JP-7856681-B2 - Substrate processing apparatus and substrate processing method

JP7856681B2JP 7856681 B2JP7856681 B2JP 7856681B2JP-7856681-B2

Inventors

川岸稜也
大宅宗明
高村幸宏

Assignees

株式会社ＳＣＲＥＥＮホールディングス

Dates

Publication Date: 20260511
Application Date: 20240116

Claims (11)

A substrate processing apparatus for applying a processing solution to the surface of a substrate, A slit nozzle having a slit-shaped discharge port for discharging the processing liquid, Above the substrate, a nozzle moving unit moves the slit nozzle, with its discharge opening facing downward, in a direction along the surface of the substrate, relative to the substrate; A plate-shaped nozzle guard is provided on the front side of the slit nozzle in the relative movement direction in which the slit nozzle moves relative to the substrate by the nozzle moving part when the processing liquid is applied, and moves integrally with the slit nozzle. A foreign object detection unit for detecting foreign objects attached to the nozzle guard, When the foreign matter detection unit detects the foreign matter, the control unit restricts the application operation of the processing liquid to the substrate, A foreign matter removal unit for removing the foreign matter from the nozzle guard, The system includes a nozzle cleaning unit for cleaning the slit nozzle , The control unit controls the foreign matter removal unit so that the foreign matter is removed from the nozzle guard while the coating operation is restricted. The foreign matter removal unit is provided in the relative movement direction on the front side of the nozzle cleaning unit and at a distance from the nozzle cleaning unit equal to the distance from the slit nozzle to the nozzle guard. The control unit controls the nozzle cleaning unit and the foreign matter removal unit so that the cleaning of the slit nozzle by the nozzle cleaning unit and the removal of foreign matter by the foreign matter removal unit are performed at least partially in parallel. A substrate processing apparatus characterized by the following:
A substrate processing apparatus according to claim 1 , The control unit is a substrate processing apparatus that, while restricting the coating operation, prompts the user to remove the foreign matter from the nozzle guard.
A substrate processing apparatus for applying a processing solution to the surface of a substrate, A slit nozzle having a slit-shaped discharge port for discharging the processing liquid, Above the substrate, a nozzle moving unit moves the slit nozzle, with its discharge opening facing downward, in a direction along the surface of the substrate, relative to the substrate; A plate-shaped nozzle guard is provided on the front side of the slit nozzle in the relative movement direction in which the slit nozzle moves relative to the substrate by the nozzle moving part when the processing liquid is applied, and moves integrally with the slit nozzle. A foreign object detection unit for detecting foreign objects attached to the nozzle guard, Before discharging the processing liquid from the outlet of the slit nozzle toward the surface of the substrate, a preliminary discharging unit waits at a preliminary discharging position away from the substrate, discharging a predetermined amount of the processing liquid from the outlet of the slit nozzle, A control unit that controls the pre-discharge unit and the foreign object detection unit, Equipped with, The foreign object detection unit is provided in the relative movement direction on the front side of the pre-discharge unit and at a distance from the pre-discharge unit equal to the distance from the slit nozzle to the nozzle guard. A substrate processing apparatus, wherein the control unit controls the pre-discharge unit and the foreign matter detection unit so that the discharge or standby of the processing liquid in the pre-discharge unit and the detection of the foreign matter in the foreign matter detection unit are performed at least partially in parallel.
A substrate processing apparatus for applying a processing solution to the surface of a substrate, A slit nozzle having a slit-shaped discharge port for discharging the processing liquid, Above the substrate, a nozzle moving unit moves the slit nozzle, with its discharge opening facing downward, in a direction along the surface of the substrate, relative to the substrate; A plate-shaped nozzle guard is provided on the front side of the slit nozzle in the relative movement direction in which the slit nozzle moves relative to the substrate by the nozzle moving part when the processing liquid is applied, and moves integrally with the slit nozzle. A foreign object detection unit for detecting foreign objects attached to the nozzle guard, Equipped with, The foreign object detection unit is a substrate processing apparatus that detects the foreign object based on the amount of light received by the light receiver while integrally moving along the tip of the nozzle guard a light receiver that emits a parallel light beam parallel to the relative direction of movement toward the tip of the nozzle guard and a light receiver that receives the parallel light beam that has come forward without being blocked by the nozzle guard.
A substrate processing apparatus for applying a processing solution to the surface of a substrate, A slit nozzle having a slit-shaped discharge port for discharging the processing liquid, Above the substrate, a nozzle moving unit moves the slit nozzle, with its discharge opening facing downward, in a direction along the surface of the substrate, relative to the substrate; A plate-shaped nozzle guard is provided on the front side of the slit nozzle in the relative movement direction in which the slit nozzle moves relative to the substrate by the nozzle moving part when the processing liquid is applied, and moves integrally with the slit nozzle. A foreign object detection unit for detecting foreign objects attached to the nozzle guard, Equipped with, The aforementioned foreign object detection unit detects the foreign object based on a projection image of the nozzle guard taken along the tip of the nozzle guard while emitting light from a direction parallel to the relative movement direction, in a substrate processing apparatus.
