JP-7857179-B2 - Alkali-soluble resin composition and cured product thereof

Inventors

• 寺田 拓真
• 木村 純也

Assignees

• 株式会社日本触媒

Dates

Publication Date

20260512

Application Date

20220711

Claims (7)

1. An alkali-soluble resin composition characterized by comprising an alkali-soluble resin having a structure represented by the following formula (1) and metal oxide particles having a number-average primary particle diameter greater than 1 nm and less than 30 nm. (In formula (1), R1 and R8 are the same or different, representing a monovalent organic group having a polymerizable double bond. R2 and R7 are the same or different, representing a hydrogen atom or a group represented by formula (2) below, and at least one of R2 and R7 is the group represented by formula (2) below. R3 and R6 are the same or different, representing a divalent organic group. R4 and R5 are the same or different, representing a substituent. X represents a direct bond , an alkylene group or -SO2- . a represents the number of R4s , an integer from 0 to 4, and if there are multiple R4s , they may be the same or different. b represents the number of R5s , an integer from 0 to 4, and if there are multiple R5s , they may be the same or different. n represents an integer of 1 or more. If n is an integer of 2 or more, then multiple R4s , R5s , R6s , R 7 and X may be the same or different. (In formula (2), R9 represents a divalent organic group which may have substituents.)
2. The alkali-soluble resin composition according to claim 1, characterized in that the metal oxide particles contain at least one metal element selected from the group consisting of titanium, aluminum, zirconium, zinc, tin, cerium, and silicon.
3. The alkali-soluble resin composition according to claim 1 or 2, characterized in that the metal oxide particles are surface-modified metal oxide particles.
4. Furthermore, the alkali-soluble resin composition according to claim 1 or 2 is characterized by containing epoxy (meth)acrylate.
5. Furthermore, the alkali-soluble resin composition according to claim 1 or 2 is characterized by comprising a polymerizable compound and a photopolymerization initiator.
6. The alkali-soluble resin composition according to claim 1 or 2, characterized in that it is for forming a high refractive index transparent film.
7. A cured product obtained by curing the alkali-soluble resin composition according to claim 1 or 2.

Description

This invention relates to an alkali-soluble resin composition and its cured product. More specifically, this invention relates to an alkali-soluble resin composition capable of yielding a cured product with a high refractive index, and its cured product. Alkali-soluble resin compositions are being explored for various applications in optical components and electrical/electronic equipment, such as color filters used in liquid crystal display devices and solid-state image sensors, inks, printing plates, printed circuit boards, semiconductor devices, photoresists, organic insulating films, and organic protective films. Resins and resin compositions with superior properties required for each application are being developed. In recent years, there has been a growing trend towards miniaturization, thinning, and energy efficiency in optical components, electrical and electronic equipment, and consequently, higher performance is required for the various components used. To meet these demands, research is being conducted on alkali-soluble resin compositions that serve as materials for various components. To date, alkali-soluble resin compositions have been developed to meet a variety of requirements. For example, Patent Document 1 describes a photosensitive resin composition for image formation that can achieve both alkali developability and photocurability, and further provides a cured product that is excellent in dimensional stability with respect to temperature changes and does not exhibit brittleness. This composition contains an acid-modified vinyl ester obtained by synthesizing an epoxy compound, a phenol compound, an unsaturated monobasic acid, and a polybasic acid anhydride, using a crystalline epoxy resin with a melting point of 90°C or higher as at least a portion of the epoxy compound, and a phenol compound having a bisphenol S skeleton as at least a portion. For example, Patent Document 2 describes a photosensitive resin composition that, even as a thin film, has a high dielectric constant, suppresses leakage current, and enables high-resolution pattern formation by photolithography. This photosensitive resin composition contains zirconium dioxide particles, a dispersant, a solvent, a binder resin, a polymerizable monomer, and a polymerization initiator, wherein the binder resin contains at least one of an epoxy (meth)acrylate resin having a specific repeating unit structure and an epoxy (meth)acrylate resin having a specific substructure. Japanese Patent Publication No. 2008-250306International Publication No. 2018/021497 The present invention will be described in detail below. Furthermore, combinations of two or more of the individual preferred embodiments of the present invention described below are also preferred embodiments of the present invention. Furthermore, in this specification, "(meth)acrylate" means "acrylate and/or methacrylate," and "(meth)acrylic acid" means "acrylic acid and/or methacrylic acid." 1. Alkali-Soluble Resin Composition The alkali-soluble resin composition of the present invention is characterized by comprising an alkali-soluble resin having a structure represented by the following formula (1) and metal oxide particles. (In formula (1), R1 and R8 are identical or different, representing a monovalent organic group having a polymerizable double bond. R2 and R7 are identical or different, representing a hydrogen atom or a group represented by formula (2) below, and at least one of R2 and R7 is the group represented by formula (2) below. R3 and R6 are identical or different, representing a divalent organic group. R4 and R5 are identical or different, representing a substituent. X represents a direct bond or a divalent organic group. a represents the number of R4s , an integer from 0 to 4, and if there are multiple R4s , they may be identical or different. b represents the number of R5s , an integer from 0 to 4, and if there are multiple R5s , they may be identical or different. n represents an integer of 1 or more. If n is an integer of 2 or more, the multiple R4s , R5s , R6s , R7s and Xs may be identical or different.) (In formula (2), R9 represents a divalent organic group which may have substituents.) The alkali-soluble resin composition of the present invention can yield a cured product with a high refractive index because the alkali-soluble resin has a specific structure containing an aromatic ring, which enables it to exhibit a high refractive index. Furthermore, this structure results in high hydrophobicity and good compatibility with metal oxide particles, allowing the metal oxide particles to disperse well in the resin and fully exert their functions. The components contained in the alkali-soluble resin composition of the present invention are described below. (1) Alkali-soluble resin The alkali-soluble resin used in the present invention has a structure represented by the above formula (1). In formula (1) above, R1 and R8 are the same or different monovalent organic gro