JP-7856275-B1 - Sheet-type sintered bonding material

Abstract

The present invention relates to a sheet-like sintered bonding material having a metal layer made of a plate-like or foil-like metal and a tacky adhesive layer containing metal nanoparticles and a solvent on both sides of the metal layer, wherein the metal nanoparticles are composite metal nanoparticles in which an organic coating layer made of one or more aliphatic carboxylic acids having 1 to 10 or 12 carbon atoms is formed around a metal nucleus with an average particle size of 1 to 200 nm, which is made up of aggregates of metal atoms; a joint formed by joining the sheet-like sintered bonding material and a bonding member; and electrical equipment, electronic equipment, semiconductor components, or heat dissipation components using the said joint.

Inventors

• 熊谷 圭祐
• 武田 光市
• 深江 信邦
• 宮原 香織

Assignees

• 株式会社日本スペリア社
• 株式会社巴川コーポレーション

Dates

Publication Date

20260511

Application Date

20250701

Priority Date

20240701

Claims (8)

1. A metal layer consisting of a plate-shaped or foil-shaped metal, The metal layer has a tacky adhesive layer on both sides containing metal nanoparticles and a solvent. The aforementioned solvent contains one or more polyols, including isobornylcyclohexanol, terpene ( Tersolve THA90 (trade name)) , triethanolamine, polyethylene glycol, styrene-acrylonitrile copolymer, or fine particles of polyurea, as a high-viscosity solvent. A sheet-like sintered bonding material characterized in that the metal nanoparticles are composite metal nanoparticles in which an organic coating layer made of one or more aliphatic carboxylic acids having 1 to 10 or 12 carbon atoms is formed around a metal nucleus with an average particle size of 1 to 200 nm, which is made up of an aggregate of metal atoms.
2. The sheet-like sintered bonding material according to claim 1 , wherein the content of the highly viscous solvent in the adhesive layer is 0.1 to 20.0% by mass.
3. The sheet-like sintered bonding material according to claim 1 or 2, wherein the thickness of the metal layer is 10 to 1000 μm, and the thickness of the adhesive layer is 20 to 100 μm.
4. The sheet-like sintered bonding material according to claim 1 or 2, wherein the metal atoms constituting the metal nanoparticles are individual metals consisting of copper, gold, platinum, palladium, or silver, or composites thereof.
5. The sheet-like sintered bonding material according to claim 1 or 2, wherein the adhesive layers on both sides of the metal layer allow the bonding member to be fixed after mounting it to the sheet-like sintered bonding material.
6. The sheet-like sintered bonding material according to claim 1 or 2, wherein the adhesive layer comprises metal nanoparticles, a filler, a solvent, and a dispersant.
7. The sheet-like sintered bonding material according to claim 1 or 2, wherein one or both sides of the metal layer are surface-treated with one or more elements selected from the group consisting of copper, gold, silver, platinum, or palladium, or a composite thereof.
8. A joint formed by joining a sheet-like sintered bonding material and a bonding member according to claim 1 or 2, or an electrical device, electronic device, semiconductor component, or heat dissipation component using said joint.

Description

The present invention relates to a sheet-like sintered bonding material and to electrical equipment, electronic equipment, semiconductor components, and heat dissipation components using the sheet-like sintered bonding material. In the manufacturing of semiconductor modules such as power control units installed in xEVs (electric vehicles), hybrid electric vehicles, plug-in hybrid electric vehicles, and fuel cell vehicles, a method is known for joining semiconductor chips and heat dissipation components to lead frames and insulating circuit boards. This method involves placing a sheet-form bonding material, rather than a paste, between the substrate and the semiconductor chip or heat dissipation component, and then sintering the bond. This method is known because it eliminates the need for a printing process and facilitates bonding, regardless of the size of the semiconductor chip or heat dissipation component. As an example of the bonding material, a heat bonding material (Patent Document 1) is known, which comprises a metal layer formed from a bulk metal material and a metal bonding layer laminated on both sides of the metal layer by coating or supporting, wherein the bulk material is an elemental metal selected from copper, silver, gold, platinum, and palladium, or an alloy composed of at least two or more elements selected from copper, silver, platinum, and palladium, the bulk material is a foil, a metal mesh, or a porous metal body, and the metal layer is coated with a polymer dispersant and formed into a film by forming a dispersion solution in which at least one elemental metal fine particle selected from the group consisting of elemental metals, alloys, and metal compounds is dispersed in an organic solvent, and the average primary particle size of the metal fine particle is 5 to 500 nm. Patent No. 6851810 In Test Example 3, the sample that underwent the temporary bonding process in Test Example 1 was fired to bond it, then embedded in resin, polished, and the resulting SEM image shows the results of observing the bonded cross-section. The sheet-like sintered bonding material of the present invention comprises a metal layer made of a plate-shaped or foil-shaped metal, The bonding material has a tacky adhesive layer containing metal nanoparticles and a solvent on both sides of the aforementioned metal layer. The plate-like or foil-like metal constituting the aforementioned metal layer refers to a metal member with a thickness of 10 μm or more. While it is preferable for the plate-shaped or foil-shaped metal to have a uniform thickness, it is not required to have a uniform thickness. Furthermore, the plate-shaped or foil-shaped metal may have holes, such as those in punched metal, as needed. If holes are present or if it is a mesh, there are no restrictions on the size or number of holes within the scope of achieving the effects of the present invention, and in the case of a mesh, there are no restrictions on the thickness of the metal wire or the size of the openings of the mesh. The foil-shaped or plate-shaped metal does not need to be solid; depending on the application, it may be made by weaving wire-shaped metal or by thinning short metal fibers. In the present invention, from the viewpoint of bonding reliability and workability, the thickness of the metal layer is preferably 10 to 1000 μm, more preferably 10 to 100 μm, even more preferably 20 to 70 μm, and particularly preferably 20 to 50 μm. The area of the metal layer can be adjusted as appropriate according to the required area of the components for joining in electrical equipment, electronic equipment, semiconductor components, heat dissipation components, etc., and there are no particular limitations. Examples of materials for the metal layer include iron, copper, silver, gold, aluminum, nickel, platinum, palladium, and alloys consisting of two or more of these, as well as stainless steel, but there are no particular limitations. Furthermore, one or both sides of the metal layer may be surface-treated with one or more of the following: copper, gold, silver, platinum, or palladium, or a composite thereof. Examples of the aforementioned surface treatments include dry plating such as physical vapor deposition (PVD) and chemical vapor deposition (CVD), wet plating such as electroplating and electroless plating, chemical conversion treatment (fermite) and anodizing treatment (anodizing), hot-dip galvanizing, and sputtering, and can be appropriately selected within the range that provides the effects of the present invention. There are no particular limitations on the combination of the metals that make up the metal layer and the metals that make up the thin film formed by the surface treatment. Furthermore, there are no particular limitations on the thickness of the thin film. In this invention, layers of a desired thickness (adhesive layers) are formed on both sides of the metal layer. When the surface of this adhesive layer is brought into cont