JP-7856441-B2 - electronic equipment

Inventors

• 小島 裕

Assignees

• キヤノン株式会社

Dates

Publication Date

20260511

Application Date

20220131

Claims (5)

1. A conductive portion is patterned directly onto the exposed surface of a resin molded body , and the surface includes a plurality of annular protrusions that protrude from the surface of the resin molded body, An electronic device having a contact component that possesses a biasing force and has a contact range capable of electrical contact, and that traces a rotational trajectory around a predetermined axis of rotation , The conductor portion and the contact component are in a relative relationship where their positions change. The conductor portion is positioned within the range of the rotational trajectory traced by the contact area . The pattern center of the conductor portion is eccentric from the center of the rotation axis. The aforementioned contact range is characterized by sliding across the plurality of annular protrusions in the radial direction as it rotates .
2. The aforementioned contact component traces a straight-line trajectory that reciprocates within a predetermined range. The electronic device according to claim 1, wherein the pattern of the conductor portion is not parallel to the straight-line trajectory of the contact component.
3. The electronic device according to claim 1 or 2, characterized in that the wiring section for drawing wires from the conductor section is positioned lower than the conductor section.
4. Furthermore, it includes an operating component that is operated by the user, The electronic device according to any one of claims 1 to 3, characterized in that the operating feel of the operating member to which the contact component is integrally attached is changed by changing the height of the exposed surface of the conductor portion and thereby changing the contact pressure of the contact component sliding on the exposed surface of the conductor portion.
5. Furthermore, it includes an operating component that is operated by the user, The electronic device according to any one of claims 1 to 4, characterized in that the operating feel of the operating member to which the contact component is integrally attached is changed by changing the contact area in which the conductor portion and the contact component slide against each other.

Description

This invention relates to an electronic device in which a conductive material is patterned on the surface of a resin molded product using MID (Mixed In-Depth) technology. Traditionally, with the miniaturization and diversification of electronic devices, electrical circuits have been designed to be formed in the limited space inside the device. Flexible printed circuit boards (FPCs) are used in some parts of printed circuit boards. Furthermore, various modules that make up electronic devices are known to utilize MID (Molded Interconnect Device) technology in the formation of electrical circuits to achieve miniaturization. MID technology is a technique that involves irradiating a predetermined area of a heat-resistant resin base component with a laser, thereby forming a metal plating film only on the irradiated area. The areas where the metal plating film is formed become conductive patterns. Furthermore, it is possible to print solder paste onto a conductive pattern and reflow mount electrical components. By using MID technology, the base material, conductive pattern, and electrical components mounted on the conductive pattern are integrated into a single structure, simplifying the structure and enabling improved assembly and cost reduction. Furthermore, the electrical connection method between the MID-processed electrical circuit and metal contacts, as described above, requires greater connection reliability and high durability against the sliding of the metal contacts. For example, the technology described in Patent Document 1 discloses a technique for obtaining a three-dimensional wiring shape by forming a conductive polymer pattern on a laminated substrate, then bending the laminate, and finally applying electroplating to the bent pattern. Japanese Patent Publication No. 2016-201322 External perspective view of the imaging device 100Exploded perspective view of the imaging device 100A schematic diagram illustrating the configuration of the imaging device 100 and the transmission path of electrical signals.(a) Diagram showing the dial unit 401 of the operating member 104 for the correct position disassembled from the top cover unit 203, (b) Exploded perspective view of the dial unit 401Detailed view of brush contact 404(a) Top view of the sliding contact portion 403, (b) Schematic diagram of the cross section at A-A(a) A top view showing the positional relationship between the sliding contact portion 403 and the brush contact 404 in the dial unit 401, (b) A cross-sectional view showing the contact state between the sliding contact portion 403 and the brush contact 404 at B-B.A diagram and chart showing a sequence for identifying the position and phase of the contact portion 504.Modified examples of the contact portion 504, the first protrusion 604, the second protrusion 605, the protrusion 902, etc. MID (Molded Interconnect Device) refers to a resin molded product with patterned wiring or patterned electrodes. This refers to a molded product in which the conductive parts, namely wiring and electrodes, are patterned onto a resin plate. Preferred embodiments of the present invention will be described in detail below with reference to the accompanying drawings. (Description of imaging device 100) Figure 1 is an external perspective view of the imaging device 100 in an embodiment of the present invention, in which the imaging device 100 has a housing shape in which the normal position gripping part 101 and the vertical position gripping part 102 are integrated. 104 is the operating member for the positive position, 105 is the operating member for the vertical position, and 106 is a general term for the operating members that perform physical operations, referred to as the physical operating member 106. Figure 2 is an exploded perspective view of the imaging device 100 in an embodiment of the present invention. 201 is a front cover unit, serving as the front exterior cover of the imaging device 100, and also acting as a chassis that maintains the rigidity of the imaging device 100. To maintain chassis rigidity, it is primarily constructed from lightweight and strong magnesium alloys. Furthermore, the front cover unit 201 incorporates a lens mount and electrical contact pins for lens attachment and communication, physical operation buttons on the front, and ear loops for attaching a strap. When combined with the bottom cover (not shown), it also forms a battery compartment for housing battery 208. The front surface of the front cover unit 201 is an external surface, and therefore, it is painted for aesthetic purposes. In addition, a rubber grip 209 made of NBR + PVC or similar material is attached to the imaging device 100 for gripping. The units described later are assembled sequentially, stacked on the back of the front cover unit 201. Unit 202 is an EVF (Electric View Finder) unit. It consists of an eyepiece, a diopter adjustment mechanism, an OLED (Electroluminescent) panel, and an eyepiece detection sensor