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JP-7856724-B2 - Multi-node server

JP7856724B2JP 7856724 B2JP7856724 B2JP 7856724B2JP-7856724-B2

Inventors

  • 陳 勃翰
  • 劉 威呈

Assignees

  • 和碩聯合科技股▲分▼有限公司

Dates

Publication Date
20260511
Application Date
20241016
Priority Date
20231109

Claims (11)

  1. Server case and A main circuit board installed inside the server case, having a first node area and a second node area, A power adapter circuit board is mounted vertically on the main circuit board, and has a first power input connector and a second power input connector on its first side surface, and a first power output connector facing the first node area and a second power output connector facing the second node area on its second side surface opposite to the first side surface, A signal adapter module including a first signal connector, a second signal connector, and a signal adapter circuit board installed in a direction parallel to the main circuit board and electrically connecting the first signal connector and the second signal connector, A multi-node server characterized by having the following features.
  2. The signal adapter circuit board comprises an intermediate segment, a first adapter segment, and a second adapter segment, the intermediate segment connecting the first adapter segment and the second adapter segment, the width of the intermediate segment being narrower than the widths of the first and second adapter segments, forming a ventilation recess, and the width of the ventilation recess corresponding to the first power input connector and the second power input connector, as described in claim 1.
  3. The multi-node server according to claim 2, wherein the signal adapter circuit board is installed elevated above the main circuit board, the first signal connector is installed on the bottom surface of the first adapter segment, and the second signal connector is installed on the bottom surface of the second adapter segment.
  4. The multi-node server according to claim 3, wherein the first signal connector has a first engagement end face, the second signal connector has a second engagement end face, the first engagement end face faces the first node area, and the second engagement end face faces the second node area.
  5. The multi-node server according to claim 1, wherein the power adapter circuit board is located between the first signal connector and the second signal connector.
  6. The multi-node server according to claim 1, wherein the first power input connector is positioned facing away from the first node area and connected to the first power supply, and the second power input connector is positioned facing away from the second node area and connected to the second power supply.
  7. The multi-node server according to claim 1, wherein a first identification connector and a second identification connector are further provided on the second side surface of the power adapter circuit board.
  8. The multi-node server according to claim 7, wherein a first alignment device and a second alignment device are further provided on the second side surface of the power adapter circuit board.
  9. The multi-node server according to claim 8, wherein the first identification connector is located between the first alignment device and the first power input connector, and the second identification connector is located between the second alignment device and the second power input connector.
  10. The multi-node server according to claim 1, wherein an intermediate fixing portion, a first side fixing portion, and a second side fixing portion are formed on the upper edge of the power adapter circuit board, the intermediate fixing portion is located between the first side fixing portion and the second side fixing portion, and ventilation grooves are formed on both sides of the intermediate fixing portion.
  11. The multi-node server according to claim 1, further comprising an air guide cover, the air guide cover being installed outside the first and second power input connectors, the air guide cover including an arc-shaped portion and a pair of side shrouds, the pair of side shrouds each connected to both sides of the arc-shaped portion.

Description

This invention relates to a multi-node server, and more particularly to a server having two or more nodes. Traditionally, common server configurations include single-node servers and multi-node servers. A "node" refers to a basic unit within a data structure that stores and processes data. Types of nodes include, for example, "computation nodes" responsible for computation, "storage nodes" for data storage, "network nodes" that connect different nodes and provide external connectivity to the entire computing cluster, and "control nodes" for users to manage the entire computing cluster. Multi-node servers offer greater flexibility in function placement and scalability compared to single-node servers. Currently, typical multi-node servers primarily consist of Central Processing Unit (CPU) compute nodes. Each CPU compute node can be combined with different access interfaces (I/O ports), data storage hardware (Storage Disk), and expansion cards (Add-On Card) to create a configuration tailored to various requirements. When deep computing is required using artificial intelligence (AI), one of the nodes can be replaced with a computing node equipped with a graphics processing unit (GPU). Furthermore, when high-density data storage is required, one of the nodes can be replaced with a storage node equipped with multiple storage disk slots. While existing single-node systems allow for rapid replacement, each node performs computations independently and lacks signal connectivity between nodes. To implement nodes with the two distinct functions described above, it is necessary to connect signals from one of the nodes to the CPU computing node. Generally, signal lines are used to connect these signals, but limitations in signal line length and cable management prevent rapid replacement in single-node systems. Therefore, overcoming the aforementioned shortcomings through structural design improvements, in order to enable multi-node servers to be quickly replaced by other computing nodes, is a challenge that needs to be addressed in this field. This is a three-dimensional exploded view showing the multi-node server of the present invention.This is an exploded view showing the vertical integrated circuit substrate module of the present invention.A three-dimensional assembly diagram showing the vertical integrated circuit substrate module of the present invention.Another three-dimensional composite diagram showing the vertical integrated circuit substrate module of the present invention.This is a top view showing the multi-node server of the present invention.This is a schematic diagram showing the heat dissipation airflow of the multi-node server of the present invention. Referring to Figures 1 to 5, an embodiment of the present invention provides a multi-node server 100, which includes a server case 10, a main circuit board 20, a power adapter circuit board 30, and a signal adapter module 40. The main circuit board 20 is installed within the server case 10 and includes at least two node areas, namely a first node area A1 and a second node area A2, but the present invention is not limited thereto. For example, one of the node areas may house a central processing unit (CPU) computing node, and the other node area may contain a graphics processing unit (GPU) computing node or a memory node. The power adapter circuit board 30 and the signal adapter module 40 can be referred to as vertical integrated circuit board modules. As shown in Figures 1 to 3, the power adapter circuit board 30 is mounted vertically on the main circuit board 20. The power adapter circuit board 30 has two opposing sides: the first side faces the power supply (P1, P2), and the second side faces the opposite side, i.e., the node area (A1, A2). The first side of the power adapter circuit board 30 is provided with a first power input connector 31A and a second power input connector 31B. The second side of the power adapter circuit board 30 is provided with a first power output connector 32A and a second power output connector 32B. The first power output connector 32A faces the first node area A1, and the second power output connector 32B faces the second node area A2. The power input connector 31A faces away from the first node area A1 and is positioned to receive power from the first power supply P1. The first power input connector 31A is connected to the first power output connector 32A and the second power output connector 32B via the plate body 32 of the power adapter circuit board 30, supplying power to the first node device N1 and the second node device N2 (see Figure 6). The second power input connector 31B faces away from the second node area A2 and is positioned to receive power from the second power supply P2. Similarly, the second power input connector 31B is connected to the first power output connector 32A and the second power output connector 32B via the plate body 32 of the power adapter circuit board 30, supplying power to the first node devi