JP-7856730-B2 - Relay movable spring and relay capable of reducing temperature rise

JP7856730B2JP 7856730 B2JP7856730 B2JP 7856730B2JP-7856730-B2

Inventors

ジョン，シュミン
ダイ，ウェングアン
リ，ファンノン
リャオ，グォジン

Assignees

シァメンホンファエレクトリックパワーコントロールズカンパニーリミテッド

Dates

Publication Date: 20260511
Application Date: 20241121
Priority Date: 20201215

Claims (12)

A relay having a multi-contact structure, comprising a base, a magnetic circuit structure and at least two contact structures, A relay having a multi-contact structure, characterized in that the base is provided with at least two grooves equal to the number of contact structures, the at least two grooves are alternately arranged on opposite sides of the base so that each groove is located in the same row of the base, each contact structure is mounted in the corresponding groove, the magnetic circuit structure is mounted in the base and is linked to a movable spring in each contact structure, thereby driving the operation of the corresponding movable spring when the magnetic circuit structure operates, spatially separating the mounting positions of each contact structure, and reducing the temperature rise due to an increase in rated current.
A relay having a multi-contact structure according to claim 1, characterized in that the magnetic circuit structure and one of the at least two contact structures are mounted in the same groove, the armature in the magnetic circuit structure is connected to a movable spring in one of the contact structures to actuate the corresponding movable spring when the magnetic circuit structure is operating, and in each groove, through holes are provided between adjacent grooves, and the armature in the magnetic circuit structure passes through the corresponding through holes and is connected to the movable spring in the contact structure in the corresponding groove to actuate the corresponding movable spring when the magnetic circuit structure is operating.
The relay having a multi-contact structure according to claim 2, wherein a baffle for separating high and low currents is provided in the groove to which the magnetic circuit structure and one contact structure are attached, and the baffle is located between the one contact structure and the magnetic circuit structure.
The relay having a multi-contact structure according to claim 3, characterized in that there are two contact structures, and the mounting position of one contact structure in the groove is closer to the other contact structure than to the magnetic path structure.
The relay having a multi-contact structure according to claim 4, wherein the armature in the magnetic circuit structure is H -shaped, both ends of the armature are connected to push portions and, via the corresponding push portions, to a movable spring in the corresponding contact structure, and the through hole is provided at a position corresponding to the armature.
The relay having a multi-contact structure according to claim 1, wherein the movable spring in the at least two contact structures includes a movable contact, a movable spring plate, and a movable spring lead plate, one end of the movable spring plate is connected to the movable spring lead plate, the other end of the movable spring plate fixes the movable contact, and at least one straight slit extends from the end of the movable spring plate toward the connection point with the movable spring lead plate toward the other end, dividing the movable spring plate into at least two current carrier conductors, and there are at least two movable contacts, each fixed to a corresponding current carrier conductor, thereby forming at least two parallel connection structures for the movable spring plate.
The relay having a multi-contact structure according to claim 6, characterized in that at least one of the two current carrier conductors of the movable spring plate has a larger width dimension.
A relay having a multi-contact structure according to claim 7, characterized in that at least one of the at least two movable contacts has a larger thickness dimension.
The relay having a multi-contact structure according to claim 8, characterized in that the movable contact with a large thickness is fixed to the current carrier conductor with a large width.
A relay having a multi-contact structure according to claim 6, characterized in that a connecting sheet is further attached to the surface of the movable spring plate facing the fixed contact, and the connecting sheet is connected between each movable contact.
The relay having a multi-contact structure according to any one of claims 6 to 10, characterized in that the movable spring plate is formed by stacking a plurality of spring plates.
The relay having a multi-contact structure according to claim 11, characterized in that a U-shaped bend is provided in the middle portion of the movable spring plate.

Description

This invention relates to the field of relay technology, and more particularly to a movable spring for a relay and a relay. A relay is an electronically controlled device that comprises a control system (also called an input circuit) and a controlled system (also called an output circuit), and is generally applied to automatic control circuits. In practice, a relay is an automatic switch that controls a large current with a small current, and therefore performs functions such as automatic adjustment, safety protection, and conversion in a circuit. Relays are heat-sensitive components; exceeding the tolerable temperature accelerates the deterioration of the plastic and insulating materials inside the relay, leading to oxidative corrosion of the contacts, making arc extinguishing difficult, attenuating the technical parameters of the electrical element, and resulting in reduced reliability. The movable spring in a relay is a component prone to temperature rise. Most movable springs consist of a movable contact, a movable spring plate, and a movable spring lead plate. The movable contact is fixed to one end of the movable spring plate, and the other end is fixed to the movable spring lead plate. During relay operation, the end of the movable spring plate to which the movable contact is fixed oscillates around the other end (the end fixed to the movable spring lead plate). The movable spring plate is both an operating component and a current carrier; therefore, it is the component in the movable spring most susceptible to temperature rise. Conventional technology generally adjusts the rated current within an appropriate range to meet temperature requirements. With the expansion of relay applications, relays have evolved towards higher loads and miniaturization. The increase in rated current inevitably raises the temperature of the movable spring plate, making the effective reduction of this temperature rise an urgent issue. The object of the present invention is to provide a movable spring for a relay that can reduce temperature rise by solving the shortcomings of the prior art and improving the structure, thereby reducing the effect of temperature rise due to an increase in rated current, meeting the temperature rise requirements, and eliminating the problems such as accelerated deterioration of the plastic and insulating materials inside the relay due to the relay's temperature rise exceeding the requirements, oxidative corrosion of the contacts making arc extinguishing difficult, attenuation of the technical parameters of the electrical element, and decreased reliability. The technical solution used by the present invention to solve its technical problems is as follows: A movable spring for a relay capable of reducing temperature rise, comprising a movable contact, a movable spring plate, and a movable spring lead plate, wherein the movable spring plate has opposing first and second ends, the first end being connected to the movable spring lead plate, the movable spring plate includes at least two current carrier conductors, the movable contacts are at least two and are fixed to the at least two current carrier conductors respectively and are close to the second end of the movable spring plate, thereby the movable spring plate forming at least two parallel connection structures, and a connecting sheet is further attached to the movable spring plate, the connecting sheet being connected to the at least two movable contacts. According to one embodiment of the present invention, at least one linear slit extends along the direction from the second end to the first end of the movable spring plate, and the at least one linear slit divides the movable spring plate into at least two current carrier conductors. According to one embodiment of the present invention, at least one of the two current carrier conductors of the movable spring plate has a larger width dimension. According to one embodiment of the present invention, at least one of the two movable contacts has a larger thickness. According to one embodiment of the present invention, the movable contact with a large thickness is fixed to the current carrier conductor with a large width. According to one embodiment of the present invention, the movable spring plate includes a plurality of stacked sub-spring plates. According to one embodiment of the present invention, a U-shaped bend is provided in the intermediate portion of the movable spring plate. According to one embodiment of the present invention, the movable spring plate includes a first sub-spring plate, a second sub-spring plate, a third sub-spring plate, and a fourth sub-spring plate stacked in order. Each of the first, second, third, and fourth sub-spring plates is provided with two linear slits, thereby forming three current carrier conductors. The movable contacts are two or three in number and are fixed to the corresponding current carrier conductors, forming the movable spring plate as a three-p