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JP-7856772-B2 - Low dielectric resin compositions, adhesion promoters, low dielectric adhesive compositions, low dielectric adhesive molded products, low dielectric adhesives, and laminates

JP7856772B2JP 7856772 B2JP7856772 B2JP 7856772B2JP-7856772-B2

Inventors

  • 坂本 奈津季
  • 廣田 義人

Assignees

  • 三井化学株式会社

Dates

Publication Date
20260511
Application Date
20230807
Priority Date
20220815

Claims (14)

  1. A low-dielectric resin composition containing a polyolefin resin, The aforementioned polyolefin resin Styrene-based elastomer (A) and It contains a cyclic olefin polymer (B) having an alicyclic ring in its main chain, With respect to 100 parts by mass of the total amount of the styrene-based elastomer (A) and the cyclic olefin polymer (B), the content ratio of the styrene-based elastomer (A) is 30 parts by mass or more and 89 parts by mass or less. The styrene-based elastomer (A) contains structural units derived from styrene, and the proportion of structural units derived from styrene relative to the total amount of the styrene-based elastomer (A) is 5% by mass or more and 90% by mass or less. The weight-average molecular weight of the styrene-based elastomer (A) is between 10,000 and 500,000. A low-dielectric resin composition in which the glass transition temperature of the cyclic olefin polymer (B) is 70°C or higher and 120°C or lower.
  2. The weight-average molecular weight of the styrene-based elastomer (A) is between 70,000 and 110,000. The low dielectric resin composition according to claim 1.
  3. The low-dielectric resin composition according to claim 1, wherein the styrene-based elastomer (A) contains structural units derived from styrene, and the content ratio of the structural units derived from styrene relative to the total amount of the styrene-based elastomer (A) is 10% by mass or more and 40% by mass or less.
  4. The low-dielectric resin composition according to claim 1, wherein the styrene-based elastomer (A) does not contain structural units derived from butylene.
  5. The low-dielectric resin composition according to claim 1, wherein the glass transition temperature of the cyclic olefin polymer (B) is 100°C or higher.
  6. The low-dielectric resin composition according to claim 1, wherein the polyolefin resin is modified with a functional group-containing monomer.
  7. The low-dielectric resin composition according to claim 6, wherein the functional group-containing monomer includes a carboxyl group-containing monomer.
  8. An adhesion promoter comprising the low-dielectric resin composition described in claim 1.
  9. It contains a thermosetting resin and the adhesion agent described in claim 8, A low-dielectric adhesive composition wherein the thermosetting resin comprises at least one selected from the group consisting of epoxy resins, polyphenylene ether resins, fluororesins, polyimide resins, phenolic resins, melamine resins, polyolefin resins having unsaturated double bonds, and liquid crystal polymers.
  10. A low-dielectric adhesive molded article comprising a cured product of the low-dielectric adhesive composition described in claim 9.
  11. An insulating layer comprising the low dielectric adhesive molded product described in claim 10, A laminate comprising a conductive layer disposed on at least one side of the insulating layer.
  12. A low-dielectric adhesive comprising the low-dielectric resin composition described in claim 1.
  13. Insulating layer and, A conductor layer positioned opposite the insulating layer, The system comprises an adhesive layer disposed between the insulating layer and the conductor layer, which adheres the insulating layer and the conductor layer together. A laminate in which the adhesive layer comprises the low-dielectric adhesive described in claim 12.
  14. The first conductor layer, A second conductor layer is disposed opposite to the first conductor layer, The device comprises an adhesive layer disposed between the first conductor layer and the second conductor layer, which adheres the first conductor layer and the second conductor layer together. A laminate in which the adhesive layer comprises the low-dielectric adhesive described in claim 12.

