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JP-7857040-B1 - Integrated liquid cooling heat dissipation device

JP7857040B1JP 7857040 B1JP7857040 B1JP 7857040B1JP-7857040-B1

Abstract

[Problem] To provide an integrated liquid cooling and heat dissipation device in which the liquid flows uniformly through the liquid heat dissipation tube and at a moderate flow rate. [Solution] The integrated liquid cooling heat dissipation device according to the present invention includes a liquid cooling train 100 and a liquid cooling head 200. The liquid cooling train 100 includes a first liquid box 10, a second liquid box 20, and a heat dissipation tube assembly 30 connected between the first liquid box 10 and the second liquid box 20. The liquid cooling head 200 is connected to the first liquid box 10 and is used for bonding processors. A low-temperature liquid chamber 14 and a high-temperature liquid chamber 15 are formed inside the first liquid box 10 of the liquid cooling train 100, and a flow divider plate 16 is provided inside the low-temperature liquid chamber 14. The flow divider plate 16 has a plurality of through holes 164 on both sides. [Selection Diagram] Figure 4

Inventors

  • ▲黄▼ 崇賢

Assignees

  • ▲黄▼ 崇賢

Dates

Publication Date
20260512
Application Date
20241224
Priority Date
20241113

Claims (9)

  1. An integrated liquid cooling heat dissipation device including a liquid cooling train and a liquid cooling head, The liquid cooling train includes a first liquid box, a second liquid box, and a heat dissipation tube assembly, the heat dissipation tube assembly includes a plurality of first heat dissipation tubes, second heat dissipation tubes, and heat dissipation fins, the first heat dissipation tubes and the second heat dissipation tubes form flat metal tubes, both ends of which are connected to the first liquid box and the second liquid box , respectively, and the heat dissipation fins are arranged on the outer surfaces of the first heat dissipation tube and the second heat dissipation tube, respectively. The upper surface of the liquid cooling head is bonded to the outer surface of the bottom wall of the first liquid box, and the bottom surface of the liquid cooling head is bonded to the surface of the processor. The first liquid box includes a first box body and a first box cover, a first chamber is recessed in the upper surface of the first box body, the inside of the first chamber is divided into a low-temperature liquid chamber and a high-temperature liquid chamber by a thermal barrier structure, and the bottoms of the low-temperature liquid chamber and the high-temperature liquid chamber are connected to the inside of the liquid cooling head via low-temperature liquid holes and high-temperature liquid holes, respectively. The first box cover covers the upper end of the first box body, and the upper wall of the first box cover is provided with a plurality of first heat dissipation tube insertion holes that connect to the low-temperature liquid chamber and the high-temperature liquid chamber, and the lower ends of the first heat dissipation tube and the second heat dissipation tube are respectively inserted into the first heat dissipation tube insertion holes. An integrated liquid cooling and heat dissipation device characterized in that a flow divider plate is provided in the cryogenic liquid chamber, the flow divider plate is provided with through holes that connect both sides, and the liquid entering the cryogenic liquid chamber from the first heat dissipation tube flows through a plurality of through holes before entering the inside of the liquid cooling head through the cryogenic liquid holes, as a result of the flow divider plate.
  2. The flow divider plate is formed from a bent metal plate and includes a first plate corresponding to the first heat dissipation tube insertion hole of the first box cover, a second plate connected to one end of the first plate, and a third plate connected to the other end of the first plate. The integrated liquid cooling heat dissipation device according to claim 1, characterized in that the second plate is fixed to one surface of the heat blocking structure, and the end of the third plate is bonded and fixed to the inner surface of the first box cover.
  3. The integrated liquid-cooled heat dissipation device according to claim 2, characterized in that the plurality of through holes are arranged in the first plate, the second plate, or the third plate.
  4. The integrated liquid-cooled heat dissipation device according to claim 2, characterized in that the second plate is welded to one side of the heat-blocking structure.
  5. The thermal barrier structure includes a low-temperature liquid partition plate and a high-temperature liquid partition plate. The integrated liquid cooling and heat dissipation device according to claim 4, characterized in that the low-temperature liquid partition plate and the high-temperature liquid partition plate are arranged parallel to each other in the first chamber, the areas around the low-temperature liquid partition plate and the high-temperature liquid partition plate are arranged on the inner wall of the first chamber and the inner wall of the first box cover, and the second plate is fixed to one surface of the low-temperature liquid partition plate.
  6. The integrated liquid-cooled heat dissipation device according to claim 2, characterized in that two fixing holes are provided on the surface of the second plate corresponding to the heat-blocking structure, and two fixing protrusions are provided on one surface of the heat-blocking structure, with the fixing protrusions being fitted into the fixing holes.
  7. The thermal barrier structure includes a low-temperature liquid partition plate and a high-temperature liquid partition plate. The integrated liquid cooling and heat dissipation device according to claim 6, characterized in that the low-temperature liquid partition plate and the high-temperature liquid partition plate are arranged parallel to each other in the first chamber, the low-temperature liquid partition plate and the high-temperature liquid partition plate are welded to the inner wall of the first chamber and the inner wall of the first box cover, and the second plate is fixed to one surface of the low-temperature liquid partition plate.
  8. The aforementioned second liquid box includes a second box body, a second partition plate, and a second box cover. A second chamber is recessed in the upper surface of the second box body, a second partition plate is provided inside the second chamber, the second chamber is divided into a liquid output chamber and a liquid input chamber by the second partition plate, a plurality of second heat dissipation tube insertion holes are provided in the bottom wall of the second box body that connect to the liquid output chamber and the liquid input chamber, the upper ends of the first heat dissipation tube and the second heat dissipation tube are inserted into the second heat dissipation tube insertion holes, the upper ends of the first heat dissipation tube and the second heat dissipation tube connect to the liquid output chamber and the liquid input chamber, The integrated liquid-cooled heat dissipation device according to claim 1, characterized in that the second box cover covers the opening at the upper end of the second box body.
  9. The integrated liquid-cooled heat dissipation device according to claim 8, further comprising a liquid pump, wherein the liquid pump is located in the liquid input chamber of the second box body.

Description

This invention relates to the technical field of liquid-cooled heat dissipation devices, and more particularly to an integrated liquid-cooled heat dissipation device for cooling and dissipating heat from servers and the like. Currently, liquid cooling systems used in computers and servers are generally of the separate type, comprising elements and units such as separate liquid cooling trains, liquid cooling heads, and liquid pumps, connected by multiple liquid tubes to form a closed-loop system. However, the separate structure is not compact and is inconvenient to install. The inventor previously filed a patent application for an integrated liquid cooling system, which features a liquid pump inside the liquid cooling train, a liquid cooling head at the bottom of the bottom cooling train, and the ability to attach the liquid cooling head to the processor, thereby achieving liquid cooling for the processor. This is a schematic three-dimensional view of the integrated liquid-cooled heat dissipation device according to the present invention.This is an exploded schematic diagram of the liquid cooling train and liquid cooling head according to the present invention.This is an exploded schematic diagram of the liquid-cooled train according to the present invention.Figure 1 is a schematic vertical cross-sectional view of the integrated liquid-cooled heat dissipation device according to the present invention.This is an exploded schematic diagram of the first liquid box area of the liquid cooling train according to the present invention.This is an exploded schematic diagram of the entire first liquid box of the liquid cooling train according to the present invention.This is a schematic diagram of the flow-dividing partition plate and thermal barrier structure according to the present invention.This is a schematic exploded view of the second liquid box of the liquid cooling train according to the present invention.