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JP-7857034-B2 - Wafer optical recognition device

JP7857034B2JP 7857034 B2JP7857034 B2JP 7857034B2JP-7857034-B2

Inventors

  • 佐佐木 大輔

Assignees

  • 樂華科技股▲ふん▼有限公司

Dates

Publication Date
20260512
Application Date
20241001

Claims (8)

  1. A wafer optical recognition device comprising an imaging device, a light-emitting device, a support component, a circuit board, and an optical refraction component, The imaging device captures image and character information on a semiconductor wafer, and one side of the imaging device is provided with a focus adjustment component for adjusting the focal length of the imaging device, the focus adjustment component comprises an adjustment drive component fixedly connected to the imaging device, the adjustment drive component comprises a screw thread adjustment section, an elastic component provided on the adjustment drive component, and an adjustment component drilled in the elastic component and connected to the screw thread adjustment section, The light-emitting device is provided on one side of the imaging device and comprises a plurality of light-emitting components. The aforementioned imaging device and the aforementioned light-emitting device are mounted on a support component. The circuit board is provided on one side of the light-emitting device and is connected to the imaging device and the light-emitting device, thereby acquiring video information captured by the imaging device, recognizing the image and text information, and further controlling the operation of each of the light-emitting components, so that each of the light-emitting components operates individually or in combination with others. The circuit board is electrically connected to a power supply component, and the circuit board is data-connected to a connector compatible with a network communication protocol. The wafer optical recognition device is characterized in that the optical refraction component is provided on one side of the light-emitting device and refracts the light emitted from each of the light-emitting components.
  2. The adjustment drive component further comprises a plurality of fixed parts fixedly connected to the imaging device, a plurality of slide grooves provided on one side of each fixed part, and a drive component housing groove provided between each slide groove, A limiting component is provided on the side of the adjustment drive component away from the imaging device, and the limiting component comprises a plurality of guide portions housed in the slide groove, and between each of the guide portions, a limiting component housing groove is provided corresponding to the position of the drive component housing groove. The screw thread adjustment portion is provided on one side of the drive component housing groove portion, The wafer optical recognition apparatus according to claim 1, characterized in that the elastic component is housed in the drive component housing groove and the limiting component housing groove, and the adjustment component is commonly drilled in the limiting component , the adjustment drive component, and the elastic component.
  3. The wafer optical recognition apparatus according to claim 2 , characterized in that the support component and the limiting component are mutually locked and connected to the outer cover body.
  4. The wafer optical recognition apparatus according to claim 1, characterized in that a unidirectional optical component is provided between the light-emitting device and the optical refraction component.
  5. The wafer optical recognition apparatus according to claim 4 , characterized in that a reflective component is provided on the side of the unidirectional optical component opposite to the light-emitting device and the optical refraction component, and the reflective component is located in front of the imaging device.
  6. The wafer optical recognition apparatus according to claim 1, characterized in that the recognition of the image and character information is performed by an AI artificial intelligence chip provided on a circuit board, and the AI artificial intelligence chip learns and records the image and character information in the video information.
  7. The wafer optical recognition apparatus according to claim 1, characterized in that at least one side of the optical refraction component is provided with an optical enhancement light-emitting unit that is electrically connected to the circuit board.
  8. A wafer optical recognition device comprising an imaging device, a light-emitting device, a circuit board, and an optical refraction component, The aforementioned imaging device captures image and text information on a semiconductor wafer. The light-emitting device is provided on one side of the imaging device and comprises a plurality of light-emitting components. The circuit board is provided on one side of the light-emitting device and is connected to the imaging device and the light-emitting device, thereby acquiring video information captured by the imaging device, recognizing the image and text information, and further controlling the operation of each of the light-emitting components, so that each of the light-emitting components operates individually or in combination with others. The light refraction component is provided on one side of the light-emitting device and refracts the light emitted from each of the light-emitting components. One side of the imaging device is provided with a focus adjustment component for adjusting the focal length of the imaging device. The wafer optical recognition device is characterized in that the focus adjustment component comprises an adjustment drive component fixedly connected to the imaging device, the adjustment drive component comprises a plurality of fixed parts fixedly connected to the imaging device, a plurality of slide grooves provided on one side of each fixed part, a drive component housing groove provided between each slide groove, and a screw thread adjustment part provided on one side of the drive component housing groove, a limiting component is provided on the side of the adjustment drive component away from the imaging device, the limiting component comprises a plurality of guide parts housed in the slide groove, a limiting component housing groove corresponding to the position of the drive component housing groove is provided between each guide part, an elastic component is housed in the drive component housing groove and the limiting component housing groove, and an adjustment component is drilled in common in the limiting component, the adjustment drive component, and the elastic component.

