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JP-7856433-B2 - tape

JP7856433B2JP 7856433 B2JP7856433 B2JP 7856433B2JP-7856433-B2

Inventors

  • 鈴木 佑奈
  • 佃 壮一
  • 千嶋 憲治

Assignees

  • ＺＡＣＲＯＳ株式会社

Dates

Publication Date
20260511
Application Date
20220104

Claims (5)

  1. A tape having an adhesive layer on one side of a substrate layer formed using a solvent-soluble polyimide varnish, The aforementioned tape is a protective tape that protects a semiconductor wafer or semiconductor chip as an adherend. The tape has a breaking elongation of 100% or more and an elastic modulus of 2 GPa or less, and maintains a breaking elongation of 100% or more and an elastic modulus of 2 GPa or less after heating at 230°C for 80 seconds.
  2. The tape according to claim 1 , wherein the adhesive layer can reduce its adhesive strength by hardening.
  3. The tape according to claim 1 or 2, wherein, after heating at 230°C for 80 seconds, or after the adhesive strength is reduced by hardening of the adhesive layer, the adhesive strength to polybenzoxazole (PBO) is 0.5 N/25 mm or less.
  4. The tape according to any one of claims 1 to 3 , wherein the adhesive adhesive layer has a release film on the adhesive adhesive surface opposite to the base material layer.
  5. A protective tape for protecting a semiconductor chip as an adherend, according to any one of claims 1 to 4 .

Description

This invention relates to tape. In the manufacturing process of semiconductor components, as described in Patent Documents 1 to 4, tapes having an adhesive layer are used to attach the semiconductor to be processed. Japanese Patent Publication No. 2003-105292Japanese Patent Publication No. 2010-225753Japanese Patent Publication No. 2010-251722International Publication No. 2017/154619 This is a cross-sectional view showing an example of tape. The present invention will be described below based on preferred embodiments. Figure 1 shows an example of a tape according to the embodiment. The tape 10 of the embodiment is a tape 10 having an adhesive layer 11 on one side of a base layer 12, and has a break elongation of 100% or more and an elastic modulus of 2 GPa or less. Furthermore, the tape 10 maintains a break elongation of 100% or more and an elastic modulus of 2 GPa or less even after heating at 230°C for 80 seconds. The adhesive layer 11 can fix adherends such as semiconductor wafers and semiconductor chips with a predetermined adhesive strength. The adherends are fixed to the adhesive surface 11a of the adhesive layer 11. In this specification, the adhesive layer refers to either an adhesive layer, an adhesive layer, or a material that possesses the properties of both an adhesive layer and an adhesive layer. The adhesive layer 11 can be formed from an adhesive. The adhesive refers to either an adhesive, an adhesive, or a material that possesses the properties of both an adhesive and an adhesive. Adhesive strength refers to peel strength, and for example, refers to adhesive strength or bonding strength. The adhesive surface 11a is the surface on which the adhesive layer 11 has adhesive strength, and for example, refers to an adhesive surface or bonding surface. Specific examples of adhesives include acrylic adhesives, silicone adhesives, urethane adhesives, epoxy adhesives, olefin heat sealants, etc. The adhesive layer 11 is not limited to a pressure-sensitive adhesive (adhesive), and may be formed using a curing adhesive, a reactive adhesive, a solvent-based adhesive, etc. A tape 10 using an adhesive in the adhesive layer 11 may be an adhesive tape. A tape 10 using an adhesive in the adhesive layer 11 may also be an adhesive tape. Until the adherend is fixed to the adhesive layer 11, a release film 14 may be present on the adhesive surface 11a of the adhesive layer 11. To improve the bonding strength between the adhesive layer 11 and the base layer 12, the base layer 12 may have an anchoring agent layer between it and the adhesive layer 11. If the tape 10 has a release film 14, the release film 14 is removed before the tape 10 is applied to the adherend. The tape body 13, having the adhesive layer 11 on one side of the base layer 12, is then bonded to the adherend. The base layer 12 is not particularly limited, but examples include polyolefin resins such as polyethylene (PE) resin and polypropylene (PP) resin; polyester resins such as polyethylene terephthalate (PET) resin, polybutylene terephthalate (PBT) resin, and polyethylene naphthalate (PEN) resin; and at least one resin film such as polyamide (PA) resin, polyimide (PI) resin, polyetherimide (PEI) resin, polyamideimide (PAI) resin, polycarbonate (PC) resin, polyethersulfone (PES) resin, polyphenylene sulfide (PPS) resin, polyetheretherketone (PEEK) resin, and fluororesin. The optical properties of the base layer 12 are not particularly limited and can be transparent, translucent, or opaque. The base layer 12 may be a resin film with coloring or printing. The thickness of the base layer 12 is not particularly limited, but for example, it may be 5 to 500 μm, and in the case of a thin layer, it may be about 15 to 30 μm. The base layer 12 may be a single layer or a laminate of two or more layers. From the viewpoint of conformability to the adherend, it is preferable that the elongation at break of the tape 10 is 100% or more, and the elastic modulus of the tape 10 is 2 GPa or less. If the tape 10 has a release film 14, the elongation at break and elastic modulus of the tape body 13, which has an adhesive layer 11 on one side of the base layer 12 (excluding the release film 14), are measured as the elongation at break and elastic modulus of the tape body 13. Elongation at break is the percentage of elongation at the point when a sample, such as a film, breaks under constant-speed tensile stress. Specifically, if the length of the sample before the tensile test is Lo and the length at break is L, the elongation at break is expressed as (L - Lo) / Lo × 100 (%). A higher elongation at break indicates a more flexible film under tensile force. The modulus of elasticity is the proportionality constant between stress and strain when a sample, such as a film, undergoes elastic deformation. Examples of moduli of elasticity include tensile modulus, compressive modulus, flexural modulus, shear modulus, and torsional modulus. The modulus of elasticity in the tensile