JP-7857098-B2 - Vacuum deposition apparatus, rotation angle determination method, and method for manufacturing a deposited material.

JP7857098B2JP 7857098 B2JP7857098 B2JP 7857098B2JP-7857098-B2

Inventors

田中美和
市川竜弥

Assignees

株式会社アルバック

Dates

Publication Date: 20260512
Application Date: 20211222

Claims (20)

Multiple holders capable of holding the objects to which the deposited material is deposited, and capable of revolving while each rotating on its own axis of revolution, An imaging unit capable of imaging at least one of the plurality of holders holding the object to be deposited, the holder having a mark for determining the rotation angle of the object to be deposited, A vacuum deposition apparatus comprising: a dynamic deposition mode in which deposition is performed on the object to be deposited while it is rotating and revolving; and a static deposition mode in which deposition is performed on the object to be deposited while it is stationary; and a control unit which causes the imaging unit to take an image and determines the rotation angle of the object to be deposited based on the image taken by the imaging unit in the static deposition mode.
A vacuum deposition apparatus according to claim 1 , The field of view of the imaging unit includes at least the range in which the holder moves in the orbital direction when the holder rotates once.
A vacuum deposition apparatus according to claim 1 or 2 , A vacuum deposition apparatus further comprising an incidence angle adjustment mechanism that rotates the holder about an axis perpendicular to the orbital axis to adjust the incidence angle of the deposited material on the material to be deposited.
A vacuum deposition apparatus according to claim 3 , The field of view of the imaging unit includes at least the perturbation range when the holder is perturbed in the perturbation direction due to the rotation of the holder by adjusting the incident angle. Vacuum deposition apparatus.
A vacuum deposition apparatus according to claim 1, The aforementioned mark is provided at a position off the rotation axis of the holder and rotates around the rotation axis in accordance with the rotation and revolution of the holder in a vacuum deposition apparatus.
A vacuum deposition apparatus according to claim 5 , The holder has a flange portion, The aforementioned mark is a vacuum deposition apparatus provided on the flange portion.
A vacuum deposition apparatus according to claim 6 , The aforementioned mark is a hole that penetrates the flange portion in a vacuum deposition apparatus.
A vacuum deposition apparatus according to any one of claims 1 to 7 , The control unit determines the rotation angle based on the position of the mark in the image and the center position of the holder. Vacuum deposition apparatus.
A vacuum deposition apparatus according to any one of claims 1 to 8 , The control unit performs a correction process to correct the holder in the image so that it appears as if it were viewed from the front of the holder, and determines the rotation angle based on the image after the correction process. Vacuum deposition apparatus.
A vacuum deposition apparatus according to any one of claims 1 to 9 , Vacuum chamber and The vacuum chamber is further provided with a first window, The imaging unit is a vacuum deposition apparatus that images the holder from outside the vacuum chamber through the first window.
A vacuum deposition apparatus according to claim 10 , A vacuum deposition apparatus further comprising a first anti-deposition part for preventing the deposition of the material onto the first window portion.
A vacuum deposition apparatus according to claim 11 , The vacuum deposition apparatus includes a first shutter that switches between a shielded state in which the first window is shielded and an exposed state in which the first window is exposed, within the vacuum chamber.
A vacuum deposition apparatus according to claim 11 or 12 , The vacuum deposition apparatus includes a first anti-deposition portion which is interposed between the first window portion and the deposition source of the deposited material inside the vacuum chamber.
A vacuum deposition apparatus according to any one of claims 1 to 13 , A vacuum deposition apparatus further comprising an illumination unit that irradiates light onto the holder when imaging is performed by the imaging unit.
A vacuum deposition apparatus according to claim 14 , Vacuum chamber and The vacuum chamber is further provided with a second window, The illumination unit irradiates the holder with light from outside the vacuum chamber through the second window in the vacuum deposition apparatus.
A vacuum deposition apparatus according to claim 15 , A vacuum deposition apparatus further comprising a second anti-deposition part for preventing the deposition of the material onto the second window portion.
A vacuum deposition apparatus according to claim 16 , The vacuum deposition apparatus includes a second shutter that switches between a shielded state in which the second window is shielded and an exposed state in which the second window is exposed, within the vacuum chamber.
A vacuum deposition apparatus according to any one of claims 1 to 17 , A rotating body that rotatably supports the axis of rotation of each of the plurality of holders and is rotatable around the axis of revolution, A first visual mark is provided on the holder, which rotates around the axis of rotation in accordance with the rotation and revolution of the holder, A vacuum deposition apparatus further comprising: a second visual mark provided on the rotating body, which rotates around the orbital axis in accordance with the rotation of the rotating body, wherein the second visual mark coincides with the position of the first visual mark when the holder reaches a predetermined rotation angle.
The system switches between a dynamic deposition mode, in which the material is deposited onto the object while it is rotating or orbiting, and a static deposition mode, in which the material is deposited onto the object while it is stationary. In a plurality of holders each capable of holding the object to be deposited and capable of revolving while each rotating on its own axis, at least one of the plurality of holders holding the object to be deposited, which has a mark for determining the rotation angle of the object to be deposited , is imaged by the imaging unit in the static deposition mode . A method for determining the rotation angle of the object to be coated with a vapor deposition coating, based on an image captured by the imaging unit.
The system switches between a dynamic deposition mode, in which the material is deposited onto the object while it is rotating or orbiting, and a static deposition mode, in which the material is deposited onto the object while it is stationary. In a plurality of holders each capable of holding the object to be deposited and capable of revolving while each rotating on its own axis, at least one of the plurality of holders holding the object to be deposited, which has a mark for determining the rotation angle of the object to be deposited , is imaged by the imaging unit in the static deposition mode . Based on the image captured by the imaging unit, the rotation angle of the object to be coated is determined. A method for manufacturing a material to which a material has been deposited, wherein a material is deposited onto the material to be deposited based on the determined rotation angle of the material to be deposited.

