured product exhibits excellent warp suppression and adhesion to the conductive layer. Furthermore, the cured product of the resin composition according to this embodiment typically exhibits excellent adhesion to silicon. Moreover, the resin composition according to this embodiment preferably has a low minimum melt viscosity, and it is preferable to obtain a cured product with a low tensile modulus. The resin composition according to this embodiment may further contain any components in combination with the components described above. For example, the resin composition may contain (D) a curing agent, (E) a curing accelerator, etc. [2. (A) Epoxy resin] The resin composition according to this embodiment includes (A) epoxy resin as component (A). (A) epoxy resin is a curable resin having epoxy groups. The epoxy resin (A) according to this embodiment includes a chelate-type epoxy resin (A-1) as component (A-1). The chelate-type epoxy resin (A-1) contains epoxy groups and a chelating structure. A chelating structure represents a structure that has the ability to form chelates. This chelating structure usually contains at least one atom selected from the group consisting of oxygen and nitrogen. In the following description, atoms selected from the group consisting of oxygen and nitrogen may be referred to as "specific atoms." A single chelating structure usually contains multiple specific atoms. Since the multiple specific atoms are generally not directly bonded, there are molecular chains that link these specific atoms together. That is, specific atoms are usually linked to each other by molecular chains. Here, the atoms included in the molecular chains do not include oxygen atoms and nitrogen atoms. The number of atoms in the molecular chains is usually one or more, preferably two or more, and preferably six or less. Here, the number of atoms in the molecular chains that link the specific atoms together represents the minimum number of atoms between the specific atoms linked by the molecular chains. Therefore, even if branched chains are bonded to the molecular chain, the number of atoms included in those branched chains is not included in the number of atoms in the molecular chain. Therefore, the chelating structure may preferably be a structure containing adjacent specific atoms via 1 to 6 atoms, more preferably 2 to 6 atoms. In this chelating structure, some or all of the specific atoms may function as coordination atoms. The chelating structure preferably contains an oxygen atom as a specific atom. It is more preferable that at least one of the oxygen atoms designated as specific atoms originates from a hydroxyl group. That is, it is more preferable that the chelating structure contains a hydroxyl group, and that the oxygen atom contained in that hydroxyl group is the specific atom of the chelating structure. Furthermore, it is more preferable that at least one of the oxygen atoms designated as specific atoms originates from a carbonyl group. That is, it is more preferable that the che