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JP-7856515-B2 - Electronic components

JP7856515B2JP 7856515 B2JP7856515 B2JP 7856515B2JP-7856515-B2

Inventors

  • 易 龍飛
  • 戸蒔 重光

Assignees

  • TDK株式会社

Dates

Publication Date
20260511
Application Date
20220715

Claims (6)

  1. The base body and, A first conductor , which is placed inside the aforementioned element and extends in one direction, A second conductor , which is disposed within the element and extends in one direction, A first connecting conductor is arranged within the element and is installed to extend linearly between the end of the first conductor in the extending direction and the end of the second conductor in the extending direction. A connecting conductor disposed within the element, extending in one direction and having a first end and a second end in the direction of extension, wherein the first end is connected to the first connecting conductor and the connecting conductor is located between the first conductor and the second conductor, An electronic component comprising: a capacitor pad disposed within the element and electrically connected to the second end of the connecting conductor.
  2. The electronic component according to claim 1, wherein the first end of the connecting conductor is connected to the central portion of the first connecting conductor in the extending direction.
  3. The third conductor extending in one direction, The fourth conductor extending in one direction, A second connecting conductor is installed, extending linearly from the end of the third conductor in the extending direction to the end of the fourth conductor in the extending direction, The electronic component according to claim 1 or 2, wherein the first end of the connecting conductor is connected to the second connecting conductor and is located between the third conductor and the fourth conductor.
  4. The first connecting conductor and the second connecting conductor are arranged such that, when viewed from one direction, the extending direction of the first connecting conductor and the extending direction of the second connecting conductor intersect. The electronic component according to claim 3, wherein the first end of the connecting conductor is connected to the intersection of the first connecting conductor and the second connecting conductor.
  5. The aforementioned capacitor pad has multiple pads, The electronic component according to claim 1 or 2, further comprising a third connecting conductor that connects the second end of the connecting conductor to each of the plurality of capacitor pads.
  6. The element has a pair of end faces facing each other in a first direction, a pair of mounting faces and a main face facing each other in a second direction, and a pair of side faces facing each other in a third direction, and exhibits a rectangular parallelepiped shape. The first conductor, the second conductor, the third conductor, and the fourth conductor extend along the second direction. The electronic component according to claim 3, wherein, when viewed from the second direction, the first conductor and the second conductor are located on a first diagonal within the element, and the third conductor and the fourth conductor are located on a second diagonal that intersects the first diagonal within the element.

Description

This invention relates to electronic components. Patent Document 1 discloses a laminated structure comprising multiple dielectric layers and multiple electrode layers. The electrode layers comprise a first capacitor electrode, a second capacitor electrode facing the first capacitor electrode, and an inductor electrode whose first end is connected to the first capacitor electrode and its second end to the second capacitor electrode, forming a loop with the first end as the starting point and the second end as the ending point. The inductor electrode is composed of a line electrode formed along the dielectric layer and a via electrode extending in the direction of the dielectric layer's lamination. The laminated bandpass filter disclosed in Patent Document 1 features three or more LC parallel resonators, each composed of a first capacitor electrode, a second capacitor electrode, and an inductor electrode. In the laminated bandpass filter described in Patent Document 1, the inductor electrodes of the multiple LC parallel resonators are arranged such that the loop surface of the inductor electrode radiates from the central axis extending in the direction of the dielectric layer's lamination, and the inductor electrodes of the input stage LC parallel resonators are adjacent to those of the output stage LC parallel resonators. International Publication No. 2012/066873 Figures 1(a) and 1(b) are perspective views of an electronic component according to the first embodiment.Figure 2 is a transparent perspective view of the electronic component shown in Figure 1.Figure 3 is a transparent perspective view of the electronic component shown in Figure 1.Figure 4 is a top view of the electronic component shown in Figure 1.Figure 5 is an end view of the electronic component shown in Figure 1.Figure 6 is a side view of the electronic component shown in Figure 1.Figure 7 is an equivalent circuit diagram of the electronic component shown in Figure 1.Figure 8 is a transparent perspective view of an electronic component according to the second embodiment.Figure 9 is a transparent perspective view of the electronic component shown in Figure 8.Figure 10 is a top view of the electronic component shown in Figure 8.Figure 11 is an end view of the electronic component shown in Figure 8.Figure 12 is a side view of the electronic component shown in Figure 8. Hereinafter, preferred embodiments of the present invention will be described in detail with reference to the attached drawings. In the description of the drawings, identical or equivalent elements are denoted by the same reference numerals, and redundant descriptions are omitted. [First Embodiment] An electronic component according to the first embodiment will be described with reference to Figures 1(a), 1(b), 2, and 3. Figures 1(a) and 1(b) are perspective views of the electronic component according to the first embodiment. Figure 2 is a transparent perspective view of the electronic component shown in Figure 1. Figure 3 is a transparent perspective view of the electronic component shown in Figure 1. As shown in Figures 1(a), 1(b), 2, and 3, the electronic component 1 comprises a base body 2, a first terminal electrode 3, a second terminal electrode 4, a third terminal electrode 5, and a resonator 6. In Figures 2 and 3, for convenience of explanation, the base body 2 is shown by a dashed line. Body 2 has a rectangular parallelepiped shape. This includes rectangular parallelepiped shapes with chamfered corners and edges, and rectangular parallelepiped shapes with rounded corners and edges. Body 2 has a pair of end faces 2a and 2b, a pair of main faces 2c and 2d, and a pair of side faces 2e and 2f as its outer surfaces. The end faces 2a and 2b face each other. The main faces 2c and 2d face each other. The side faces 2e and 2f face each other. Hereafter, the opposing direction of the end faces 2a and 2b will be referred to as the first direction D1, the opposing direction of the main faces 2c and 2d as the second direction (one direction) D2, and the opposing direction of the side faces 2e and 2f as the third direction D3. The first direction D1, the second direction D2, and the third direction D3 are approximately perpendicular to each other. The end faces 2a and 2b extend in the second direction D2 to connect the main faces 2c and 2d. The end faces 2a and 2b also extend in the third direction D3 to connect the side faces 2e and 2f. The main faces 2c and 2d extend in the first direction D1 to connect the end faces 2a and 2b. The main faces 2c and 2d also extend in the third direction D3 to connect the side faces 2e and 2f. The side faces 2e and 2f extend in the first direction D1 to connect the end faces 2a and 2b. The side faces 2e and 2f also extend in the second direction D2 to connect the main faces 2c and 2d. The main surface 2d is the mounting surface, and is the surface that faces other electronic devices (e.g., circuit boards or multilayer electronic components) when mounti