A substrate processing apparatus for applying a processing solution to the surface of a substrate, A slit nozzle having a slit-shaped discharge port for discharging the processing liquid, Above the substrate, a nozzle moving unit moves the slit nozzle, with its discharge opening facing downward, in a direction along the surface of the substrate, relative to the substrate; A plate-shaped nozzle guard is provided on the front side of the slit nozzle in the relative movement direction in which the slit nozzle moves relative to the substrate by the nozzle moving part when the processing liquid is applied, and moves integrally with the slit nozzle. A foreign object detection unit for detecting foreign objects attached to the nozzle guard, Equipped with, The aforementioned foreign object detection unit detects the foreign object based on an image of the nozzle guard taken from below along the tip of the nozzle guard , in a substrate processing apparatus.
A coating step in which the processing liquid is applied to the surface of the substrate by moving the slit nozzle and a plate-shaped nozzle guard relative to the substrate while discharging the processing liquid from the discharge port of the slit nozzle with the discharge port close to the surface of the substrate, thereby preventing foreign matter from adhering to the slit nozzle with the nozzle guard, which is provided on the front side of the slit nozzle in the relative movement direction of the slit nozzle, Prior to the coating process, a detection step is performed to detect the adhesion of foreign matter to the nozzle guard, When the foreign matter is detected by the foreign matter detection unit, the process of applying the processing liquid to the substrate is restricted. With the aforementioned coating operation restricted, the foreign matter is removed from the nozzle guard by the foreign matter removal unit, The process includes a step of cleaning the slit nozzle with a nozzle cleaning unit, The foreign matter removal unit is provided in the relative movement direction on the front side of the nozzle cleaning unit and at a distance from the nozzle cleaning unit equal to the distance from the slit nozzle to the nozzle guard. The cleaning of the slit nozzle by the nozzle cleaning unit and the removal of the foreign matter by the foreign matter removal unit are performed at least partially in parallel. A substrate processing method characterized by the following:
A coating step in which the processing liquid is applied to the surface of the substrate by moving the slit nozzle and a plate-shaped nozzle guard relative to the substrate while discharging the processing liquid from the discharge port of the slit nozzle with the discharge port close to the surface of the substrate, thereby preventing foreign matter from adhering to the slit nozzle with the nozzle guard, which is provided on the front side of the slit nozzle in the relative movement direction of the slit nozzle, Prior to the coating process, a detection step is performed in which a foreign matter detection unit detects the adhesion of foreign matter to the nozzle guard, The process includes a step of discharging a predetermined amount of the processing liquid from the discharge port of the slit nozzle at a preliminary discharge position away from the substrate by a preliminary discharge unit before discharging the processing liquid from the discharge port of the slit nozzle toward the surface of the substrate, and waiting there. The foreign object detection unit is provided in the relative movement direction on the front side of the pre-discharge unit and at a distance from the pre-discharge unit equal to the distance from the slit nozzle to the nozzle guard. The discharge or standby of the processing liquid by the pre-discharge unit and the detection of the foreign matter by the foreign matter detection unit are performed at least partially in parallel. A substrate processing method characterized by the following:
A coating step in which the processing liquid is applied to the surface of the substrate by moving the slit nozzle and a plate-shaped nozzle guard relative to the substrate while discharging the processing liquid from the discharge port of the slit nozzle with the discharge port close to the surface of the substrate, thereby preventing foreign matter from adhering to the slit nozzle with the nozzle guard, which is provided on the front side of the slit nozzle in the relative movement direction of the slit nozzle, Prior to the coating process, a detection step is performed in which a foreign matter detection unit detects the adhesion of foreign matter to the nozzle guard, Equipped with, The foreign object detection unit integrates a light emitter that projects a parallel light beam parallel to the relative movement direction toward the tip of the nozzle guard, and a light receiver that receives and receives the parallel light beam that has come forward without being blocked by the nozzle guard, and detects the foreign object based on the amount of light received by the light receiver while moving these together along the tip of the nozzle guard. A substrate processing method characterized by the following:
A coating step in which the processing liquid is applied to the surface of the substrate by moving the slit nozzle and a plate-shaped nozzle guard relative to the substrate while discharging the processing liquid from the discharge port of the slit nozzle with the discharge port close to the surface of the substrate, thereby preventing foreign matter from adhering to the slit nozzle with the nozzle guard, which is provided on the front side of the slit nozzle in the relative movement direction of the slit nozzle, Prior to the coating process, a detection step is performed in which a foreign matter detection unit detects the adhesion of foreign matter to the nozzle guard, Equipped with, The foreign object detection unit detects the foreign object based on a projection image of the slit nozzle, which is captured along the tip of the slit nozzle while emitting light from a direction parallel to the relative movement direction. A substrate processing method characterized by the following:
A coating step in which the processing liquid is applied to the surface of the substrate by moving the slit nozzle and a plate-shaped nozzle guard relative to the substrate while discharging the processing liquid from the discharge port of the slit nozzle with the discharge port close to the surface of the substrate, thereby preventing foreign matter from adhering to the slit nozzle with the nozzle guard, which is provided on the front side of the slit nozzle in the relative movement direction of the slit nozzle, Prior to the coating process, a detection step is performed in which a foreign matter detection unit detects the adhesion of foreign matter to the nozzle guard, Equipped with, The foreign object detection unit detects the foreign object based on an image of the slit nozzle taken from below along the tip of the slit nozzle. A substrate processing method characterized by the following:

