JP-7856625-B2 - Image sensor unit and imaging device

JP7856625B2JP 7856625 B2JP7856625 B2JP 7856625B2JP-7856625-B2

Inventors

阿部卓朗
粟津亘平
渡邉優太
阿部雄大

Assignees

富士フイルム株式会社

Dates

Publication Date: 20260511
Application Date: 20211201
Priority Date: 20210224

Claims (10)

This is an image sensor unit built into the housing of the imaging device. An image sensor having an imaging surface for capturing an image of a subject and a back surface facing the imaging surface, A circuit board attached to the back surface and having an opening formed therein that exposes a part of the back surface, A first heat conduction member and a second heat conduction member through which the driving heat of the image sensor is conducted, A vibration damping function that moves the image sensor in the plane direction of the imaging surface, A third heat conductive member formed of metal, Equipped with, The first heat conductive member is connected to the second heat conductive member and has higher elasticity than the second heat conductive member. The second heat conductive member is connected to the back surface through the opening , The first heat conductive member is deformable to follow the movement of the image sensor due to the vibration damping function, and has an outer layer and an inner layer connected to the outer layer and located in the space surrounded by the outer layer. The outer layer and the inner layer have a bend that allows them to deform in accordance with the movement of the image sensor due to the vibration damping function. The second heat conductive member and the third heat conductive member each have a first piece facing the back surface and a second piece bent from the first piece and extending in the direction normal to the imaging surface and the back surface. The second piece of the second heat conductive member is inserted into the space between the outer layer and the inner layer and fixed to the first heat conductive member while being sandwiched between the outer layer and the inner layer. The second piece of the third heat conductive member is inserted into the space between the outer layer and the inner layer on the opposite side from the second piece of the second heat conductive member, and is fixed to the first heat conductive member while being sandwiched between the outer layer and the inner layer. Image sensor unit.
The circuit board is equipped with a flexible circuit board, The image sensor unit according to claim 1 , wherein the flexible substrate is arranged on the opposite side of the second piece from the first heat conductive member.
The image sensor unit according to claim 1 or claim 2 , wherein the second heat conductive member has higher thermal conductivity than the first heat conductive member.
The image sensor unit according to claim 3 , wherein the second heat conductive member is thicker than the first heat conductive member.
The image sensor unit according to any one of claims 1 to 3 , wherein the opening exposes the central region of the back surface.
The image sensor unit according to claim 5 , wherein the central region is a region on which identification information of the image sensor is written.
The first heat conductive member is formed from a graphite sheet, The image sensor unit according to any one of claims 1 to 6 , wherein the second heat conductive member is formed of metal.
The casing and The housing is housed within the image sensor unit described in any one of claims 1 to 7 , An imaging device equipped with the following features.
The imaging apparatus according to claim 8 , wherein the housing is connected to the third heat conductive member and the drive heat is conducted from the back surface.
The housing and the third heat conductive member are connected by a fourth heat conductive member. The first heat conductive member and the fourth heat conductive member are formed from graphite sheets. The imaging apparatus according to claim 9 , wherein the fourth heat conductive member is thicker than the first heat conductive member.

Description

The technology disclosed herein relates to an image sensor unit and an imaging device. Japanese Patent No. 5168047 describes a heat dissipation structure for an image sensor mounted on an image stabilization unit, characterized in that a heat dissipation member is provided near the image stabilization unit, and a metal member located near the image sensor in the image stabilization unit and the heat dissipation member are connected by a flexible member having thermal conductivity, wherein the heat dissipation member is ring-shaped surrounding the metal member, and a plurality of extensions are formed on its outer edge, and these plurality of extensions are fixed to the lens barrel or frame of the camera. Japanese Patent Publication No. 2020-067632 describes an imaging device comprising an imaging sensor, a sensor substrate on which the imaging sensor is mounted, and a metal holder having an outer shape larger than that of the imaging sensor, wherein the sensor substrate is provided with an opening that exposes an exposed portion which is a part of the main surface of the imaging sensor, and the metal holder is configured to directly contact the exposed portion through the opening. One embodiment of the technology of this disclosure provides an image sensor unit and an imaging apparatus that can prevent the heat-conducting member, which conducts the driving heat of the image sensor, from peeling off the image sensor. This is a diagram of a digital camera.This is a front-facing exploded perspective view of the image sensor unit.This is a rear view perspective of the disassembled image sensor unit.This is a rear view perspective of the main components of the image sensor unit after disassembly.This is a perspective view of the first heat conduction member, the second heat conduction member, and the third heat conduction member.These are plan views of the first heat conduction member, the second heat conduction member, and the third heat conduction member.This is a cross-sectional view of the main part of the image sensor unit.This is a perspective view of the third heat conduction member, the fourth heat conduction member, and the connecting member.This is a simplified plan view of the first heat conduction member.This figure shows the first heat-conducting member before and after bending.This figure shows how the first heat-conducting member deforms.This figure shows how the first heat-conducting member deforms.This diagram shows the heat conduction path for the drive of the image sensor.This diagram shows the first heat-conducting member with a triple-layer structure.This figure shows an octagonal first heat conduction member.This figure shows a first heat conductive member in which the corners of the connection parts of the outer layer and the corners of the connection parts of the inner layer are recessed inward.This figure shows an image sensor unit having a fifth heat-conducting member.This figure shows an image sensor unit having a fifth heat-conducting member.This is a simplified plan view of the fifth heat conduction member. Hereinafter, an example of an embodiment of the technology described herein will be explained with reference to the drawings. [First Embodiment] As an example, as shown in Figure 1, the digital camera 2 comprises a camera body 10. A lens mount 11 is provided on the front of the camera body 10. The lens mount 11 has a circular imaging aperture 12. An interchangeable imaging lens (not shown) is detachably mounted on the lens mount 11. The digital camera 2 is an example of an "imaging device" according to the technology of this disclosure. The camera body 10 is an example of a "housing" according to the technology of this disclosure. The camera body 10 has a built-in image sensor unit 15. The image sensor unit 15 is equipped with a rectangular plate-shaped image sensor 16. The image sensor 16 is, for example, a CMOS (Complementary Metal Oxide Semiconductor) image sensor or a CCD (Charge Coupled Device) image sensor. The image sensor 16 has a rectangular imaging surface 17 for imaging a subject. The imaging surface 17 receives subject light indicating the subject. As is well known, pixels that convert the received subject light into electrical signals are arranged in a two-dimensional manner on the imaging surface 17. The entire imaging surface 17 is exposed to the outside through the imaging aperture 12. A CPU (Central Processing Unit) 18 is connected to the image sensor unit 15. The CPU 18 controls the operation of the image sensor unit 15. Although not shown in the diagram, the CPU 18 is connected to memory, specifically ROM (Read Only Memory) and/or RAM (Random Access Memory), via a bus line. The computer is composed of the CPU 18, memory, and bus line. The image sensor unit 15 is equipped with an image stabilization function. The image stabilization function is a function to suppress the relative positional displacement between the subject light incident on the image sensor 17 an