JP-7856304-B2 - Resin encapsulation apparatus and resin encapsulation method

JP7856304B2JP 7856304 B2JP7856304 B2JP 7856304B2JP-7856304-B2

Inventors

田上秀作
柳澤誠

Assignees

ヤマハロボティクス株式会社

Dates

Publication Date: 20260511
Application Date: 20220722

Claims (5)

A resin sealing apparatus for resin sealing an electronic component of a workpiece including a substrate and an electronic component, The system includes a resin encapsulation mold for compressing and molding a resin onto the workpiece to encapsulate the electronic component, The resin encapsulation mold comprises a first mold and a second mold paired with the first mold. The first mold has a cavity recess and a work guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, The workpiece is provided with a through hole for positioning, The second mold has a workpiece insertion portion that is inserted into the through hole, The work guide portion positions the workpiece from the outside of the workpiece in a plan view of the first mold when the resin sealing mold is opened. A resin sealing device in which the workpiece is positioned relative to the second mold by inserting the workpiece insertion portion into the through hole while the resin sealing mold is clamped .
A resin sealing apparatus for resin sealing an electronic component of a workpiece including a substrate and an electronic component, The system includes a resin encapsulation mold for compressing and molding a resin onto the workpiece to encapsulate the electronic component, The resin encapsulation mold comprises a first mold and a second mold paired with the first mold. The first mold has a cavity recess and a work guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, The work guide portion has a plurality of protrusions arranged along the outer circumference of the workpiece in a plan view of the first mold, The work guide portion is a resin sealing device that positions the workpiece from the outside of the workpiece in a plan view of the first mold when the resin sealing mold is opened .
A resin sealing method using a resin sealing mold for resin sealing an electronic component of a workpiece including a substrate and an electronic component, The resin encapsulation mold comprises a first mold and a second mold paired with the first mold. The first mold has a cavity recess and a work guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, The resin sealing method described above is To supply resin to the cavity recess provided in the first mold, The workpiece is supplied to the first mold such that the electronic component is positioned inside the cavity recess into which the resin is supplied, and The resin sealing mold is clamped by moving the first mold and the second mold relative to each other, thereby sealing the electronic component in resin. Includes, Supplying the workpiece includes positioning the workpiece from the outside of the workpiece using the workpiece guide portion in a plan view of the first mold, with the resin sealing mold in the open state. A resin sealing method for the aforementioned electronic component, which includes positioning the workpiece relative to the second mold by inserting a workpiece insertion portion provided in the second mold into a through hole provided in the workpiece while the resin sealing mold is clamped .
A resin sealing method using a resin sealing mold for resin sealing an electronic component of a workpiece including a substrate and an electronic component, The resin encapsulation mold comprises a first mold and a second mold paired with the first mold. The first mold has a cavity recess and a work guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, The resin sealing method described above is To supply resin to the cavity recess provided in the first mold, The workpiece is supplied to the first mold such that the electronic component is positioned inside the cavity recess into which the resin is supplied, and The resin sealing mold is clamped by moving the first mold and the second mold relative to each other, thereby sealing the electronic component in resin. Includes, A resin encapsulation method comprising supplying the workpiece, positioning the workpiece from the outside of the workpiece using the workpiece guide portion in a plan view of the first mold while the resin encapsulation mold is open, and bringing at least a portion of the electronic component provided on the workpiece into contact with the resin inside the cavity recess.
A resin sealing method using a resin sealing mold for resin sealing an electronic component of a workpiece including a substrate and an electronic component, The resin encapsulation mold comprises a first mold and a second mold paired with the first mold. The first mold has a cavity recess and a work guide portion provided on the outer circumferential surface of the cavity recess on the side facing the second mold, The work guide portion has a plurality of protrusions arranged along the outer circumference of the workpiece in a plan view of the first mold, The resin sealing method described above is To supply resin to the cavity recess provided in the first mold, The workpiece is supplied to the first mold such that the electronic component is positioned inside the cavity recess into which the resin is supplied, and The resin sealing mold is clamped by moving the first mold and the second mold relative to each other, thereby sealing the electronic component in resin. Includes, A resin sealing method comprising supplying the workpiece, wherein the resin sealing mold is opened, and the workpiece is positioned from the outside of the workpiece by the plurality of protrusions in a plan view of the first mold.

