Search

JP-7856500-B2 - processing equipment

JP7856500B2JP 7856500 B2JP7856500 B2JP 7856500B2JP-7856500-B2

Inventors

  • 中野 翔太

Assignees

  • 株式会社ディスコ

Dates

Publication Date
20260511
Application Date
20220614

Claims (4)

  1. A first processing unit comprising: a first table for suction-holding a workpiece; a first processing means for processing the workpiece held by suction on the first table while supplying processing fluid; a first moving mechanism for moving the first table in the Y-axis direction; a first transport pad for holding the upper surface of a workpiece; a first Y-axis moving mechanism for moving the first transport pad in the Y-axis direction; and a first Z-axis moving mechanism for moving the first transport pad in the Z-axis direction, which is orthogonal to the X-axis and Y-axis directions; A second processing unit is provided, comprising: a second table for suction-holding a workpiece; a second processing means for processing the workpiece held by suction on the second table while supplying processing fluid; a second moving mechanism for moving the second table in the Y-axis direction; a second transport pad for holding the upper surface of a workpiece; a second Y-axis moving mechanism for moving the second transport pad in the Y-axis direction; and a second Z-axis moving mechanism for moving the second transport pad in the Z-axis direction perpendicular to the X-axis and Y-axis directions, and is positioned next to the first processing unit in the horizontal direction in the X-axis direction perpendicular to the Y-axis direction. The system comprises a third table for suction and holding a workpiece, and a third moving mechanism that moves the third table in the X-axis direction, enabling the transfer of the workpiece between the third table and the first transfer pad, and enabling the transfer of the workpiece between the third table and the second transfer pad. A first drying control unit that sprays air from the upper surface of the first table or the upper surface of the third table to dry the lower surface of the workpiece held by the first transport pad, A second drying control unit that sprays air from the upper surface of the second table or the upper surface of the third table to dry the lower surface of the workpiece held by the second transport pad, A processing device equipped with the following features.
  2. The processing apparatus according to claim 1, wherein the first table, the second table, the third table, the first transport pad, and the second transport pad hold a plurality of workpieces.
  3. The processing apparatus according to claim 1, further comprising a cleaning means for cleaning a workpiece processed by the first processing means or the second processing means.
  4. A method for manufacturing a workpiece using the processing apparatus described in claim 3, A first holding step involves holding the workpiece in the first table, A first processing step involves processing the workpiece held in the first table using a first processing means, A first transfer step involves holding the workpiece processed by the first processing means with the first transfer pad and transferring it from the first table to the third table, In the first transfer process, a first drying process is performed in which air is sprayed from the upper surface of the first table or the upper surface of the third table to dry the lower surface of the workpiece held by the first transport pad, A second transfer step in which the workpiece held on the third table is held by the second transfer pad and transferred to the second table, A second processing step in which the workpiece held in the second table is processed by the second processing means, A third transfer step involves holding the workpiece processed by the second processing means with the second transfer pad and transferring it from the second table to the cleaning means, A method for manufacturing a workpiece, comprising: a second drying step in which, in the third transfer step, air is sprayed from the upper surface of the second table to dry the lower surface of the workpiece held by the second transport pad.

Description

This invention relates to a processing apparatus for processing a workpiece while supplying a processing fluid to the workpiece held on a table. For example, in the manufacturing process of semiconductor devices such as ICs and LSIs used in electronic devices, the back surface of the wafer is ground down using a grinding device to thin the wafer to a predetermined thickness in order to miniaturize and lighten the semiconductor device. In particular, in recent years, there has been a demand for thinner semiconductor devices to meet the requirements for thinner and smaller electronic devices. Here, the wafer grinding apparatus includes a chuck table that holds the wafer by suction on its holding surface, a grinding means for grinding the wafer while supplying processing fluid to it, a transport means for loading or unloading the wafer from the holding surface of the chuck table, a cleaning means for cleaning the wafer after grinding with cleaning water, and a cassette for storing the cleaned wafer. In such a wafer grinding apparatus, the ground wafer is transported by a transport means to a cleaning means, where it is cleaned and dried. Afterward, the wafer is transported by the transport means to a cassette and stored within the cassette. In this case, when transporting the ground wafer to the cleaning means, air is sprayed (air blow) towards the underside of the wafer to remove any processing fluid (grinding fluid) adhering to the underside (see, for example, Patent Document 1). Furthermore, Patent Document 2 discloses a grinding apparatus that holds multiple workpieces in a chuck table having multiple holding surfaces, and grinds these multiple workpieces by performing an infeed grinding process and a creep-feed grinding process. Japanese Patent Publication No. 2010-167519Japanese Patent Publication No. 2022-029598 This is a perspective view showing a part of the processing apparatus (grinding apparatus) according to the present invention, broken in half.This is a perspective view of the first conveying means.This is a partial perspective view showing the mechanism for removing a workpiece from a cassette and temporarily placing it.This is a perspective view of the workpiece removal mechanism.This is a perspective view of the workpiece handling mechanism.This is a perspective view of the cassette transfer mechanism.This is a partial perspective view showing the state of the temporary storage section when the fully automatic operation of the processing apparatus (grinding apparatus) according to the present invention stops.This is a partial perspective view showing the state in which the workpiece is lifted and its underside is dried when the fully automatic operation of the processing apparatus (grinding apparatus) according to the present invention stops.This is a partially broken side view showing the state in which the workpiece is lifted and its underside is dried when the fully automatic operation of the processing apparatus (grinding apparatus) according to the present invention stops. The embodiments of the present invention will be described below with reference to the accompanying drawings. First, the configuration of a grinding apparatus as one embodiment of the processing apparatus according to the present invention will be described based on Figures 1 to 6. In the following description, the arrow directions shown in Figure 1 will be defined as the X-axis direction (left-right direction), the Y-axis direction (front-back direction), and the Z-axis direction (up-down direction), respectively. [Configuration of the grinding device] The grinding apparatus 1 shown in Figure 1 is a fully automated grinding apparatus for two rectangular plate-shaped workpieces W, and its main components include a first processing unit U1 for rough grinding the workpieces W, a second processing unit U2 for finish grinding the workpieces W that have been roughly ground by the first processing unit U1, a temporary storage section 40 for temporarily holding the workpieces W in order to transfer them between the first and second grinding units U2, a cleaning means 60 for cleaning the workpieces W that have been finish ground by the second grinding unit U2, a cassette stage 50 on which a cassette 6 containing a plurality of workpieces W before grinding is placed, a stocker 70 for storing the plurality of cassettes 6, and a drying control unit 200 for drying the underside of the workpieces W by spraying air toward the underside of the workpieces W. The following describes the configurations of the main components of the grinding apparatus 1: the first processing unit U1, the second processing unit U2, the temporary storage section 40, the cleaning means 60, the cassette stage 50, the stocker 70, and the drying control unit 200. <First processing unit and second processing unit> As shown in Figure 1, the first processing unit U1, which rough-grinds the workpiece W, and the second processing unit U2, which finish-grinds the wo