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JP-7856339-B2 - Resin encapsulation apparatus and resin encapsulation method

JP7856339B2JP 7856339 B2JP7856339 B2JP 7856339B2JP-7856339-B2

Inventors

  • 田上 秀作
  • 柳澤 誠

Assignees

  • ヤマハロボティクス株式会社

Dates

Publication Date
20260511
Application Date
20230418
Priority Date
20220608

Claims (10)

  1. A compression molding resin encapsulation apparatus for resin encapsulating the electronic components of a workpiece including a base material and electronic components, A resin encapsulation mold for compressing and molding a resin material onto the workpiece to resin-encapsulate the electronic component, A loader hand for transporting the resin material to the resin sealing mold, The system includes a resin quantity calculation unit that calculates the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis, based on the mounting status of the electronic components in the workpiece. The resin sealing mold includes an upper mold and a lower mold, the upper mold having a cavity recess that opens toward the lower mold, The aforementioned resin material includes a first resin and a second resin. The first resin is a sheet-like resin, The second resin is a granular resin, a powdered resin, or a liquid resin. Of the first resin and the second resin, at least the supply amount of the second resin is determined on a work-by-work basis based on the amount of resin calculated by the resin amount calculation unit. The loader hand is configured to arrange the first resin and the second resin in the cavity recess so that the second resin faces the upper mold.
  2. A compression molding resin encapsulation apparatus for resin encapsulating the electronic components of a workpiece including a base material and electronic components, A resin encapsulation mold for compressing and molding a resin material onto the workpiece to resin-encapsulate the electronic component, A loader hand for transporting the resin material to the resin sealing mold, The system includes a resin quantity calculation unit that calculates the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis, based on the mounting status of the electronic components in the workpiece. The resin sealing mold includes an upper mold and a lower mold, the upper mold having a cavity recess that opens toward the lower mold, The aforementioned resin material includes a first resin and a second resin. The first resin is a sheet-like resin, The second resin is a granular resin, a powdered resin, or a liquid resin. Of the first resin and the second resin, at least the supply amount of the second resin is determined on a work-by-work basis based on the amount of resin calculated by the resin amount calculation unit. The loader hand is configured to arrange the first resin and the second resin in the cavity recess so that the first resin faces the upper mold, and the loader hand is configured to do so.
  3. A first resin supply unit that supplies the first resin, The system further comprises a second resin supply unit that supplies the second resin, The second resin supply unit is configured to supply the second resin into the opening of the guide unit on the first resin supplied by the first resin supply unit. The resin encapsulation apparatus according to claim 1.
  4. A compression molding resin encapsulation apparatus for resin encapsulating the electronic components of a workpiece including a base material and electronic components, A resin encapsulation mold for compressing and molding a resin material onto the workpiece to resin-encapsulate the electronic component, A loader hand for transporting the resin material to the resin sealing mold, The system includes a resin quantity calculation unit that calculates the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis, based on the mounting status of the electronic components in the workpiece. The resin sealing mold includes an upper mold and a lower mold, the lower mold having a cavity recess that opens toward the upper mold, The aforementioned resin material includes a first resin and a second resin. The first resin is a sheet-like resin, The second resin is a granular resin, a powdered resin, or a liquid resin. Of the first resin and the second resin, at least the supply amount of the second resin is determined on a work-by-work basis based on the amount of resin calculated by the resin amount calculation unit. The loader hand is configured to arrange the first resin and the second resin in the cavity recess so that the first resin faces the lower mold, and the loader hand is configured to do so.
  5. A compression molding resin encapsulation apparatus for resin encapsulating the electronic components of a workpiece including a base material and electronic components, A resin encapsulation mold for compressing and molding a resin material onto the workpiece to resin-encapsulate the electronic component, A loader hand for transporting the resin material to the resin sealing mold, The system includes a resin quantity calculation unit that calculates the amount of resin material to be supplied to the workpiece on a workpiece-by-workpiece basis, based on the mounting status of the electronic components in the workpiece. The resin sealing mold includes an upper mold and a lower mold, the lower mold having a cavity recess that opens toward the upper mold, The aforementioned resin material includes a first resin and a second resin. The first resin is a sheet-like resin, The second resin is a granular resin, a powdered resin, or a liquid resin. Of the first resin and the second resin, at least the supply amount of the second resin is determined on a work-by-work basis based on the amount of resin calculated by the resin amount calculation unit. The loader hand is configured to arrange the first resin and the second resin in the cavity recess so that the second resin faces the lower mold, in a resin encapsulation apparatus.
  6. The loader hand has a suction pad or an electrostatic chuck. A resin encapsulation apparatus according to any one of claims 1 to 5.
  7. The loader hand is configured to transport the first resin and the second resin to the resin sealing mold while the first resin and the second resin are fused together. A resin encapsulation apparatus according to any one of claims 1 to 5 .
  8. The amount of the second resin to be supplied is determined based on the difference between the amount of resin calculated by the resin amount calculation unit and the amount of the first resin to be supplied. A resin encapsulation apparatus according to any one of claims 1 to 5 .
  9. The supply amount of the second resin is less than the supply amount of the first resin. A resin encapsulation apparatus according to any one of claims 1 to 5 .
  10. A compression molding resin encapsulation method for a workpiece including a base material and electronic components, wherein the electronic components are resin-encapsulated, Based on the mounting arrangement of the electronic components in the workpiece, the amount of resin material to be supplied to the workpiece is calculated on a per-workpiece basis. To supply the aforementioned workpiece to a resin sealing mold, The process includes supplying a resin material to the resin encapsulation mold, and using the resin encapsulation mold to compress and mold the resin material onto the workpiece to resin encapsulate the electronic component. The resin sealing mold includes an upper mold and a lower mold, the upper mold having a cavity recess that opens toward the lower mold, The resin material comprises a first resin and a second resin, wherein the first resin is a sheet-like resin, and the second resin is a granular resin, a powdered resin, or a liquid resin. Of the first resin and the second resin, the supply amount of at least the second resin is determined on a per-workpiece basis based on the amount of the resin material calculated on a per-workpiece basis. A resin sealing method comprising a loader hand that transports the resin material to the resin sealing mold, wherein the first resin and the second resin are arranged in the cavity recess so that the second resin faces the upper mold.

