JP-7856708-B2 - Polyamide film, method for manufacturing the same, and cover window and display device containing the same

Inventors

• キム、ハンジュン
• オ、デソン
• キム、ソンファン
• イ、ジンウ
• キム、フンシク
• リュ、ジヨン

Assignees

• マイクロワークス ソリューションズ 株式会社

Dates

Publication Date

20260511

Application Date

20240826

Priority Date

20200929

Claims (8)

1. Contains polyamide polymers, It includes a first IR peak having a maximum value in the wavenumber interval of 2950 cm⁻¹ to 2900 cm⁻¹ on the IR spectrum, and a second IR peak having a maximum value in the wavenumber interval of 2875 cm⁻¹ to 2825 cm⁻¹ . The area of the first IR peak is 1.4 times or less the area of the second IR peak. The polyamide polymer comprises two or more amide repeating units, The two or more amide repeating units include a first amide repeating unit derived from a first dicarbonyl compound and a second amide repeating unit derived from a second dicarbonyl compound. The angle between the two carbonyl groups in the first dicarbonyl compound is 160° to 180°. A polyamide film in which the angle between the two carbonyl groups in the second dicarbonyl compound is 80° to 140° .
2. The polyamide film according to claim 1, wherein the area of the first IR peak is 0.6 times or more the area of the second IR peak.
3. The polyamide film according to claim 1, wherein the area of the first IR peak is 0.8 to 1.2 times the area of the second IR peak.
4. Based on a film thickness of 50 μm, Modulus is 5 GPa or higher, Transmittance of 80% or more, Haze is less than 1%, A polyamide film according to claim 1, wherein the yellowness is 3.5 or less.
5. A cover window for a display device, comprising the polyamide film and functional layer described in claim 1.
6. Display unit and The display unit includes a cover window, The cover window comprises the polyamide film and functional layer described in claim 1, in a display device.
7. The process involves polymerizing a diamine compound and a dicarbonyl compound in an organic solvent to prepare a polymer solution containing a polyamide polymer at a temperature of -20°C to 25°C , The steps include: casting the polymer solution to produce a gel sheet; The step includes heat treatment of the gel sheet, The dicarbonyl compound comprises a first dicarbonyl compound and a second dicarbonyl compound having a smaller angle between the two carbonyl groups than the first dicarbonyl compound. The step of preparing a polymer solution containing the polyamide polymer is as follows: The step of adding a diamine compound to an organic solvent and dissolving it, The first step involves adding a first dicarbonyl compound and stirring, then adding a second dicarbonyl compound and stirring to prepare a first polymer solution. The steps include: adding the first dicarbonyl compound or the second dicarbonyl compound and stirring to prepare the second polymer solution; The steps of adding the first or second dicarbonyl compound and stirring to prepare the third polymer solution are carried out sequentially. The content of the first dicarbonyl compound or the second dicarbonyl compound added in the step of preparing the second polymer solution is 0.5 mol% to 15 mol% based on the total number of moles of the dicarbonyl compounds. The content of the first dicarbonyl compound or the second dicarbonyl compound added in the step of preparing the third polymer solution is 0.5 mol% to 15 mol% based on the total number of moles of the dicarbonyl compounds. The method for producing a polyamide film according to claim 1, wherein the molar ratio of the first dicarbonyl compound to the second dicarbonyl compound is 10:90 to 79:21 .
8. A method for producing a polyamide film according to claim 7, wherein the first dicarbonyl compound is added in the step of preparing the second polymer solution, and the second dicarbonyl compound is added in the step of preparing the third polymer solution.

Description

Examples of implementations include polyamide films with excellent optical and mechanical properties, methods for manufacturing the same, and cover windows and display devices containing the same. Polyamide polymers exhibit excellent resistance to friction, heat, and chemicals, and are used in primary electrical insulation materials, coatings, adhesives, extrusion resins, heat-resistant paints, heat-resistant plates, heat-resistant adhesives, heat-resistant fibers, and heat-resistant films. Polyamides are used in a variety of fields. For example, polyamides are made in powder form and used as coatings for metals or magnetic wires, often mixed with other additives depending on the application. Polyamides are also used in conjunction with fluoropolymers as decorative and corrosion-resistant coatings, acting as a bonding agent for fluoropolymers to metal substrates. Furthermore, polyamides are used to coat kitchen utensils, possessing heat and chemical resistance, and are used as membranes in gas separation systems, including in natural gas wells for filtering contaminants such as carbon dioxide, hydrogen sulfide, and other impurities. Recently, polyamide films have been developed that are less expensive while possessing excellent optical, mechanical, and thermal properties, by forming polyamides into films. Such polyamide films can be applied to display materials such as organic light-emitting diodes (OLEDs) or liquid crystal displays (LCDs), and can be used as anti-reflective films, compensation films, or phase difference films when achieving phase difference properties. When applying such polyamide films to foldable displays, flexible displays, and other applications, optical properties such as transparency and colorlessness, as well as mechanical properties such as flexibility and hardness, are required. However, there is generally a trade-off relationship between optical properties and mechanical properties; improving mechanical properties may reduce optical properties. Therefore, there is a continuing need for research into polyamide films that exhibit improved mechanical and optical properties. Figure 1 shows a cross-sectional view of a display device based on one implementation example.Figure 2 shows a schematic flowchart of a method for manufacturing a polyamide film according to one implementation example.Figure 3 is a schematic flowchart illustrating the manufacturing steps of a polyamide polymer solution based on some implementation examples.Figure 4 shows the XRD analysis graph (diffractogram) for the polyamide film of Example 1.Figure 5 shows the FT-IR analysis spectra of the polyamide films of the examples and comparative examples.Figure 6 shows the FT-IR analysis spectrum for the polyamide film of Example 7.Figure 7 shows the FT-IR analysis spectrum for the polyamide film of Comparative Example 5.Figure 8 shows the FT-IR analysis spectrum for the polyamide film of Comparative Example 6. The following describes examples of implementations with reference to the accompanying drawings, so that those with ordinary skill in the art to which the present invention pertains can easily carry them out. However, the examples of implementation may be carried out in various different forms and are not limited to those described herein. In this specification, when a film, window, panel, or layer is described as being formed "on" or "under" another film, window, panel, or layer, "on" and "under" include all formations that are formed "directly" or "indirectly" through other components. The criteria for on/under each component are explained based on the drawings. Note that the sizes of components in the drawings may be exaggerated for illustrative purposes and do not represent the actual sizes applied. Furthermore, throughout this specification, the same reference numeral refers to the same component. In this specification, when a part is said to "include" a component, unless otherwise stated, it means that it may include other components, rather than excluding them. In this specification, singular expressions are interpreted as including singular or plural nouns, as interpreted in the context, unless otherwise specified. Furthermore, all figures and expressions describing the quantities of components, reaction conditions, etc., as described herein should be understood to be modified by the term "approximately" unless otherwise specified. In this specification, terms such as "first," "second," etc., are used to describe various components, and such components are not limited to those defined by these terms. These terms are used solely to distinguish one component from another. Furthermore, in this specification, "substituted" means, unless otherwise specified, that the molecule is substituted with one or more substituents selected from the group consisting of deuterium, -F, -Cl, -Br, -I, hydroxyl group, cyano group, nitro group, amino group, amidino group, hydrazine group, hydrazone group, ester group, ketone g