Description

This invention relates to a wafer optical recognition device, and more particularly to a wafer optical recognition device that can clearly and distinctly detect characters engraved on a semiconductor wafer, while simultaneously incorporating an AI image recognition function and an automatic image learning function, enabling character recognition on a wide variety of semiconductor wafers by utilizing light from various angles. The surface of a typical semiconductor wafer is engraved with a number indicating its identification information, and this number is used in subsequent related manufacturing processes and inspection work. For example, the main structure of Taiwan Patent No. M632730, "Wafer Number Engraving Recognition Apparatus," consists of an optical recognition component. A wafer mounting unit is provided on one side of the optical recognition component, and an upper reflective component and a lower reflective component are provided on the other side of the wafer mounting unit. This allows the wafer to be placed on the wafer mounting unit, the upper reflective component to reflect the image of the wafer's upper surface to the optical recognition component, and the lower reflective component to reflect the image of the wafer's lower surface to the optical recognition component. The optical recognition component can then recognize the numbers engraved on the upper and lower surfaces from the images of the upper and lower surfaces. This ability to simultaneously read the numbers engraved on the upper and lower surfaces of the wafer improves convenience in use. However, when using the wafer number marking recognition device described above, the following problems and drawbacks definitely exist, and improvements are expected. While the device has the function of engraving and recognizing numbers, it cannot adjust the angle of the light beam. Therefore, when attempting to engrave and recognize numbers on different semiconductor wafers using the recognition device, differences in wafer size or the position of the engraved numbers can prevent the recognition device from accurately recognizing the numbers, increasing the risk of misidentification. Furthermore, reflections caused by ambient light can also prevent accurate recognition. Taiwan Patent No. M632730 Specification This is a perspective view of a preferred embodiment of the present invention.This is a cross-sectional view of a preferred embodiment of the present invention.This is an exploded view of a preferred embodiment of the present invention.This is a structural block diagram of a preferred embodiment of the present invention.This is an embodiment diagram of a preferred embodiment of the present invention.This is a cross-sectional view of another preferred embodiment of the present invention.This is exploded view 1 of yet another preferred embodiment of the present invention.This is exploded view 2 of yet another preferred embodiment of the present invention.This is a cross-sectional view of yet another preferred embodiment of the present invention.This figure shows the adjustment of yet another preferred embodiment of the present invention.This is an embodiment diagram of yet another preferred embodiment of the present invention.This figure shows light enhancement in yet another preferred embodiment of the present invention. Refer to Figures 1 to 4. Figures 1 to 4 are perspective views and implementation drawings of preferred embodiments of the present invention. As can be seen from the figures, the present invention consists of a shooting device 1, a light-emitting device 2, a circuit board 3, an AI artificial intelligence chip 31, a light refraction component 4, and a support component 51. The imaging device 1 can capture image and text information A1 on semiconductor wafer A. The light-emitting device 2 is provided on one side of the imaging device 1, and the light-emitting device 2 comprises a plurality of light-emitting components 21. The circuit board 3 is provided on one side of the light-emitting device 2 and is connected to the imaging device 1 and the light-emitting device 2. This allows the circuit board 3 to acquire the video information 11 captured by the imaging device 1, recognize the image/text information A1, and control the operation of each of the light-emitting components 21. As a result, each of the light-emitting components 21 can be operated individually or in combination with multiple other light-emitting components 21. The AI artificial intelligence chip 31 is provided on the circuit board 3 and is capable of recognizing image and text information A1, as well as learning and recording the image and text information A1 within the video information 11. The light refraction component 4 is provided on one side of the light-emitting device 2 and refracts the light emitted from each of the light-emitting components 21. The imaging device 1 and the light-emitting device 2 are mounted on the support component 51. Of these, the