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JP-7856663-B2 - Laser curing method for card wire

JP7856663B2JP 7856663 B2JP7856663 B2JP 7856663B2JP-7856663-B2

Inventors

  • ヨハネス ブルスケ
  • ヨッヘン シュタウス

Assignees

  • グロツ・ベッケルト コマンディートゲゼルシャフト

Dates

Publication Date
20260511
Application Date
20211217
Priority Date
20210202

Claims (18)

  1. A laser curing method for a card wire (10) comprising a base (11) and a plurality of teeth (12) protruding from the base, A step of forming at least one laser beam region (27) inside the working space (26), A step of supplying an inert gas (G) to the aforementioned workspace (26), The process involves transporting the card wire (10) in the transport direction (F) to the work space (26), so that the hardening target section (A) of each tooth (12) moves through the at least one laser beam region (27), so that at least one outer surface (18, 19) of each hardening target section (A) moves through the at least one laser beam region (27), and the hardening target section (A) is heated. A step of cooling the section to be hardened (A), A laser curing method that includes the following features.
  2. The method according to claim 1, characterized in that the card wire (10) moves continuously in the transport direction (F) without stopping.
  3. The method according to the present invention, characterized in that the card wire (10) moves at a constant speed in the conveying direction (F).
  4. The method according to any one of claims 1 to 3, characterized in that the at least one laser beam region (27) has a non-circular contour having a length (x) in the transport direction (F) and a width (y) perpendicular to the transport direction (F), wherein the width (y) is particularly shorter than the length (x).
  5. The method according to any one of claims 1 to 4, characterized in that the at least one laser beam region (27) includes at least one straight outer edge.
  6. The method according to claim 5, characterized in that at least one straight outer edge of the laser beam region (27) is oriented parallel to the transport direction (F).
  7. The method according to 5 or 6 , characterized in that the intensity of the laser light changes abruptly at each linear outer edge of the laser beam region (27).
  8. The method according to any one of claims 1 to 7, characterized in that the at least one laser beam region (27) is formed by at least one beamforming optical system (31) that converts the incident laser beam (30) into an exit laser beam (32), and thus the exit laser beam forms at least one of the at least one laser beam region (27).
  9. The method according to the 8th , characterized in that there is a beam dump (38) configured to capture at least a portion of the laser light of the emitted laser beam (32).
  10. The method according to 9 , characterized in that the beam dump (38) is cooled by a cooling medium (K).
  11. The method according to 9 or 10, characterized in that the beam dump (38) comprises at least one incident surface (39) of the emitted laser beam (32) which is directed obliquely with respect to the direction of propagation of the laser light passing through the at least one laser beam region ( 27 ).
  12. The method according to any one of claims 1 to 11, characterized in that the laser beam source (28) emits a laser beam (29) for forming the at least one laser beam region (27) having a wavelength of 900 nm to 1100 nm.
  13. The method according to any one of claims 1 to 12, characterized in that the period for which laser light is applied to the laser beam region (A) in the at least one laser beam region (27) is 50 ms to 70 ms.
  14. The method according to any one of claims 1 to 13, characterized in that the card wire (10) is annealed before entering the at least one laser beam region (27).
  15. The method according to any one of claims 1 to 14, characterized in that the card wire (10) is cleaned before entering the at least one laser beam region (27).
  16. The method according to any one of claims 1 to 15, characterized in that a first laser beam region (27a) and a second laser beam region (27b) located at a distance from each other are formed.
  17. The method according to 16, characterized in that the first outer surface (18) of the hardening target section (A) moves through the first laser beam region (27a), and the second outer surface (19) of the hardening target section (A) opposite to the first outer surface ( 18 ) moves through the second laser beam region (27b).
  18. The method according to any one of claims 1 to 17, characterized in that the heating of the hardening target section (A) is measured.

Description

This invention relates to a laser curing method for the curing target section of a card wire. A laser curing method is known, for example, from Patent Document 1. In this method, a laser beam is directed through an opening into a working space, and the card wire moves through this working space in the transport direction. The card wire is preheated in front of the working space in the transport direction by a gas burner. Behind the working space in the transport direction, the card wire is cooled by a spray nozzle. The working space has a spherical interior, allowing the laser light reflected from the card wire to be reflected back to the card wire from the inside of the working space. In this way, the laser light can be directed to the card wire from two opposing sides. The laser curing method for card wire is also described in Patent Document 2. Patent document 3 describes the curing of card wire by induction heating and subsequent cooling with a cooling medium. This document states that laser curing lacks advantages because localized overheating can occur due to the energy of the laser beam. Induction heating of card wire is also known from patent document 4. Patent Document 5 describes a method for hardening workpieces or tools, such as band saw blades, using an electron beam, wherein the electron beam energy is adapted to the shape and/or position of the section to be hardened. The use of lasers for laser beam cutting is known from Patent Document 6. This allows, for example, the cutting of the contour of a card wire from a workpiece. The card wire has a base around which the card wire is wound onto a roller. The teeth have a roughly triangular contour and protrude from the base. In the direction of extension of the card wire or base, two directly adjacent teeth are separated from each other by a gap. During carding, the fabric fibers are drawn out by the carding wire wound on the roller and directed circumferentially around the roller in the gaps between adjacent windings of the carding wire. This configures the teeth of the carding wire to draw out the fabric fibers and hold them until they are released. Therefore, it is desirable to provide these teeth with sufficient hardness to prevent excessive wear due to friction with the fabric fibers. The base of the carding wire needs to be elastic, as it must be wound onto the roller in sequence. Therefore, during the manufacture of all-steel carding wire for needle cloth, it is desirable for the carding wire to have different hardnesses in different areas. Therefore, at least the hardening target section of each tooth of the card wire must be hardened, while the base has a lower hardness compared to the hardening target section. This creates a transition region between the already hardened and unhardened parts. In the transition region, the hardness of the card wire is not precisely defined, which can be a drawback for the card wire or individual teeth of the card wire. Furthermore, the formation of a metal oxide layer due to heating (scaling) is also a disadvantage. Subsequently, it is generally necessary to remove the ion oxide layer again in a further process. U.S. Patent No. 4924062Swiss Patent No. 670455German Patent Application Publication No. 102014106574Japanese Patent No. 2909774German Patent No. 2018793German Patent Application Publication No. 102006030418 This is a partial schematic perspective view of an example of card wire.Figure 1 is a schematic side view of a partial card wire.This is a cross-sectional view showing a plane perpendicular to the extension direction of the card wire at the cutting line III-III in Figure 2.Figures 1 to 3 are basic schematic diagrams illustrating the progression of hardness in already hardened teeth using card wire.This is a basic schematic diagram of a curing apparatus and curing method for card wire, viewed from the direction of transport.This is a schematic diagram of the apparatus and method shown in Figure 5, viewed from a side perpendicular to the conveying direction.This is a basic diagram of the laser beam region of the present invention, where the length direction is the transport direction and the width direction is perpendicular to the transport direction.This is a very schematic diagram of a modified example of a laser curing apparatus and laser curing method for card wire. This invention relates to laser curing of a card wire 10, which is schematically shown in Figures 1 to 3. The card wire 10 comprises a base 11 extending in the longitudinal direction L. The cross-section of the base 11 may be polygonal, for example, rectangular. In the width direction B, a plurality of teeth 12 protrude from the base 11, alternately arranged in the longitudinal direction L. Between two directly adjacent teeth 12 in the longitudinal direction L, there is a gap 13. Each tooth 12 has a substantially triangular contour with a corner 14 positioned away from the base 11 in the width direction B. The corner 14 is formed