JP-7856820-B2 - Electronic equipment and method for manufacturing the same
Inventors
- 渡村 憲司
- 堀越 正太
- ティン-ルップ・ウォング
- 宮本 旅人
- 恩田 祐一
- 藤井 一男
Assignees
- レノボ・シンガポール・プライベート・リミテッド
Dates
- Publication Date
- 20260511
- Application Date
- 20250520
- Priority Date
- 20240703
Claims (10)
- An electronic device having a flat rectangular housing, The aforementioned enclosure is A side wall frame formed by bending an extruded profile to create at least three side walls, A first cover, which is combined with the side wall frame to form one side of the housing, A second cover, which is combined with the side wall frame to form the other side of the housing, A plate-shaped plate frame is provided between opposing portions of the three aforementioned side walls, An electronic device characterized by having [a certain feature].
- In the electronic device described in claim 1, The electronic device is characterized in that the plate frame comprises two vertical walls that intersect the plate-like surface at an angle.
- In the electronic device according to claim 2, A main board containing a main control unit is provided within the aforementioned enclosure. An electronic device characterized in that at least the main control unit of the main board is provided in the space enclosed on three sides by the plate-like surface of the plate frame and the two vertical walls.
- In the electronic device according to claim 2, The electronic device is characterized in that the plate frame has a flattened U-shape due to the plate-like surface and the two vertical walls.
- In the electronic device described in claim 1, The electronic device is characterized in that the plate frame is an extruded profile.
- In the electronic device described in claim 1, The housing is at least one of a first housing and a second housing connected by a hinge so as to be rotatable relative to each other. The aforementioned side wall frame has a rectangular C-shape with four bent sections. The electronic device is characterized in that the plate frame is connected to the side wall frame in a manner that closes the rectangular C-shaped opening in the vicinity of the opening.
- In the electronic device according to claim 6, The electronic device is characterized in that the plate frame is fixed to the side walls that form both ends of the opening in the side wall frame.
- In the electronic device described in claim 1, The housing is at least one of a first housing and a second housing connected by a hinge so as to be rotatable relative to each other. The electronic device is characterized in that the side wall frame has a rectangular C-shape with four bent portions, and the hinge is positioned in the opening of the rectangular C-shape.
- In the electronic device described in claim 1, The aforementioned side wall frame has an inwardly protruding portion, The electronic device is characterized in that the plate frame has an outward-facing protrusion that is fixed to the inward-facing protrusion.
- A method for manufacturing an electronic device having a flat rectangular housing, A step of bending an extruded profile to form at least three side walls and obtain a side wall frame, A step of attaching a plate-shaped plate frame between opposing portions of the three side walls, The process involves attaching a first cover to one side of the side wall frame and a second cover to the other side. A method for manufacturing electronic equipment, characterized by having [a certain feature].
Description
This invention relates to an electronic device having a flat rectangular housing and a method for manufacturing the same. The casing of electronic devices such as notebook personal computers (notebook PCs) is a flat, rectangular box shape formed by an upper and lower cover, with the control board, battery, and other components housed inside. The side walls of the casing are often integrated with either the upper or lower cover, resulting in a shallow, tray-like shape known as a unibody design. Japanese Patent Publication No. 2020-140406 Figure 1 is a perspective view of an electronic device according to one embodiment.Figure 2 is a bottom view of the main casing of an electronic device.Figure 3 is an exploded perspective view of the main unit's casing.Figure 4 is an exploded plan view of the main casing.Figure 5 is an exploded bottom view of the main casing.Figure 6 is a perspective view of the frame.Figure 7 is a perspective view of the extruded profile that will be used as the material for the side wall frame.Figure 8 is a perspective view of the extruded profile that will be used as the material for the plate frame.Figure 9 is a perspective view of the plate frame.Figure 10 shows examples of frames of different sizes, where (a) shows a small frame and (b) shows a large frame.Figure 11-1 shows modified examples of extruded profiles, where (a) is a perspective view of the extruded profile according to the first modified example, (b) is a perspective view of the extruded profile according to the second modified example, (c) is a perspective view of the extruded profile according to the third modified example, and (d) is a perspective view of the extruded profile according to the fourth modified example.Figure 11-2 is a partial cross-sectional perspective view of an extruded profile and its corresponding lower cover according to a fifth modified example.Figure 12 shows modified versions of the plate frame, where (a) is a schematic cross-sectional view of the plate frame according to the first modified version, (b) is a schematic cross-sectional view of the plate frame according to the second modified version, (c) is a schematic cross-sectional view of the plate frame according to the third modified version, (d) is a schematic cross-sectional view of the plate frame according to the fourth modified version, (e) is a schematic cross-sectional view of the plate frame according to the fifth modified version, (f) is a schematic cross-sectional view of the plate frame according to the sixth modified version, (g) is a schematic cross-sectional view of the plate frame according to the seventh modified version, (h) is a schematic cross-sectional view of the plate frame according to the eighth modified version, (i) is a schematic cross-sectional view of the plate frame according to the ninth modified version, (j) is a schematic cross-sectional view of the plate frame according to the tenth modified version, (k) is a schematic cross-sectional view of the plate frame according to the eleventh modified version, and (l) is a schematic cross-sectional view of the plate frame according to the twelfth modified version.Figure 13 shows modified versions of the main housing, where (a) is a schematic cross-sectional view of the main housing according to the first modified version, (b) is a schematic cross-sectional view of the main housing according to the second modified version, (c) is a schematic cross-sectional view of the main housing according to the third modified version, and (d) is a schematic cross-sectional view of the main housing according to the fourth modified version.Figure 14 is a perspective view of a modified tablet-type electronic device.Figure 15 is an exploded perspective view of the retaining block and the portion into which the retaining block is inserted.Figure 16 is a schematic cross-sectional view of the retaining block and the portion into which the retaining block is inserted.Figure 17 is a schematic cross-sectional view of a retaining block and a first modified example of the portion into which the retaining block is inserted.Figure 18 is a schematic cross-sectional view of a retaining block and a second modified example of the portion into which the retaining block is inserted.Figure 19 is a flowchart showing a method for manufacturing electronic equipment. The embodiments of the electronic device according to the present invention will be described in detail below with reference to the drawings. However, the present invention is not limited to these embodiments. Figure 1 is a perspective view of an electronic device 10 according to one embodiment. Figure 2 is a bottom view of the main body casing 12 of the electronic device 10. In this embodiment, a notebook PC is used as an example of the electronic device 10. The electronic device 10 may also be a tablet PC or smartphone having a flat, rectangular casing. In Figure 1, the electronic device 10 is shown from above, with the display casing 14 opene