JP-7857094-B2 - Wiring circuit board and method for manufacturing the same

JP7857094B2JP 7857094 B2JP7857094 B2JP 7857094B2JP-7857094-B2

Inventors

津田尚
井上真弥

Assignees

日東電工株式会社

Dates

Publication Date: 20260512
Application Date: 20211209

Claims (13)

Transparent substrate and A first terminal portion formed on the transparent substrate, A second terminal portion formed on the transparent substrate, The device comprises a wiring layer formed on the transparent substrate so as to connect the first terminal portion and the second terminal portion, A slit is formed in the wiring layer, extending continuously from the first terminal portion to the second terminal portion. A linear portion is formed extending from the first terminal portion to the second terminal portion, which are opposite each other across the slit. The width of the slit is equal from the first terminal portion to the second terminal portion, and the widths of the plurality of linear portions are formed to be equal. The transparent substrate has first and second main surfaces facing opposite directions. The transparent substrate has through holes formed so as to penetrate the first main surface and the second main surface. The first terminal portion is formed on the first main surface of the transparent substrate. The second terminal portion is formed on the second main surface of the transparent substrate. The wiring layer is formed on the first and second main surfaces of the transparent substrate so as to connect the first terminal portion and the second terminal portion through the through-hole, The slit is formed to constitute a part of the through hole between the linear portions and to extend continuously from the first terminal portion to the second terminal portion through the through hole. Wiring circuit board.
The wiring circuit board according to claim 1, wherein the maximum width of the wiring layer is less than or equal to the maximum width of the first terminal portion and less than or equal to the maximum width of the second terminal portion.
One or more slits are formed in the wiring layer, extending continuously from the first terminal portion to the second terminal portion. A wiring circuit board according to claim 1 or 2, comprising a plurality of linear portions that face each other with a slit in between and connect the first terminal portion and the second terminal portion.
The wiring circuit board according to claim 3, wherein the width of each linear portion is 2 μm or more and 100 μm or less.
The wiring circuit board according to claim 3 or 4, wherein the ratio of the width of each linear portion to the maximum width of the first and second terminal portions is 0.33 or less.
The wiring circuit board according to any one of claims 1 to 3, wherein the wiring layer includes, in order from the transparent substrate, a first sputtered film formed of a first metal, a second sputtered film formed of a second metal, and a plating layer formed of a third metal.
The wiring layer is formed in a spiral shape, as described in any one of claims 1 to 6.
The wiring layer includes a first wiring portion formed on the first main surface and a second wiring portion formed on the second main surface. The first wiring portion is formed in a spiral shape on the first main surface, The wiring circuit board according to claim 1, wherein the second wiring portion is formed in a spiral shape on the second main surface.
The wiring circuit board according to claim 8, wherein the first wiring portion and the second wiring portion are formed to be identical in shape so that they overlap each other when viewed in a first direction perpendicular to the first and second main surfaces.
The slit includes a first slit portion formed in the first wiring portion and a second slit portion formed in the second wiring portion. The wiring circuit board according to claim 9, wherein the first slit portion and the second slit portion are formed to be the same shape so as to overlap each other when viewed from the first direction.
A coil formed by the wiring layer of a wiring circuit board according to any one of claims 1 to 10.
An antenna formed by a wiring circuit board as described in any one of claims 1 to 10.
The process of preparing the transparent substrate, The process includes the step of forming a first terminal portion, a second terminal portion, and a wiring layer connecting the first terminal portion and the second terminal portion on the transparent substrate, The step of forming the wiring layer is, A slit is formed in the wiring layer, extending continuously from the first terminal portion to the second terminal portion. A linear portion is formed extending from the first terminal portion to the second terminal portion, which are opposite each other across the slit. The width of the slit is equal from the first terminal portion to the second terminal portion, and the widths of the plurality of linear portions are formed to be equal. Through holes are formed in the transparent substrate so as to penetrate the first main surface and the second main surface . The first terminal portion is formed on the first main surface of the transparent substrate. The second terminal portion is formed on the second main surface of the transparent substrate. The wiring layer is formed on the first main surface and the second main surface of the transparent substrate so as to connect the first terminal portion and the second terminal portion through the through hole. The slit is formed to constitute a part of the through hole between the linear portions and to extend continuously from the first terminal portion to the second terminal portion through the through hole. A method for manufacturing a wiring circuit board.

