JP-7857208-B2 - Parts transfer device

Inventors

• 春日 大介

Assignees

• ヤマハ発動機株式会社

Dates

Publication Date

20260512

Application Date

20221108

Claims (5)

1. A parts supply unit having a parts placement area on which multiple parts are arranged while attached to an elastically deformable sheet, A head unit comprising: a suction head provided above the component placement area so as to be movable in the vertical direction and for adsorbing and holding the component on the sheet from above; and a head lifting motor for moving the suction head in the vertical direction; A push-up unit comprising: a push-up pin provided below the component placement area so as to be movable in the vertical direction, which pushes up the component to be picked up by the suction head from below through the sheet; and a pin lifting motor for moving the push-up pin in the vertical direction; The system comprises a control unit that controls the head lifting motor and the pin lifting motor, The control unit is With the tip of the push-up pin positioned at a sheet contact position where it contacts the sheet, and the tip of the suction head positioned at a component contact position where it contacts the component on the sheet, the pin lifting motor is controlled to move upward until the tip of the push-up pin reaches a push-up position above the sheet contact position, and the head lifting motor is controlled to move upward in accordance with the upward movement of the push-up pin, thereby performing a push-up movement process. In the aforementioned upward movement process, the speed of upward movement of the upward-moving pin is set to be greater than the speed of upward movement of the suction head, and a load control current upper limit value is set for the drive current of the pin lifting motor and the head lifting motor, indicating the upper limit value when a target load is applied to the component. The drive current of the pin lifting motor and the head lifting motor is maintained at the load control current upper limit value, and the drive of the pin lifting motor and the head lifting motor is continued until the tip of the upward-moving pin reaches the upward-moving position , thereby maintaining a constant distance between the upward-moving pin and the suction head in the component transfer device.
2. The component transfer device according to claim 1, wherein the control unit controls the pin lifting motor and the head lifting motor so that, in the upward movement process, the upward movement of the upward-moving pin begins earlier than the suction head.
3. The aforementioned lifting unit has a rotary encoder provided on the pin lifting motor, The component transfer device according to claim 1 or 2, wherein the control unit detects, in the upward movement process, that the tip of the upward pin has reached the upward position based on a signal output from the rotary encoder.
4. The control unit is As a preprocessing step before the aforementioned upward movement process, a contact movement process is performed in which the pin lifting motor is controlled to move upward until the tip of the upward-moving pin reaches the sheet contact position, and the head lifting motor is controlled to move downward until the tip of the suction head reaches the component contact position. The component transfer device according to claim 1, wherein in the contact movement process, the pin lifting motor and the head lifting motor are controlled so that the drive current of the pin lifting motor and the head lifting motor remain within a range less than or equal to the upper limit of the load control current.
5. The component transfer device according to claim 4, wherein the control unit detects, in the contact movement process, that when the drive current of the pin lifting motor and the head lifting motor reaches the upper limit of the load control current, the tip of the push-up pin reaches the sheet contact position and the tip of the suction head reaches the component contact position.

Description

This invention relates to a component transfer device comprising: a head unit having a suction head for adsorbing and holding components placed in a component placement area from above; and a push-up unit having a push-up pin for pushing up the component to be adsorbed by the suction head from below. A component transfer device is known that picks up components attached to a sheet in a component placement area and transfers them to a substrate or the like. This type of component transfer device comprises a head unit with a suction head that holds components from above, and a push-up unit with a push-up pin that pushes up the component being held by the suction head from below. In this device, the suction head presses down on the component attached to the sheet from above, while the push-up pin pushes up from below. In this device, if the load acting on the component is too large when the push-up pin pushes up the component while it is held by the suction head, the component may be damaged. Conversely, if the load acting on the component is too small, the suction head may not be able to properly hold the component. Therefore, a technology to control the load acting on the component is necessary in this device. Patent Document 1 discloses a technique for controlling the load acting on a component. In the technique disclosed in Patent Document 1, the upward load acting on the component during the upward movement of the upward-pushing pin is measured using a load measuring device, and based on the measurement results, the pressing force acting on the component during the suction movement of the suction head is controlled. Japanese Patent Publication No. 2004-273910 This is a plan view showing the overall configuration of a component mounting device as a component transfer device according to an embodiment of the present invention.These are perspective and side views of the head unit and push-up unit installed in a component mounting device.This is a block diagram showing the control configuration of a component mounting device.This diagram illustrates the processing performed by the processing unit of a control unit installed in a component mounting device.This diagram illustrates the upper limit of the load control current that the processing unit references when performing contact movement processing and upward movement processing.This is a flowchart showing the flow of the contact movement processing performed by the processing unit.This is a flowchart showing the flow of the upward movement process performed by the processing unit.This is a flowchart showing the flow of the upward movement process performed by the processing unit. The embodiments of the present invention will be described below with reference to the drawings. In the following description, directional relationships will be explained using the XYZ Cartesian coordinate axes. The X and Y directions are mutually orthogonal on the horizontal plane, and the Z direction is the vertical direction (up and down direction) that is perpendicular to both the X and Y directions. Furthermore, one side of the X direction will be referred to as the "+X side," and the other side opposite to that side will be referred to as the "-X side." Similarly, one side of the Y direction will be referred to as the "+Y side," and the other side opposite to that side will be referred to as the "-Y side." The component transfer apparatus according to the present invention can be applied to various devices, such as a taping device for housing dies diced from a wafer onto a tape, a die bonder for wire bonding the dies to a substrate, or a component mounting device for mounting the dies onto a substrate. Here, we will describe an example of how the component transfer apparatus of the present invention is applied to a component mounting device. [Overall configuration of the component mounting equipment] As shown in Figure 1, the component mounting apparatus 1 according to this embodiment is a device that mounts (mounts) dies 7a (components) diced from a wafer 7 onto a substrate P. As shown in Figures 1 and 2, the component mounting apparatus 1 comprises a base 2, a conveyor 3, a head unit 4, a component supply unit 5, a wafer supply device 6, a camera unit 32U, and a push-up unit 40. The base 2 is the mounting base for various devices provided by the component mounting device 1. The conveyor 3 is a transport line for the substrate P, installed on the base 2 so as to extend in the X direction. The conveyor 3 transports the substrate P from outside the machine to a predetermined mounting position and, after the mounting work is completed, transports the substrate P from the mounting position to outside the machine. The conveyor 3 has a clamping mechanism (not shown) that holds the substrate P at the mounting position. The position where the substrate P is shown in Figure 1 is the mounting position. The component supply unit 5 supplies multiple dies 7a in a diced state from the wa