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JP-7856458-B2 - Retaining member

JP7856458B2JP 7856458 B2JP7856458 B2JP 7856458B2JP-7856458-B2

Inventors

  • 鈴木 佳祐

Assignees

  • 日本特殊陶業株式会社

Dates

Publication Date
20260511
Application Date
20220324

Claims (5)

  1. A first plate-like member having a first surface and a second surface provided on the opposite side of the first surface, A second plate-like member having a third surface and a fourth surface provided on the opposite side of the third surface, It has, The second surface of the first plate-like member and the third surface of the second plate-like member are thermally connected. In the holding member that holds an object on the first surface, The heating element has linear heating lines formed substantially concentrically on the inside of the first plate-shaped member or on the second surface, When viewed from the direction of arrangement of the first plate-like member and the second plate-like member, The aforementioned heating element is A pair of heating lines, consisting of two heating lines adjacent to each other in the radial direction of the heating element, is provided, comprising a first pair of heating lines and a second pair of heating lines arranged separately in the circumferential direction of the heating element, separated by a predetermined separation region. A first folded portion that connects the ends of the two heating lines constituting the first heating line pair on the separation region side, A second folded portion that connects the ends of the two heating lines constituting the second pair of heating lines on the separated region side, Equipped with, The circumferential pitch width, which is the distance between the first folded portion and the second folded portion, is greater than the radial pitch width, which is the distance between the two heating lines that constitute the pair of heating lines. A through hole is formed in at least one of the first plate-like member and the second plate-like member. When viewed from the aforementioned arrangement direction, The through hole is formed at the location of the separation region between the first folded portion and the second folded portion. The circumferential pitch width is 1.0 times or more and less than 1.2 times the circumferential width of the through hole. The first folded portion and the second folded portion are formed in an arc shape. A retaining member characterized by the following.
  2. In the retaining member of claim 1, The circumferential pitch width is no more than four times the radial pitch width. A retaining member characterized by the following.
  3. In the retaining member of claim 1 or 2, The resistance per unit length of the heating line forming the first folded portion and the second folded portion is greater than the resistance per unit length of the heating line forming the pair of heating lines. A retaining member characterized by the following.
  4. In the retaining member of claim 1 or 2, The resistance per unit length of the heating line forming the first folded portion and the second folded portion is smaller than the resistance per unit length of the heating line forming the pair of heating lines. A retaining member characterized by the following.
  5. In any one of the holding members from claim 1 to 4, The holding member is an electrostatic chuck having chuck electrodes that generate an electrostatic attraction for holding the object. A retaining member characterized by the following.

Description

This disclosure relates to a holding member for holding an object. Regarding documents relating to holding members, Patent Document 1 discloses a wafer heating device used in film deposition and etching equipment in the manufacturing process of semiconductor devices. The wafer heating device disclosed in Patent Document 1 has a heater pattern consisting of heating lines for heating the wafer embedded within a ceramic member (ceramic substrate) that has a holding surface (wafer support surface). Patent No. 3477062 This is a schematic perspective view of the electrostatic chuck of this embodiment.This is an XY plan view of the electrostatic chuck of this embodiment.This is an XZ cross-sectional view of the ceramic member of this embodiment.This is a top view of the heating element of this embodiment.This is an enlarged view of the pair of folded portions of the heating element in this embodiment and the surrounding area (an enlarged view of the area α in Figure 4).This diagram shows a pair of folded portions of a heating element and their surroundings, with a circumferential pitch width of 2.5 mm.This is an evaluation result of the temperature distribution in a portion of the holding surface (i.e., the position on the holding surface corresponding to the hole in the base member and the surrounding area) when the circumferential pitch width is set to 2.5 mm.This diagram shows a pair of folded portions of a heating element and its surrounding area, with a circumferential pitch width of 5.0 mm.This is an evaluation result of the temperature distribution in a portion of the holding surface when the circumferential pitch width is 5.0 mm.This diagram shows a pair of folded portions of a heating element and its surrounding area, with a circumferential pitch width of 6.0 mm.This is an evaluation result of the temperature distribution in a portion of the holding surface when the circumferential pitch width is 6.0 mm.This diagram shows a pair of folded portions of a heating element and their surroundings, with a circumferential pitch width of 8.0 mm (and a line width ratio of 100%).This is an evaluation result of the temperature distribution of a portion of the holding surface when the circumferential pitch width is 8.0 mm (and the line width ratio is 100%).This graph shows the evaluation results of the temperature difference on the holding surface with respect to the circumferential pitch width.This is a table showing the evaluation results of the temperature difference of the holding surface with respect to the circumferential pitch width.This diagram shows a pair of folded sections of a heating element and their surroundings, with the line width ratio set to 75%.This figure shows the evaluation results of the temperature distribution in a portion of the holding surface when the line width ratio is set to 75%.This diagram shows a pair of folded sections of a heating element and their surroundings, with the line width ratio set to 50%.This figure shows the evaluation results of the temperature distribution in a portion of the holding surface when the line width ratio is set to 50%.This diagram shows a pair of folded sections of a heating element and their surroundings, with the line width ratio set to 25%.This figure shows the evaluation results of the temperature distribution in a portion of the holding surface when the line width ratio is set to 25%.This graph shows the evaluation results of the temperature difference on the holding surface in relation to the ratio of line width.This is a table showing the evaluation results of the temperature difference on the holding surface in relation to the ratio of line width.This figure shows the first modified example.This figure shows a second modified example. An embodiment of the holding member of this disclosure will be described. In this embodiment, an electrostatic chuck 1 will be used as an example of the holding member. <Overall explanation of electrostatic chucks> The electrostatic chuck 1 of this embodiment is a device that attracts and holds a semiconductor wafer W by electrostatic attraction, and is used, for example, to fix a semiconductor wafer W in a vacuum chamber of a semiconductor manufacturing apparatus. Note that the semiconductor wafer W is an example of the "object" of this disclosure. As shown in Figure 1, the electrostatic chuck 1 comprises a ceramic member 10, a base member 20, and a bonding layer 30 that joins the ceramic member 10 and the base member 20. The ceramic member 10 is an example of the "first plate-like member" of this disclosure, and the base member 20 is an example of the "second plate-like member" of this disclosure. For the purposes of the following explanation, the X, Y, and Z axes are defined as shown in Figure 1. Here, the Z axis is the axis in the direction of the central axis Ca of the electrostatic chuck 1 (the vertical direction in Figure 1), and the X and Y axes are the radial axes of the electrostatic chuck 1. As shown in Fi