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JP-7857047-B2 - Overmolded structure within glass

JP7857047B2JP 7857047 B2JP7857047 B2JP 7857047B2JP-7857047-B2

Inventors

  • フレミング ジェブ エイチ．
  • ポポビッチ マーク

Assignees

  • スリーディー グラス ソリューションズ，インク

Dates

Publication Date
20260512
Application Date
20230315
Priority Date
20220318

Claims (9)

  1. A method for overmolding one or more electronic devices in or on a photosensitive glass substrate, The steps include providing the photosensitive glass substrate including the one or two or more electronic devices, The steps include forming one or more overmolded openings in the photosensitive glass substrate, wherein each overmolded opening is a blind opening , The method comprising the steps of applying an overmolding material to fill the one or more overmolding openings and covering at least a portion of the one or more electronic devices.
  2. A step of masking a design layout that includes one or more overmolded structures in order to form the one or more overmolded openings, The steps include: exposing at least a portion of the photosensitive glass substrate to an active energy source; The steps include heating the photosensitive glass substrate at a temperature above its glass transition temperature for at least 10 minutes, The method according to claim 1, further comprising the step of cooling the photosensitive glass substrate in order to convert at least a portion of the exposed glass into a crystalline material to form a glass crystal substrate.
  3. The method according to claim 2, wherein the anisotropic etching ratio between the exposed portion and the unexposed portion is at least 30:1.
  4. The method according to claim 1, wherein each of the one or more overmolded openings includes an upper opening and an interior, and at least a portion of the interior is wider than the upper opening.
  5. An apparatus for one or more electronic devices located within or on a photosensitive glass substrate, The photosensitive glass substrate and, The one or more electronic devices disposed within or on the photosensitive glass substrate, One or more overmolded openings in the photosensitive glass substrate , wherein each overmolded opening is a blind opening , The apparatus comprising a layer of overmolding material that fills the one or more overmolding openings and covers at least a portion of the one or more electronic devices.
  6. The apparatus according to claim 5, wherein each of the one or more overmolded openings includes an upper opening and an interior, and at least a portion of the interior is wider than the upper opening.
  7. The apparatus according to claim 5, wherein the one or more electronic devices include an integrated circuit die; one or more passive electronic components including a resistor, inductor, or capacitor; one or more centrifugal circuit elements including a resistor, inductor, or capacitor; or a system-in-package .
  8. An apparatus comprising one or more electronic devices in or on a photosensitive glass substrate, the apparatus comprising: the photosensitive glass substrate; the one or more electronic devices disposed in or on the photosensitive glass substrate; one or more overmolded openings in the photosensitive glass substrate, each of which is a blind opening; and a layer of overmolded material filling the one or more overmolded openings and covering at least a portion of the one or more electronic devices. A step of masking a design layout that includes one or more overmolded structures in order to form the one or more overmolded openings, The steps include: exposing at least a portion of the photosensitive glass substrate to an active energy source; The steps include heating the photosensitive glass substrate at a temperature above its glass transition temperature for at least 10 minutes, The apparatus is manufactured by a method comprising the step of cooling the photosensitive glass substrate in order to convert at least a portion of the exposed glass into a crystalline material to form a glass crystal substrate.
  9. The apparatus according to claim 8, wherein each of the one or more overmolded openings includes an upper opening and an interior, and at least a portion of the interior is wider than the upper opening .

Description

Cross-reference of related applications: This application claims priority to U.S. Provisional Patent Application No. 63/321,421, filed on 18 March 2022, the entire contents of which are incorporated herein by reference. No mention of federally funded research. This invention relates to a method and related apparatus for encapsulating components. More specifically, this invention relates to overmolding electronic devices onto a glass substrate. Without limiting the scope of this invention, the background of this invention will be described in relation to RF and electronic circuits. Driven by wearable devices, small form factor devices, device-to-device communication, RF communication, and many other applications, the demand for overmolded electronic equipment packages is increasing. Overmolding packaging techniques offer enhanced mechanical strength, reduced electrostatic discharge (ESD) damage, reduced package size, and protection against humidity, dust, dirt, and vibration. Overmolding also seals connectors, overmolded grommets (also referred to herein as "overmolding openings"), and tension reliefs. The primary reason for overmolding openings is to enhance the adhesion of the overmolding material to the substrate. Overmolding techniques can therefore protect integrated circuit dies, passive electronic components, or systems-in-a-packages (SiPs), etc. Overmolding can be performed by various methods and materials for encapsulating RF and electronic circuits. These methods and materials include low-pressure molding (LPM) processes and liquid silicone rubber (LSR) molding processes. LPM processes may involve either polyamide or polyolefin (hot-melt) materials and are typically used to encapsulate electronic components and protect them environmentally. Liquid silicone rubber (LSR) injection molding is typically used for mass production of flexible and durable parts. Overmolding encapsulation is used on several substrates, including printed circuit boards (PCBs), silicon, sapphire, and other materials. LSR is a resin based on curing silicone, possessing low compression set, high stability, and resistance to extreme temperatures. Ideally, LSR is suitable for the production of parts where high quality is essential. Thermosetting liquid silicone injection molding requires intensive distribution mixing at low temperatures before being extruded into a heated cavity. Materials that flow easily at higher temperatures and solidify at low temperatures are called thermoplastics. LPM materials used for overmolding in electronic equipment include a group of amorphous thermoplastic polyamides, because they have a processing temperature range of 180–240°C and a viscosity of approximately 3,000 centipoise. Polyamides have two suitable characteristics for electronic molding. The first characteristic is the adhesive properties of polyamides. Polyamides are high-performance hot-melt materials that mechanically adhere to substrates. Mechanical adhesion means that there is no chemical reaction with the substrate. To facilitate the necessary adhesion, overmolding openings have been used to anchor the overmolding material to the substrate. These overmolding openings are created by etching or milling molded holes, vias, trenches, or other structures into the substrate so that the molding material flows into the openings. The molding material then solidifies around the electronic components, wiring, bonding pads, or adhesive structures. Overmolding openings typically fill in a few seconds, but a typical entire molding cycle lasts 20–45 seconds. Several solutions for creating openings within overmolded packages include laser cutting and mechanical drilling. These solutions can be extended by using molding enclosures (e.g., mold chases) to create surface voids (e.g., chamfered edges) or removable inserts. Some components may require precise opening tolerances, such as openings above optical sensors. In consumer electronics, it is highly desirable to improve and expand the use of overmolded electronics packaging while reducing the difficulties in their overmolding process. Unfortunately, current technical processes for mechanical bonding have not been feasible for transitioning to glass substrates because the bond between glass and the overmolding material is not sufficient to withstand handling and packaging. In one embodiment, the present invention includes a method for overmolding one or more electronic devices in or on a photosensitive glass substrate, the method comprising the steps of: providing a photosensitive glass substrate containing one or more electronic devices; forming one or more overmolded openings in the photosensitive glass substrate; and applying an overmolding material to fill the one or more overmolded openings and to cover at least a portion of the one or more electronic devices. In one embodiment, the photosensitive glass substrate comprises silica, lithium oxide, aluminum oxide, and cerium oxide. In another embod