Description

This invention relates to a wiring circuit board and a method for manufacturing the same. Circuit boards have traditionally been used in various electrical and electronic devices. Recently, the use of circuit boards in the screens of portable devices such as wearable devices has been considered. In this case, transparent circuit boards are used to improve the visibility of the screen. In transparent circuit boards, transparency is ensured by using a transparent substrate such as glass. On the other hand, the wiring on the transparent substrate is formed from metal and therefore does not possess transparency. In the wiring board described in Patent Document 1 (hereinafter referred to as a wiring circuit board), a wiring pattern region is formed on a transparent substrate. The wiring pattern region includes a plurality of first directional wirings and a plurality of second directional wirings that function as antennas. Within the wiring pattern region, multiple openings are formed by the first directional wirings and second directional wirings arranging in a grid or mesh pattern. Japanese Patent Publication No. 2020-113997 This is a schematic plan view showing the configuration of a wiring circuit board according to one embodiment.This is a cross-sectional view of the wiring circuit board shown along line A-A in Figure 1.This is a cross-sectional view of the wiring circuit board shown along line B-B in Figure 1.This is a schematic plan view showing a wiring circuit board for an application example.This is a schematic bottom view showing a wiring circuit board for an application example.Figures 4 and 5 are cross-sectional views of the wiring circuit board along the C-C line.This is a schematic cross-sectional view illustrating a method for manufacturing a wiring circuit board.This is a schematic cross-sectional view illustrating a method for manufacturing a wiring circuit board.This is a schematic cross-sectional view illustrating a method for manufacturing a wiring circuit board.This is a schematic cross-sectional view illustrating a method for manufacturing a wiring circuit board.This is a schematic cross-sectional view illustrating a method for manufacturing a wiring circuit board.This is a schematic cross-sectional view illustrating a method for manufacturing a wiring circuit board.This is a schematic cross-sectional view illustrating a method for manufacturing a wiring circuit board.This figure shows an example of how a wiring circuit board is used.This figure shows an example of how a wiring circuit board is used.This is a schematic plan view of a wiring circuit board according to another embodiment.This is a schematic plan view of a wiring circuit board according to another embodiment.This is a schematic plan view of a wiring circuit board according to another embodiment.Figure 18 is a schematic bottom view of the wiring circuit board. The following describes in detail, with reference to the drawings, a wiring circuit board according to one embodiment of the present invention and its manufacturing method. (1) Configuration of a wiring circuit board according to one embodiment Figure 1 is a schematic plan view showing the configuration of a wiring circuit board according to one embodiment. Figure 2 is a cross-sectional view of the wiring circuit board of Figure 1 taken along line A-A. Figure 3 is a cross-sectional view of the wiring circuit board of Figure 1 taken along line B-B. As shown in Figures 1, 2 and 3, the wiring circuit board 100 comprises a transparent substrate 10, a wiring layer 50, a first terminal portion 60, a second terminal portion 70, and a cover insulating layer 80. In Figure 1, the transparent substrate 10 has a light transmittance of, for example, 80% or more in the visible light region (e.g., 380 nm to 780 nm) and is electrically insulating. In this embodiment, the transparent substrate 10 is formed from polyimide resin. Alternatively, the transparent substrate 10 may be formed from an organic insulating material such as polyester resin, acrylic resin, polycarbonate resin, or polyolefin resin. Furthermore, a glass substrate and a transparent ceramic substrate may be used as the transparent substrate 10. The transparent substrate 10 preferably has a thickness of 20 μm to 200 μm. In this embodiment, the transparent substrate 10 has a thickness of, for example, 100 μm. On the main surface of the transparent substrate 10, a wiring layer 50, a first terminal portion 60, and a second terminal portion 70 are integrally formed. On the transparent substrate 10, the first terminal portion 60 is provided at one end of the wiring layer 50, and the second terminal portion 70 is provided at the other end of the wiring layer 50. In this embodiment, the dimension of the wiring layer 50 in the direction extending from the first terminal portion 60 to the second terminal portion 70 is defined as the length, and the dimension in the direction perpendicular to the length is defined as the width. In th