Description

This invention relates to a substrate processing technology for supplying and coating a processing solution from a slit nozzle onto substrates for precision electronic devices such as glass substrates for FPDs (Flat Panel Displays) like liquid crystal displays and organic EL displays, semiconductor wafers, glass substrates for photomasks, substrates for color filters, substrates for recording disks, substrates for solar cells, substrates for electronic paper, and substrates for semiconductor packages (hereinafter simply referred to as "substrates"). A substrate processing apparatus is known that applies a processing liquid to a substrate by discharging a processing liquid from a slit nozzle, which has a slit-shaped discharge opening, while moving the slit nozzle relative to the substrate. For example, in the apparatus described in Patent Document 1, the substrate is held on the stage surface of the stage, and the processing liquid is applied by moving the slit nozzle above the stage surface. On the other hand, in the apparatus described in Patent Document 2, the substrate is moved in a so-called levitation method while the slit nozzle is positioned at a predetermined application position above the stage surface of the stage. More specifically, the substrate is levitated by a pressurized gas layer formed on the stage surface by a gas flow passing through gas holes provided on the stage surface, and the processing liquid is applied by moving the substrate so that it passes through an application area sandwiched between the slit nozzle and the stage surface. Although the substrate transport methods differ in this way, nozzle guards are provided in both apparatuses. This is to take into consideration that foreign matter or protrusions (hereinafter referred to as "foreign matter") may protrude upward on the surface side of the substrate. That is, if the processing liquid is applied while these foreign matter are present, the slit nozzle will collide with the foreign matter, hindering the application of the processing liquid. In other words, the above-mentioned collision can adversely affect the applied processing liquid and the slit nozzle. Therefore, in the conventional apparatus described above, a nozzle guard is positioned in front of the slit nozzle in the relative movement direction relative to the substrate. Japanese Patent Publication No. 2006-102609Japanese Patent Publication No. 2011-212544 This figure schematically shows the overall configuration of a coating apparatus, which is a first embodiment of the substrate processing apparatus according to the present invention.Figure 1 is a schematic side view of the coating apparatus shown.This is a perspective view showing the overall configuration and operation of the foreign object detection unit.This diagram schematically illustrates the operation of the foreign object detection unit.This flowchart shows the coating operation performed by the coating apparatus shown in Figure 1.This figure schematically illustrates the foreign matter detection operation in a coating apparatus, which is a second embodiment of the substrate processing apparatus according to the present invention.This figure schematically illustrates the foreign matter detection operation in a coating apparatus, which is a third embodiment of the substrate processing apparatus according to the present invention.This is a schematic side view showing a coating apparatus, which is a fourth embodiment of the substrate processing apparatus according to the present invention.This figure schematically illustrates the operation of a dry guard cleaner, which is an example of a foreign matter removal unit equipped in a coating apparatus, which is a fifth embodiment of the substrate processing apparatus according to the present invention.Figure 9 is a schematic diagram illustrating the operation of the dry guard cleaner.This figure schematically illustrates the operation of a dry guard cleaner, which is an example of a foreign matter removal unit equipped in a coating apparatus, which is a sixth embodiment of the substrate processing apparatus according to the present invention.Figure 11 is a schematic diagram illustrating the operation of the dry guard cleaner.This is a schematic perspective view showing the configuration and operation of a dry guard cleaner, which is an example of a foreign matter removal unit equipped in a coating apparatus, which is a seventh embodiment of the substrate processing apparatus according to the present invention.Figure 13 is a schematic diagram illustrating the operation of the dry guard cleaner.This is a schematic perspective view showing the configuration and operation of a dry guard cleaner, which is an example of a foreign matter removal unit equipped in a coating apparatus, which is the eighth embodiment of the substrate processing apparatus according to the present invention.Figure 15 is a schematic diagram illustrating the operation of the dry guard cleaner.This