JP-7856211-B2 - Photosensitive resin composition, photosensitive element, cured product, method for forming resist patterns, and method for manufacturing printed circuit boards.

JP7856211B2JP 7856211 B2JP7856211 B2JP 7856211B2JP-7856211-B2

Inventors

田中志歩
小野敬司
成田真生
武田明子

Assignees

株式会社レゾナック

Dates

Publication Date: 20260511
Application Date: 20240301
Priority Date: 20230310

Claims (16)

(A) a binder polymer, (B) a photopolymerizable compound having at least one ethylenically unsaturated bond, and (C) a photopolymerization initiator, The (C) photopolymerization initiator comprises an oxime ester-based photopolymerization initiator, The content of the oxime ester-based photopolymerization initiator is 0.3 parts by mass or more with respect to 100 parts by mass of the total of the binder polymer (A) and the photopolymerizable compound (B). The (A) binder polymer has structural units derived from (meth)acrylic acid, structural units derived from benzyl (meth)acrylate or a benzyl (meth)acrylate derivative, and structural units derived from styrene or a styrene derivative. A photosensitive resin composition in which the content of structural units derived from styrene or styrene derivatives is 45% by mass or more based on the total solid content of the binder polymer (A) .
The photosensitive resin composition according to claim 1, wherein the (C) photopolymerization initiator consists solely of the oxime ester-based photopolymerization initiator.
The photosensitive resin composition according to claim 1, wherein the oxime ester-based photopolymerization initiator comprises a compound having a carbazole structure.
The photosensitive resin composition according to claim 1, wherein the oxime ester-based photopolymerization initiator comprises a compound having a phenyl sulfide structure.
The photosensitive resin composition according to claim 1, wherein the oxime ester-based photopolymerization initiator comprises a compound having a fluorene structure.
The photosensitive resin composition according to claim 1, wherein the content of the oxime ester-based photopolymerization initiator is 3.0 parts by mass or less per 100 parts by mass of the total of the binder polymer (A) and the photopolymerizable compound (B).
A photosensitive resin composition according to claim 1, used in a direct drawing method.
The photosensitive resin composition according to claim 1, wherein the (B) photopolymerizable compound comprises a bisphenol A type (meth)acrylate compound.
The photosensitive resin composition according to claim 1, wherein the amount of dye is less than 0.5% by mass based on the total amount of solids in the photosensitive resin composition, and the dye is a dye or a pigment.
The device comprises a support and a photosensitive resin layer disposed on the support, A photosensitive element wherein the photosensitive resin layer comprises a photosensitive resin composition or a cured product thereof according to any one of claims 1 to 9 .
A cured product of the photosensitive resin composition according to any one of claims 1 to 9 .
A cured product according to claim 11 , which is a resist pattern.
A step of forming a photosensitive resin layer on a substrate using the photosensitive resin composition described in any one of claims 1 to 9 , A step of curing the photosensitive resin layer by irradiating at least a portion of the photosensitive resin layer with active light, A method for forming a resist pattern, comprising the step of removing the uncured portion of the photosensitive resin layer from the substrate to form a resist pattern.
A step of forming a photosensitive resin layer on a substrate using the photosensitive element described in claim 10 , A step of curing the photosensitive resin layer by irradiating at least a portion of the photosensitive resin layer with active light, A method for forming a resist pattern, comprising the step of removing the uncured portion of the photosensitive resin layer from the substrate to form a resist pattern.
A step of forming a resist pattern on the substrate by the resist pattern formation method described in claim 13 , A method for manufacturing a printed wiring board, comprising the steps of applying a plating treatment or an etching treatment to the substrate and the member having the resist pattern.
A step of forming a resist pattern on the substrate by the resist pattern formation method described in claim 14 , A method for manufacturing a printed wiring board, comprising the steps of applying a plating treatment or an etching treatment to the substrate and the member having the resist pattern.

Description

This disclosure relates to a photosensitive resin composition, a photosensitive element, a cured product, a method for forming a resist pattern, and a method for manufacturing a printed circuit board. In the field of printed circuit board manufacturing, photosensitive elements comprising a layer formed on a support using a photosensitive resin composition (hereinafter referred to as the "photosensitive resin layer") are widely used as resist materials for etching or plating processes. Conventionally, printed circuit boards have been manufactured using, for example, the above-mentioned photosensitive element by the following procedure. Specifically, first, the photosensitive resin layer of the photosensitive element is laminated onto a circuit-forming substrate (such as a copper-clad laminate). At this time, the photosensitive resin layer is laminated so that it adheres closely to the surface of the circuit-forming substrate where the conductor pattern (circuit) is formed. Furthermore, the lamination is performed by heat-pressing the photosensitive resin layer onto the underlying circuit-forming substrate (atmospheric pressure lamination method). Next, a desired area of the photosensitive resin layer is exposed via a mask film or the like (mask exposure method). At this time, the support (support film, etc.) is peeled off either before or after exposure. Then, the unexposed parts of the photosensitive resin layer are dissolved or dispersed and removed with a developer to form a resist pattern consisting of the cured portion of the photosensitive resin layer. Next, an etching or plating process is performed to form a conductive pattern, and finally the resist pattern is peeled off and removed. Incidentally, regarding the pattern exposure techniques mentioned above, a direct drawing method (such as the LDI (Laser Direct Imaging) method) that does not require a mask film and directly draws circuit data created with CAD using laser light is becoming increasingly widespread. Direct lithography (LDI) methods offer many advantages, including reduced mask film costs due to the elimination of mask film, high accuracy in aligning resist openings, easy scaling correction, and the elimination of the need to manage foreign matter, dirt, and scratches on the mask. As a photosensitive resin composition that can be used in such a direct drawing method, for example, a photosensitive resin composition containing a specific binder polymer and a specific photopolymerization initiator has been proposed (see, for example, Patent Documents 1 and 2 below). Japanese Patent Publication No. 2010-217400International Publication No. 2012/014580Japanese Patent Application Publication No. 11-327137 This is a schematic cross-sectional view showing a photosensitive element according to one embodiment of the present disclosure.This is a schematic perspective view illustrating an example of the manufacturing process for printed circuit boards using the semi-additive method. The embodiments of this disclosure will be described in detail below. It should be understood that other embodiments may be considered and created without departing from the scope and spirit of this disclosure. Therefore, the following description of "Modes for Carrying Out the Invention" should not be understood as limiting. In this specification, the term "process" includes not only independent processes but also processes that are not clearly distinguishable from other processes, as long as the intended function of the process is achieved. Numerical ranges indicated using "~" indicate a range that includes the numbers before and after "~" as the minimum and maximum values, respectively. In numerical ranges described stepwise in this specification, the upper or lower limit of a numerical range in one step may be replaced with the upper or lower limit of a numerical range in another step. In numerical ranges described in this specification, the upper or lower limit of a numerical range may be replaced with the values shown in the examples. The term "layer" includes not only structures formed on the entire surface when observed as a plan view, but also structures formed on only a part of it. "(meth)acrylic acid" means at least one of "acrylic acid" and its corresponding "methacrylic acid." The same applies to other similar expressions such as (meth)acrylate. In this specification, when referring to the amount of each component in a composition, if there are multiple substances corresponding to each component in the composition, unless otherwise specified, it refers to the total amount of those multiple substances present in the composition. In this specification, "room temperature" refers to 25°C. In this specification, "solids" refers to the non-volatile content in a photosensitive resin composition, excluding volatile substances (water, solvents, etc.). That is, it refers to components other than solvents such as water and organic solvents that remain without volatilizin