JP-7856288-B2 - Resin encapsulation apparatus and resin encapsulation method

Inventors

• 中山 栄二
• 高橋 晴久

Assignees

• ヤマハロボティクス株式会社

Dates

Publication Date

20260511

Application Date

20220204

Claims (6)

1. A resin encapsulation method for processing a workpiece into a molded product by encapsulating it with resin using an encapsulation die comprising an upper mold and a lower mold, The temperature of the sealing mold, which is set to a temperature at which the resin is properly heat-cured during sealing, is set as the normal setting temperature, and the temperature of the sealing mold, which is set to a predetermined temperature higher than the normal setting temperature, is set as the switching setting temperature. During a unit process in which the workpiece and the resin are loaded into the sealing mold and sealed, and then the molded product is discharged, the temperature of the sealing mold is controlled by changing the set temperature of at least one of the upper mold and the lower mold from the normal set temperature to the switching set temperature at a predetermined start timing, and by changing the set temperature from the switching set temperature to the normal set temperature at a predetermined end timing . The aforementioned termination timing is before the workpiece and the resin in the next unit process are transported to the sealing mold. The aforementioned normal setting temperature is a temperature equal to or greater than the melting temperature of the resin. A resin encapsulation method characterized by the following.
2. The resin sealing method according to claim 1, characterized in that the start timing is set to the point in time when the resin is set in a predetermined position in the sealing mold.
3. The resin sealing method according to claim 1, characterized in that the predetermined temperature is set to a temperature selected from the range of 1°C to 20°C.
4. The switching temperature is configured such that the temperature set in the upper mold is set as the first switching temperature, and the temperature set in the lower mold is set as the second switching temperature. The resin encapsulation method according to claim 1, characterized in that the first switching setting temperature is set to a temperature higher than the second switching setting temperature.
5. The aforementioned start timing is configured such that the setting timing in the upper mold is set as the first start timing, and the setting timing in the lower mold is set as the second start timing. The aforementioned termination timing is configured such that the setting timing in the upper mold is set as the first termination timing, and the setting timing in the lower mold is set as the second termination timing. The resin encapsulation method according to claim 1, characterized in that the time from the first start timing to the first end timing is set to be longer than the time from the second start timing to the second end timing.
6. A resin sealing apparatus that processes a workpiece into a molded product by sealing it with resin using a sealing die comprising an upper mold and a lower mold, The system includes a control unit that controls the temperature of the sealing mold, The control unit, The temperature of the sealing mold, which is set to a temperature at which the resin is properly heat-cured during sealing, is set as the normal setting temperature, and the temperature of the sealing mold, which is set to a predetermined temperature higher than the normal setting temperature, is set as the switching setting temperature. During a unit process in which the workpiece and the resin are loaded into the sealing mold and sealed, and then the molded product is discharged, the temperature of the sealing mold is controlled by changing the set temperature of at least one of the upper mold and the lower mold from the normal set temperature to the switching set temperature at a predetermined start timing, and by changing the set temperature from the switching set temperature to the normal set temperature at a predetermined end timing . The termination timing is controlled to occur before the workpiece and resin are transported to the sealing mold in the next unit process. The aforementioned normal setting temperature is set to a temperature equal to or higher than the melting temperature of the resin. A resin encapsulation device characterized by the following.

Description

This invention relates to a resin encapsulation apparatus and a resin encapsulation method. Examples of resin encapsulation apparatuses and methods for processing molded products by encapsulating workpieces with electronic components mounted on a substrate using a encapsulating resin (hereinafter sometimes simply referred to as "resin") include transfer molding and compression molding methods. The transfer molding method is a technique for resin sealing by supplying a predetermined amount of resin to two sealing regions (cavities) in an upper and lower mold of a sealing die, placing the workpiece at a position corresponding to each sealing region, clamping it with the upper and lower molds, and pouring the resin from the pot into the cavity (see Patent Document 1: Japanese Patent Application Publication No. 2020-102601). The compression molding method is another technique for resin sealing by supplying a predetermined amount of resin to a sealing region (cavity) in an upper and lower mold, placing the workpiece in the sealing region, and clamping it with the upper and lower molds. For example, when using a sealing die with a cavity in the upper mold, techniques are known for supplying resin to the center position on the workpiece in a single operation. On the other hand, when using a sealing die with a cavity in the lower mold, techniques are known for supplying a film covering the mold surface including the cavity and resin for molding. Japanese Patent Publication No. 2020-102601 This is a plan view showing an example of a resin encapsulation apparatus according to an embodiment of the present invention.This is a side view taken at the position of line II-II in Figure 1.Figure 1 is a front cross-sectional view showing an example of a sealing mold for a resin sealing device.This graph shows the temperature decrease trend of the lower mold according to embodiments of the present invention and conventional embodiments.This graph shows the temperature decrease trend of the upper mold according to embodiments of the present invention and conventional embodiments. The embodiments of the present invention will be described in detail below with reference to the drawings. Figure 1 is a plan view (schematic diagram) showing an example of a sealing mold 202 and a resin sealing apparatus 1 equipped with the sealing mold 202 according to an embodiment of the present invention. Figure 2 is a side view taken along the line II-II in Figure 1 (some mechanisms are not shown). For convenience of explanation, arrows may be used in the figures to indicate the front/back, left/right, and up/down directions in the resin sealing apparatus 1. In addition, in all figures used to explain each embodiment, components having the same function are denoted by the same reference numerals, and repeated explanations may be omitted. The resin encapsulation apparatus 1 according to this embodiment is an apparatus for resin encapsulating a workpiece (molded product) W using an encapsulation mold 202 comprising an upper mold 204 and a lower mold 206. Hereinafter, the resin encapsulation apparatus and method will be described using a transfer molding method as an example, in which the workpiece W is held by the lower mold 206, and a cavity 208 (partially including the mold surface 204a) provided in the upper mold 204 in a corresponding arrangement is covered with a release film (hereinafter sometimes simply referred to as "film") F, and a clamping operation is performed between the upper mold 204 and the lower mold 206 to encapsulate the workpiece W with resin R. However, the apparatus is not limited to this, and the cavity 208 may be provided only in the upper mold 204, or in both the lower mold 206 and the upper mold 204. Furthermore, the film F is not essential. First, the workpiece W to be molded has a configuration in which one or more electronic components Wb are mounted on a base material Wa in a predetermined arrangement. More specifically, examples of the base material Wa include rectangular, circular, or other rectangular resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, wafers, and other plate-shaped members. Examples of electronic components Wb include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive members, spacers, and combinations thereof. However, the material is not limited to these. Examples of methods for mounting electronic components Wb onto a substrate Wa include wire bonding and flip-chip mounting. Alternatively, in configurations where the substrate (glass or metal carrier plate) Wa is peeled off the molded product Wp after resin encapsulation, the electronic components Wb can be attached using heat-release adhesive tape or UV-curable resin that hardens upon UV irradiation. On the other hand, as an example of resin R, a tablet-shaped (for example, cylindrical) thermosetting resin (e.g., an epoxy resin containing fillers) is used. However, resin R is not limited