Description

The present invention relates to a low-dielectric resin composition, an adhesion promoter, a low-dielectric adhesive composition, a low-dielectric adhesive molded product, a low-dielectric adhesive, and a laminate. A wiring circuit board comprises, for example, a resin layer (insulating layer) containing a thermosetting resin and a conductive layer containing a metal. Wiring circuit boards are widely used in various industrial fields. In recent years, there has been a demand for direct bonding between the resin layer (insulating layer) and the conductor layer in wiring circuit boards. Therefore, it has been proposed to add an adhesion promoter to the resin layer (insulating layer) to impart adhesive properties to it. As an adhesion promoter, for example, a resin having relatively high adhesion and a relatively low dielectric constant is used. As such a resin, for example, the following low dielectric constant resin has been proposed. This low dielectric constant resin includes a maleic anhydride graft-modified resin. As the maleic anhydride graft-modified resin, either a maleic anhydride graft (styrene-ethylene-butylene-styrene) block copolymer or a maleic anhydride graft cyclic olefin copolymer is used alone (see, for example, Patent Document 2 (Examples 1 and 4)). Furthermore, in wiring circuit boards, it is also required that the resin layer (insulating layer) and the conductor layer be bonded together using an interlayer adhesive, rather than directly bonded together. As an interlayer adhesive, for example, a resin having relatively high adhesion and a relatively low dielectric constant is used. For example, the following resin has been proposed. That is, this resin comprises a mixture of maleic acid-modified propylene-1-butene copolymer and maleic acid-modified styrene-ethylene-propylene-styrene copolymer. More specifically, the above resin is produced by modifying a mixture of propylene-1-butene copolymer and styrene-ethylene-propylene-styrene copolymer with maleic acid (see, for example, Patent Document 1 (Production Example 5 and Example 1)). Japanese Patent Publication No. 2018-154823Japanese Patent Publication No. 2022-043966 Figure 1 is a schematic diagram showing a copper-clad laminate as a first embodiment of the laminate.Figure 2 is a schematic diagram showing a circuit board as a second embodiment of the laminate.Figure 3 is a schematic diagram showing a copper-clad laminate as a third embodiment of the laminate.Figure 4 is a schematic diagram showing a circuit board as a fourth embodiment of the laminate.Figure 5A shows the process for preparing a carrier-attached copper foil in a process diagram for manufacturing a circuit board as a fifth embodiment of the laminate, Figure 5B shows the process for forming the first resist layer, and Figure 5C shows the process for forming the first conductor layer.Figure 6D shows the process of removing the first resist layer in the manufacturing process for the circuit board following Figure 5, Figure 6E shows the process of removing the copper foil exposed from the first conductor layer, Figure 6F shows the process of laminating the adhesive layer, and Figure 6G shows the process of laminating the carrier-attached copper foil onto the adhesive layer.Figure 7H shows the process for manufacturing a circuit board following Figure 6, specifically the step of peeling off the carrier layer; Figure 7I shows the step of forming via holes; Figure 7J shows the step of forming via fills; and Figure 7K shows the step of forming the second resist layer.Figure 8L, following Figure 7, shows the process for manufacturing a circuit board, specifically the process of forming the second conductor layer; Figure 8M shows the process of removing the second resist layer; Figure 8N shows the process of removing the copper foil exposed from the second conductor layer; and Figure 8O shows the process of peeling off the carrier layer. 1. Low-dielectric resin composition The low-dielectric resin composition is, for example, a resin composition included in the insulating layer (described later) or adhesive layer (described later) in the laminate described later. The low-dielectric resin composition contains a polyolefin resin. The polyolefin resin contains a styrene elastomer (A) and a cyclic olefin polymer (B) having an alicyclic ring in its main chain. (1) Styrene-based elastomers Examples of styrene-based elastomers (A) include copolymers of styrene and chain-like olefins. Examples of chain-like olefins include those having 2 to 8 carbon atoms. Examples of chain-like olefins having 2 to 8 carbon atoms include ethylene, propylene, butylene (butene), pentene, hexene, octene, and 3-methyl-1-pentene. These can be used individually or in combination of two or more. Preferably, the chain-like olefins include ethylene used alone, propylene used alone, and ethylene and propylene used in combination. More preferably, the chain-like olefin is a combination of ethylene and propylene. The st