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JP-7856300-B2 - Resin encapsulation device

JP7856300B2JP 7856300 B2JP7856300 B2JP 7856300B2JP-7856300-B2

Inventors

  • 藤沢 雅彦

Assignees

  • ヤマハロボティクス株式会社

Dates

Publication Date
20260511
Application Date
20220531

Claims (4)

  1. A resin sealing apparatus that uses a sealing die comprising an upper mold and a lower mold to process a workpiece into a molded product by sealing it with resin, The system includes a press device for closing and opening the upper and lower molds, The press apparatus comprises a fixed platen to which one of the upper and lower dies is fixed, a movable platen to which the other is fixed, a tie bar that fixes the fixed platen and holds the movable platen so that it can be raised and lowered, and a drive device for raising and lowering the movable platen. The fixed platen has a fixing portion on the first surface side of the main body that is fixed to the tie bar, and a bell-shaped portion on the second surface side facing the opposite direction from the first surface, and one of the upper mold and the lower mold is fixed to the bell-shaped portion. The main body and the bell-shaped portion are integrally formed by casting, and a central hole is provided at the radial center, drilled in the direction from the first surface toward the second surface. The central hole is formed so as not to penetrate to the mold fixing surface in the bell-shaped portion. There is one opening corresponding to the aforementioned central hole. A resin encapsulation device characterized by the following.
  2. The resin sealing device according to claim 1, characterized in that a circumferential recess is provided between the main body and the bell-shaped portion, with the recess being drilled toward the radial center.
  3. The resin sealing apparatus according to claim 2, characterized in that the recess is formed such that, in both the left-right and front-back directions, the innermost part in the radial direction is located closer to the center in the radial direction than the outer circumference of one of the upper molds or the lower molds.
  4. The aforementioned fixing part is provided at the tip of the arm portion that extends radially from the four corners of the main body. The resin sealing apparatus according to claim 1, characterized in that the arm portion is configured as a deflection generating portion that generates a relatively larger deflection than other parts by concentrating stress when the mold closing is performed.

Description

This invention relates to a resin encapsulation device. Examples of resin encapsulation equipment that processes a workpiece with electronic components mounted on a substrate into a molded product by encapsulating it with a encapsulating resin (hereinafter sometimes simply referred to as "resin") include transfer molding and compression molding methods. Transfer molding is a technique for resin sealing by supplying a predetermined amount of resin to two sealing regions (cavities) in an upper and lower mold of a sealing mold. The workpiece is placed at a position corresponding to each sealing region, clamped between the upper and lower molds, and the resin is poured from the pot into the cavity. Compression molding is another technique for resin sealing, where a predetermined amount of resin is supplied to a sealing region (cavity) in an upper and lower mold, the workpiece is placed in the sealing region, and the workpiece is clamped between the upper and lower molds. For example, when using a sealing mold with a cavity in the upper mold, techniques are known for supplying resin to the center of the workpiece in a single operation. On the other hand, when using a sealing mold with a cavity in the lower mold, techniques are known for supplying a film covering the mold surface including the cavity, along with resin, for molding. In either method, a press device, as exemplified in Patent Document 1 (Japanese Patent Application Publication No. 2008-093987), is provided, that is, a mechanism for sealing the workpiece with resin by closing (clamping) the sealing molds (upper and lower molds). Japanese Patent Publication No. 2008-093987Japanese Patent Publication No. 2004-042356Japanese Patent Publication No. 2009-148933 This is a plan view showing an example of a resin encapsulation apparatus according to an embodiment of the present invention.Figure 1 is a front cross-sectional view showing an example of a press device for a resin encapsulation apparatus.Figure 1 is a front cross-sectional view showing an example of a sealing mold for a resin sealing device.Figure 1 is a perspective view showing an example of a fixed platen in a resin encapsulation device.Figure 4 is a plan view showing an example of a fixed platen.Figure 4 is a front view showing an example of a fixed platen.This is a cross-sectional view taken along the line VII-VII in Figure 4. (Overall structure) Embodiments of the present invention will be described in detail below with reference to the drawings. Figure 1 is a plan view (schematic diagram) showing an example of a resin encapsulation device 1 according to this embodiment. For convenience of explanation, arrows in the figure indicate the left-right direction (X direction), front-back direction (Y direction), and up-down direction (Z direction) of the resin encapsulation device 1. In addition, in all figures used to explain each embodiment, the same reference numerals are used for components having the same function, and repeated explanations may be omitted. The resin encapsulation apparatus 1 according to this embodiment is a device that encapsulates a workpiece (molded product) W with resin using an encapsulation mold 202 comprising an upper mold 204 and a lower mold 206. Hereinafter, as an example of the resin encapsulation apparatus 1, a compression molding apparatus will be described in which the workpiece W is held by the lower mold 206, the cavity 208 (including a portion of the mold surface) provided in the upper mold 204 is covered with a release film (hereinafter sometimes simply referred to as "film") F, and a clamping operation is performed between the upper mold 204 and the lower mold 206 to encapsulate the workpiece W with resin. However, the apparatus is not limited to this. First, the workpiece W to be molded has a configuration in which multiple electronic components Wb are mounted in a matrix on a base material Wa. More specifically, examples of the base material Wa include rectangular, circular, or other rectangular resin substrates, ceramic substrates, metal substrates, carrier plates, lead frames, wafers, and other plate-like members. Examples of electronic components Wb include semiconductor chips, MEMS chips, passive elements, heat sinks, conductive members, spacers, etc. However, the material is not limited to these examples. Examples of methods for mounting electronic components Wb onto a substrate Wa include wire bonding and flip-chip mounting. Alternatively, in configurations where the substrate (glass or metal carrier plate) Wa is peeled off the molded product Wp after resin encapsulation, the electronic components Wb can be attached using heat-release adhesive tape or UV-curable resin that hardens upon UV irradiation. On the other hand, as an example of a resin, a liquid thermosetting resin (for example, an epoxy resin containing fillers) can be used. However, the resin is not limited to the above state; it may also be in other states (shapes), such as granular (use