Description

This invention relates to a resin encapsulation apparatus and a resin encapsulation method. A resin encapsulation apparatus is known for resin-encapsulating electronic components in a workpiece containing a substrate and electronic components. This resin encapsulation apparatus comprises a resin encapsulation mold having an upper mold and a lower mold. The resin encapsulation mold is clamped by the relative vertical movement of the upper and lower molds, and the electronic components are resin-encapsulated within the cavity of the clamped resin encapsulation mold. For example, Patent Document 1 discloses a semiconductor resin encapsulation apparatus in which resin and a workpiece are placed on a lower mold having a cavity recess, and the resin is compression-molded by clamping the resin encapsulation mold. Japanese Patent Publication No. 2003-133352 This is a plan view of a resin encapsulation apparatus according to one embodiment of the present invention.Figure 1 is a partially enlarged view of the resin encapsulation apparatus.Figure 1 is a cross-sectional view of the resin encapsulation mold.Figure 3A shows enlarged sections of the upper and lower molds.This is a flowchart showing a resin encapsulation method according to one embodiment of the present invention.This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention.This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention.This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention.This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention.This figure illustrates a resin encapsulation mold and a resin encapsulation method using the same according to a second embodiment of the present invention.This figure illustrates a resin encapsulation mold and a resin encapsulation method using the same according to a second embodiment of the present invention.This is a diagram illustrating a resin encapsulation method according to a third embodiment of the present invention. The embodiments of the present invention will be described below with reference to the drawings. The drawings of each embodiment are illustrative, and the dimensions and shapes of the parts are schematic; therefore, the technical scope of the present invention should not be limited to these embodiments. [First Embodiment] <Resin encapsulation device> The configuration of the resin encapsulation apparatus 1 according to an embodiment of the present invention will be described with reference to Figures 1 to 3B. Figure 1 is a plan view of the resin encapsulation apparatus according to this embodiment. Figure 2 is a partially enlarged view of the resin encapsulation apparatus, Figure 3A is a cross-sectional view of the resin encapsulation mold, and Figure 3B is a partially enlarged view of the upper and lower molds. For convenience, each drawing is labeled with front/back, left/right, and up/down directions to clarify the relationships between the drawings and to help understand the positional relationships of each component. Also, the film F, which will be described later, is not shown in Figure 3B. The resin encapsulation apparatus 1 is a manufacturing apparatus that produces a molded product M by applying resin to a workpiece W. The workpiece W includes a base material B and an electronic component P. A molded product M can be produced by molding resin R onto the workpiece W and encapsulating the electronic component P of the workpiece W with resin. Here, the workpiece W has a surface on which the electronic component P is placed (hereinafter referred to as the "front surface of the workpiece W") and a surface opposite to the said surface on which the electronic component P is not placed (hereinafter referred to as the "back surface of the workpiece W"). In the following description, the top and bottom relationship between the front and back surfaces of the workpiece W can be reversed as appropriate depending on the structure of the resin encapsulation mold. Hereinafter, for the convenience of explanation, the workpiece W after resin encapsulation may be referred to as the molded product M. The base material B is, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, or a semiconductor substrate. The electronic component P is, for example, a semiconductor element such as an IC chip, but is not limited thereto, and may be various active elements, passive elements, or MEMS devices, etc. The resin R is, for example, a granular thermosetting resin. The form of resin R is not limited to the above; for example, it may be in the form of a sheet, liquid, or powder. The resin encapsulation apparatus 1 according to this embodiment is a compression molding type resin encapsulation apparatus. As shown in Figure 1, the resin encapsulation apparatus 1 compri