Description

This technology relates to vacuum deposition equipment and related technologies. Vacuum deposition is a technique for forming a film on a substrate or other object by heating and evaporating deposition materials such as metals and oxides in a vacuum, and then depositing and accumulating the resulting vapor onto the object to be deposited. As a type of vacuum deposition method, a technique is known in which film deposition is performed while the object to be deposited, such as a substrate, is rotated or orbited within a vacuum chamber (see, for example, Patent Document 1 below). Japanese Patent Publication No. 2009-263762 This is a schematic side view showing a vacuum deposition apparatus according to one embodiment of this technology.This is a schematic diagram showing the upper part of a vacuum deposition apparatus as viewed from above.This is a view from above showing each holder and each wafer while they are rotating on their own axis and around their own axis.This is a view from above showing each holder and each wafer while they are rotating on their own axis and around their own axis.This is an exploded perspective view showing the image acquisition target holder.This is a view of the cylindrical and flange portions of the imaging target holder from above.This figure shows another example of an imaging target holder.This is a view of the first shutter and the second shutter from the front.This diagram illustrates the field of view provided by the imaging unit, and shows the movement of the target holder and wafer on the image as captured by the imaging unit.This diagram shows the relationship between the field of view determined by the imaging unit and the first and second shutters.This diagram shows the relationship between the field of view provided by the imaging unit and the protective plate.This is a flowchart showing the processing performed by the control unit in the control device.This is a diagram to explain the correction process.This figure shows an example of a method for pre-programming correction processing.This figure shows the corrected images when the rotation angles of the image acquisition target holder are 0°, 30°, 60°, 90°, 120°, 150°, 180°, 210°, 240°, 270°, 300°, and 330°, respectively.This figure shows the process for determining the rotation angle of the holder and wafer.This is a schematic diagram of the upper part of a vacuum deposition apparatus viewed from above, showing the markings for visual inspection. The embodiments of this technology will be described below with reference to the drawings. ≪First Embodiment≫ <Overall configuration of the vacuum deposition apparatus 100> Figure 1 is a schematic side view showing a vacuum deposition apparatus 100 according to one embodiment of this technology. Figure 2 is a schematic view of the upper part of the vacuum deposition apparatus 100 as seen from above. As shown in Figure 1, the vacuum deposition apparatus 100 includes a vacuum chamber 20 as a vacuum vessel. Inside the vacuum chamber 20, on its upper side, are arranged a plurality of holders 10, each capable of holding a wafer 1 (the material to be deposited), a rotation axis 21 fixed to each holder 10, and a rotation gear 22 fixed to each rotation axis 21. Furthermore, inside the vacuum chamber 20, on its upper side, there is a rotating body 24 that can rotatably support the rotation axis 21 of the holder 10 and rotate around the orbital axis 23 as its central axis, and a fixed gear 26 that meshes with the rotation gear 22 of the holder 10. In Figure 2, the holder 10 below the rotating body 24 and the wafer 1 held below the holder 10 are normally hidden and not visible. However, to facilitate understanding of this embodiment, the holder 10 and the wafer 1 are shown with solid lines in Figure 2. The same applies to Figures 3A, 3B, and 16, which will be described later. Furthermore, inside the vacuum chamber 20, a crucible 31 for storing the deposition material as a deposition source and an electron beam device 32 for heating the deposition material by irradiating it with an electron beam are arranged on its lower side. Furthermore, inside the vacuum chamber 20, a partition wall 33 is provided to cover the crucible 31 and the electron beam apparatus 32, and a shutter 34 for the deposition source, which can open and close an opening in the partition wall 33, is arranged on its lower side. Furthermore, a vacuum pump 41 is provided outside the vacuum chamber 20 to evacuate the inside of the vacuum chamber 20. Also outside the vacuum chamber 20 are an imaging unit 43 capable of imaging at least one of the multiple holders 10 holding the wafer 1, and an illumination unit 44 that irradiates light onto the holder 10 (and wafer 1) to be imaged during imaging by the imaging unit 43. Furthermore, outside the vacuum chamber 20, there is a display unit 45 for displaying images captured by the imaging unit 43, and a control device 46 for comprehensively controlling each part of the vacuum