JP-7856551-B2 - Cleaning attachment

Inventors

• 墨 周武

Assignees

• 株式会社ＳＣＲＥＥＮホールディングス

Dates

Publication Date

20260511

Application Date

20221116

Claims (10)

1. A cleaning attachment for a supercritical processing chamber, which supports a substrate with a substrate support member and moves the substrate support member forward and backward within a processing space formed in the chamber body to house and discharge the substrate into the processing space, An engaging portion that detachably engages with the substrate support member, A cleaning attachment comprising a cleaning section that contacts the wall surface surrounding the processing space within the chamber body, and a connecting section that connects the engaging section and the cleaning section.
2. The cleaning attachment according to claim 1, wherein the cleaning section has a wiping member formed of a porous elastic material or fabric that contacts the wall surface.
3. The cleaning attachment according to claim 2, wherein the wiping member is provided corresponding to the ceiling and bottom surfaces of the wall.
4. The cleaning attachment according to claim 2, wherein the wiping member is provided corresponding to the side wall surface of the wall surface.
5. The cleaning attachment according to claim 1, wherein the cleaning unit comprises an arm portion extending diagonally with respect to the reciprocating direction of the substrate support member, and a wiping member formed of a porous elastic material or fabric and provided at the tip of the arm portion in the reciprocating direction.
6. The cleaning attachment according to any one of claims 1 to 5, wherein the engaging portion has a connecting member that connects the connecting portion and the substrate support member.
7. The cleaning attachment according to claim 6, wherein at least one of the connecting portion and the connecting member is formed of a resin material.
8. The cleaning attachment according to claim 6, wherein at least one of the connecting portion and the connecting member has a structure in which the surface of a metal member is covered with a resin material.
9. The cleaning attachment according to any one of claims 1 to 5, wherein the cleaning unit has a suction nozzle for sucking gas from the processing space.
10. The cleaning attachment according to any one of claims 1 to 5, wherein the cleaning unit has a discharge nozzle for discharging fluid into the processing space.

Description

This invention relates to a cleaning attachment for cleaning the inside of a supercritical processing chamber, which houses a substrate in its internal processing space and performs supercritical processing. Processing processes for various substrates, such as semiconductor substrates and glass substrates for display devices, include treating the substrate surface with various processing fluids. While processing using liquids such as chemical solutions and rinsing solutions has been widely practiced, processing using supercritical fluids has recently been put into practical use. In particular, when processing substrates with fine patterns formed on the surface, supercritical fluids, which have lower surface tension than liquids, can penetrate deep into the gaps in the patterns, enabling efficient processing. Furthermore, the risk of pattern collapse due to surface tension during drying can be reduced. For example, Patent Document 1, previously disclosed by the applicant, describes a substrate drying apparatus that uses a supercritical fluid. In this apparatus, the substrate to be processed is placed on a flat tray and housed in a supercritical processing chamber. The supercritical processing chamber, constructed by combining multiple metal blocks, has horizontally extending slit-shaped openings on its sides. A processing space for housing the tray is formed inside, communicating with these openings. To minimize the amount of processing fluid used, the size of the processing space is kept only slightly larger than the outer dimensions of the tray. In other words, the processing space viewed from the opening is narrow vertically, long horizontally, and has considerable depth. Japanese Patent Publication No. 2021-163916 This figure shows an example of a substrate processing apparatus to which the cleaning attachment according to the present invention can be applied.This figure shows the relationship between the support tray, the substrate, and the processing space.This figure shows the first to third embodiments of the cleaning attachment.This diagram shows the structure of the attachment part for the cleaning attachment.This figure shows a fourth embodiment of the cleaning attachment.This figure shows a fifth embodiment of the cleaning attachment. The following describes several embodiments of the cleaning attachment according to the present invention. First, the substrate processing apparatus to which these cleaning attachments are applied will be described. Note that the substrate processing apparatus 1 described here has basically the same configuration as that described in Patent Document 1 mentioned above. Therefore, a brief overview of the apparatus configuration will be provided here. <Configuration of substrate processing apparatus> Figure 1 shows a schematic configuration of an example of a substrate processing apparatus to which the cleaning attachment according to the present invention can be applied. This substrate processing apparatus 1 is a device for processing the surface of various substrates, such as semiconductor substrates, with a supercritical fluid. In order to consistently show directions in the following figures, an XYZ Cartesian coordinate system is set up as shown in Figure 1. Here, the XY plane is the horizontal plane, and the Z direction represents the vertical direction. More specifically, the (-Z) direction represents the vertically downward direction. In this embodiment, the "substrate" can refer to various types of substrates, including semiconductor wafers, photomask glass substrates, liquid crystal display glass substrates, plasma display glass substrates, FED (Field Emission Display) substrates, optical disk substrates, magnetic disk substrates, and magneto-optical disk substrates. The following explanation will primarily use a substrate processing apparatus used for semiconductor wafer processing as an example, with reference to the drawings, but the process is similarly applicable to the processing of the various substrates exemplified above. The substrate processing apparatus 1 comprises a processing unit 10, a supply unit 50, and a control unit 90. The processing unit 10 is the main component performing the supercritical drying process, and the supply unit 50 supplies the necessary chemical substances and power to the processing unit 10. The control unit 90 controls each part of these devices to perform predetermined processing. For this purpose, the control unit 90 includes a CPU 91 for executing various control programs, a memory 92 for temporarily storing processing data, a storage 93 for storing the control programs executed by the CPU 91, and an interface 94 for exchanging information with the user and external devices. The operation of the devices, described later, is achieved by the CPU 91 executing the control programs pre-written to the storage 93, causing each part of the devices to perform predetermined operations. The processing unit 10 includes a processing