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JP-7856784-B2 - Component mounting device

JP7856784B2JP 7856784 B2JP7856784 B2JP 7856784B2JP-7856784-B2

Inventors

  • 北田 佳夫
  • 春日 大介

Assignees

  • ヤマハ発動機株式会社

Dates

Publication Date
20260511
Application Date
20221005

Claims (7)

  1. A parts supply unit having a parts placement area where multiple parts arranged in a matrix are placed, A component recognition unit having a camera that captures images of the component in the component placement area, and a processing unit that recognizes the position of the component in the component placement area based on the image acquired by the camera, A head unit having multiple heads that can move between a component mounting area and a component placement area on which the circuit board on which the component is mounted is located, and which picks the component in the component placement area and mounts the component on the circuit board in the component mounting area, With respect to the circuit board placed in the aforementioned component mounting area, an inspection unit is provided to check whether components can be mounted at predetermined mounting points, A first control unit that controls the operation of the component recognition unit and the inspection unit, The system includes a second control unit that performs picking setting processing to determine which of the multiple heads will pick each of the multiple parts, and the picking order of the multiple parts by the multiple heads. The first control unit performs in parallel the recognition of the position of the component by the component recognition unit and the inspection of whether or not it can be mounted by the inspection unit. In a component mounting device, the second control unit performs the picking setting process based on the results of the parallel-executed position recognition and mounting feasibility inspection of the component, As a first process, the second control unit assumes that there are no mounting points that are unsuitable for mounting in the mounting suitability inspection, and provisionally sets the picking configuration. If, in the inspection of whether or not a mounting point can be mounted, an unsuitable mounting point is identified, the second control unit, as a second process following the first process, removes the unsuitable mounting point from the allocation target and performs the picking setting again, in a component mounting device.
  2. In the component mounting device according to claim 1 , The component mounting device wherein the second control unit performs the picking settings in the second process before the head unit performs the picking.
  3. In the component mounting device according to claim 1 , The second control unit performs the picking settings in the second process so that components that were assigned to mounting points where mounting is not possible in the first process do not remain in the component placement area.
  4. In the component mounting device described in claim 3 , A component mounting apparatus, wherein the second control unit sets the picking settings in the second process such that the amount of movement of the head unit during component mounting, when the plurality of heads each mount the component onto the substrate, is smaller than the amount of movement of the head unit during picking, when the plurality of heads each pick up the component.
  5. In the component mounting device described in claim 3 , A component mounting apparatus, wherein the second control unit sets the picking settings in the second process such that the amount of movement of the head unit during picking, in which the plurality of heads each pick up the components, is smaller than the amount of movement of the head unit during component mounting, in which the plurality of heads each mount the components onto the substrate.
  6. In the component mounting device described in claim 3 , The system includes a storage unit that stores, in advance, the first amount of movement of the head unit during component mounting, in which the multiple heads each mount the components onto the substrate, and the second amount of movement of the head unit during picking, in which the multiple heads each pick up the components, based on the array pitch of the multiple heads and the array pitch of the multiple components in the component placement area or the array pitch of the mounting points on the substrate. The second control unit, in setting the picking in the second process, In the first process, the target component that was assigned to the mounting point where mounting is not possible is picked by the target head that was assigned in the first process to pick the target component, and the target component is mounted on the substrate. In the first mode selected, the first total is the sum of the first movement amount and the second movement amount, When a second mode is selected in which the target component is picked by an adjacent head adjacent to the target head and the target component is mounted on the substrate, the second total, which is the sum of the first movement amount and the second movement amount, is calculated. A component mounting device that compares the first total with the second total, and selects the first mode if the first total is smaller, and selects the second mode if the second total is smaller, to perform the picking settings.
  7. In a component mounting device according to any one of claims 1 to 6 , The aforementioned component placement area is an area where a diced wafer is placed, and the component is a die. The camera is a wafer camera that images the wafer, The aforementioned multiple heads are arranged in a straight line in a component mounting device.

Description

This invention relates to a component mounting apparatus that picks matrix-arranged components with multiple heads and mounts them onto a substrate. For example, there are known component mounting devices that pick up matrix-arranged components, such as dies on diced wafers or tray components housed in trays, and mount them onto a substrate (for example, Patent Document 1). In this component mounting device, components brought into the component placement area inside the machine are imaged with a camera for component recognition, and then each of the multiple heads of a head unit capable of XY movement picks up the component, and the head unit is moved and the component is mounted onto the substrate. This operation is repeated. Before mounting the component onto the substrate, an inspection process is performed to determine whether the component can be mounted at a predetermined mounting point on the substrate. Conventionally, the above inspection process is performed to identify mounting points that are unsuitable for mounting components, and then the component recognition process is executed. Furthermore, after the results of these processes are obtained, picking settings are made to determine which of the multiple heads will pick each of the multiple components in a single picking operation, and to determine the picking order. In the conventional technology described above, the component recognition and picking setting processes are performed after the mounting point inspection. This results in waiting time for the inspection process to be executed, which can worsen the cycle time. Patent No. 6709900 Figure 1 is a top view plan showing the overall configuration of a component mounting device according to an embodiment of the present invention.Figure 2 is a schematic perspective view showing the head unit and the thrusting unit.Figure 3A is a top view of a diced wafer.Figure 3B shows an example of a wafer map.Figure 4 is a schematic diagram showing the component mounting status by the head unit on a multi-sided substrate.Figure 5 is a block diagram showing the control configuration of the component mounting device.Figure 6 is a flowchart showing the component mounting operation in a comparative example.Figure 7 is a flowchart showing the component mounting operation according to the embodiment.Figure 8 is a diagram illustrating the picking setup, including the allocation of the wafer die and suction head, and the mounting points between the die and the substrate.Figure 9 is a diagram illustrating the change in the picking settings when a mounting point error occurs.Figure 10 shows an example of changing the picking settings when selecting the mount priority mode, which causes the die to be picked by the head adjacent to the head that was assigned to mounting point NG.Figure 11A shows the component mounting operation in mount priority mode.Figure 11B shows the component mounting operation in mount priority mode.Figure 11C shows the component mounting operation in mount priority mode.Figure 12 shows an example of changing the picking settings when selecting the picking priority mode, which causes the die to be picked by the head that was assigned to mounting point NG.Figure 13A shows the component mounting operation in picking priority mode.Figure 13B shows the component mounting operation in picking priority mode.Figure 13C shows the component mounting operation in picking priority mode.Figure 14 is a schematic diagram showing the relationship between the head pitch, die pitch or component mounting point pitch, and the amount of head movement.Figure 15 is a table showing the formulas for calculating the head movement amount in each pattern when the picking priority mode is selected.Figure 16 is a table showing the formulas for calculating the amount of head movement in each pattern when the mount priority mode is selected. The embodiments of the present invention will be described in detail below with reference to the drawings. The component mounting apparatus according to the present invention is an apparatus that picks up a plurality of matrix-arranged components, such as dies diced from a wafer or electronic components arranged in a tray or pallet for containing components, by means of suction or other means, and mounts them onto a substrate. The component mounting apparatus described below will focus on the case where the component is a die from a wafer. [Description of component mounting device] Figure 1 is a top view plan showing the overall configuration of a component mounting device 1 according to an embodiment of the present invention. The component mounting device 1 mounts dies 7a (components) diced from a wafer 7 onto a substrate P. The component mounting device 1 includes a base 2, a conveyor 3, a head unit 4, a component supply unit 5 (component placement area), a wafer supply device 6, a camera unit 32U, and a push-up unit 40. Figure 2 is a schematic perspective view showing the head unit 4