Description

The present invention relates to a resin encapsulation apparatus and a resin encapsulation method. When encapsulating electronic components such as semiconductor elements with resin, the amount of resin supplied may be adjusted based on the mounting arrangement of the electronic components. For example, Patent Document 1 discloses a resin molding apparatus that removes excess sheet-like resin according to the mounting arrangement of the electronic components. Japanese Patent Publication No. 2021-118244 This is a plan view of a resin encapsulation apparatus according to one embodiment of the present invention.Figure 1 is a partially enlarged view of the resin encapsulation apparatus.Figure 1 is a cross-sectional view of the resin encapsulation mold.This is a flowchart showing a resin encapsulation method according to one embodiment of the present invention.This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention.This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention.This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention.This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention.This is a diagram illustrating a resin encapsulation method according to one embodiment of the present invention.This figure illustrates a resin encapsulation method according to another embodiment of the present invention.This figure illustrates a resin encapsulation method according to another embodiment of the present invention.This figure illustrates a resin encapsulation method according to another embodiment of the present invention.This figure illustrates a resin encapsulation method according to another embodiment of the present invention.This figure illustrates a resin encapsulation method according to another embodiment of the present invention.This figure illustrates a resin encapsulation method according to another embodiment of the present invention.This figure illustrates a resin encapsulation method according to another embodiment of the present invention.This figure illustrates a resin encapsulation method according to another embodiment of the present invention.This figure illustrates a resin encapsulation method according to another embodiment of the present invention.This figure illustrates a resin encapsulation method according to another embodiment of the present invention. The embodiments of the present invention will be described below with reference to the drawings. The drawings of each embodiment are illustrative, and the dimensions and shapes of each part are schematic; the technical scope of the present invention should not be interpreted as being limited to these embodiments. [First Embodiment] <Resin encapsulation device> The configuration of the resin encapsulation apparatus 1 according to an embodiment of the present invention will be described with reference to Figures 1 to 3. Figure 1 is a plan view of the resin encapsulation apparatus according to this embodiment. Figure 2 is a partially enlarged view of the resin encapsulation apparatus, and Figure 3 is a cross-sectional view of the resin encapsulation mold. In addition, each of the drawings in Figures 1 to 3 is conveniently labeled with directions (front, back, left, right, up, and down) to clarify the relationships between the drawings and to help understand the positional relationships of each component. The resin encapsulation apparatus 1 is a manufacturing apparatus that produces a molded product M by applying resin to a workpiece W. The workpiece W includes a base material B and an electronic component P. A molded product M can be produced by molding resin onto the workpiece W and encapsulating the electronic component P of the workpiece W with the resin. Here, the workpiece W has a surface on which the electronic component P is placed (hereinafter referred to as the "front surface of the workpiece W") and a surface opposite to the said surface (hereinafter referred to as the "back surface of the workpiece W"). The back surface of the workpiece W is the surface on which the electronic component P is not mounted. In the following description, the top and bottom relationship between the front and back surfaces of the workpiece W can be reversed as appropriate depending on the structure of the resin encapsulation mold. For the convenience of explanation, the workpiece W after resin encapsulation may be referred to as the molded product M. The base material B is, for example, an interposer substrate, a lead frame, a carrier plate with an adhesive sheet, or a semiconductor substrate. The electronic component P is, for example, a semiconductor element such as an IC chip, but is not limited to this, and may be various active elements, passive elements, MEMS devices, etc. As shown in Figure 3, the resin is composed of a first resi