JP-7857357-B2 - A method for determining probing parameters used when a probe system tests a device under test, a probe system and its operation method, a computer-readable non-temporary recording medium, a method for testing an unpackaged semiconductor device, a tested semiconductor device and its manufacturing method, and a method for generating a virtual mark image.

JP7857357B2JP 7857357 B2JP7857357 B2JP 7857357B2JP-7857357-B2

Inventors

ルミヤンチェフ、アンドレイ
池琳琳
白敬琳

Assignees

旺▲夕▼科技股▲分▼有限公司

Dates

Publication Date: 20260512
Application Date: 20240801
Priority Date: 20230804

Claims (20)

A method for determining probing parameters used when a probe system performs a test on a device under test, The steps include defining a dataset that shows the relationship between slip distance and probing stroke based on the shape of the probe in the probe assembly of the probe system and the shape of the contact pad of the device under test, and A step of providing a control device with one of the slip distance value and the probing stroke value, The aforementioned sliding distance value is defined as the distance the probe tip slides over the contact pad of the device being measured after it has made contact with the contact pad. The probing stroke value is defined as the distance the probe assembly and the device under test move relative to each other again after the probe tip has contacted the contact pad of the device under test, step, A step of providing the control device with one of the probe target position and the probe current position, The probe target position is the position where the probe tip of the probe is expected to stop after sliding over the contact pad of the device being measured. The current position of the probe is the current position of the probe tip, a step and A method characterized by comprising the steps of: using the control device to determine the other of the slip distance value and the probing stroke value based on one of the slip distance value and the probing stroke value, and a dataset showing the relationship between the slip distance and the probing stroke; and determining a position used for relative positioning of the probe assembly and the device under measurement based on the slip distance value and the probing stroke value, and one of the probe target position and the probe current position.
A method for determining probing parameters used when the probe system described in claim 1 performs a test on a device under test, The probe target position is provided to the control device, The position used for relative positioning of the probe assembly and the device under measurement is the probe contact position. The probe contact position is the position where the tip of the probe is expected to begin contacting the contact pad of the device under measurement, and the method is characterized by being used to position the tip of the probe at the probe contact position.
A method for determining probing parameters used when the probe system according to claim 2 performs a test on a device under test, A method further comprising the step of confirming that both the probe contact position and the probe target position are located within an acceptable range corresponding to the contact pad of the device under measurement.
A method for determining probing parameters used when the probe system according to claim 2 performs a test on a device under test, A method further comprising the steps of using the control device to generate a virtual alignment mark that indicates the probe contact position, and aligning the probe tip of the probe with respect to the virtual alignment mark.
A method for determining probing parameters used when the probe system described in claim 1 performs a test on a device under test, The current position of the probe is provided to the control device. The position used for relative positioning of the probe assembly and the device under measurement is a relative target position. A method characterized in that the relative distance between the relative target position and the current probe position is the same as the sliding distance value, and the relative target position and the probe assembly are moved synchronously relative to the device under test, thereby moving the relative target position to a position corresponding to the contact pad of the device under test, and the probe assembly and the device under test are used to position each other.
A method for determining probing parameters used when the probe system according to claim 5 performs a test on a device under test, A method further comprising the steps of using the control device to generate a virtual alignment mark that displays the relative target position, moving the virtual alignment mark relatively to a position corresponding to the contact pad of the device under measurement, and moving the relative target position to a position corresponding to the contact pad of the device under measurement.
A method for determining probing parameters used when the probe system described in claim 1 performs a test on a device under test, A dataset showing the relationship between slip distance and probing stroke is constructed using the probe system and calibration substrate, and the method of construction is as follows: The step of bringing the tip of the probe into contact with the calibration substrate, The steps include: moving the probe and the calibration substrate relative to each other by one probing stroke in the vertical axis direction, generating a sliding distance by sliding the tip of the probe on the calibration substrate, and observing the sliding distance using an optical image forming apparatus; and A method characterized by comprising the step of using the control device to generate a dataset showing the relationship between the sliding distance and the probing stroke, based on the sliding distance and the probing stroke.
A method for operating a probe system, The probe system comprises a probe assembly and a control device. The probe assembly includes a probe having a probe tip used to contact the contact pad of the device under test, The operation method of the probe system is as follows: The steps include: using the control device described above to perform a method for determining probing parameters used when the probe system described in claim 2 performs a test on a device under test; The steps include using the control device to position the probe tip of the probe at the probe contact position, The steps include: executing a probing stroke work program using the control device; The probing stroke operation program is characterized in that it causes the probe assembly and the device under measurement to move relative to each other by a probing stroke value, so that the probe tip of the probe is deflected and slides and stops at the probe target position.
A method for operating a probe system, The probe system comprises a probe assembly and a control device. The probe assembly includes a probe having a probe tip used to contact the contact pad of the device under test, The operation method of the probe system is as follows: The steps include: using the control device described above to perform a method for determining probing parameters used when the probe system described in claim 5 performs a test on a device under test; Using the control device, the relative target position is moved relative to the position corresponding to the contact pad of the device under measurement. The steps include: executing a probing stroke work program using the control device; The probing stroke operation program is characterized in that it causes the probe assembly and the device under test to move relative to each other by a probing stroke value, so that the probe tip of the probe is deflected and slides and stops at a position corresponding to the contact pad of the device under test.
A probe system, A chuck including a chuck support surface configured to support a substrate containing one or more devices to be measured, A probe assembly comprising a probe having a probe tip, wherein the probe is configured to test a device under test, An optical image forming apparatus configured to receive optical images of at least a portion of the probe system, the optical images of at least a portion of the probe assembly being included therein, A probe system comprising: a control device programmed to perform a method for determining probing parameters used when the probe system according to claim 1 performs a test on a device under test.
A non-temporary recording medium that can be read by a computer, Includes instructions that a computer can execute, A recording medium characterized in that, when the command is executed, it instructs the probe system to perform a method for determining probing parameters used when the probe system described in claim 1 performs a test on a device under test.
A method for testing unpackaged semiconductor devices, The step of providing at least one probe assembly, which includes a probe having a probe tip configured for mechanical and electrical contact with an unpackaged semiconductor device, The steps of providing a control device programmed to perform a method for determining probing parameters used when the probe system described in claim 1 performs a test on a device under test, and to obtain results, A test method characterized by including the step of using the control device to perform a test on the unpackaged semiconductor device with the probe, based on the results described above.
A tested method for manufacturing a semiconductor device, The step of providing at least one probe assembly, which includes a probe having a probe tip configured for mechanical and electrical contact with an unpackaged semiconductor device, The steps of providing a control device programmed to perform a method for determining probing parameters used when the probe system described in claim 1 performs a test on a device under test, and to obtain results, A manufacturing method characterized by comprising the step of using the control device to perform a test on the unpackaged semiconductor device with the probe, based on the results described above.
A tested semiconductor device, A non-packaged semiconductor device comprising multiple contact pads, The aforementioned unpackaged semiconductor device is tested by a single test process. The aforementioned test process is The probe system according to claim 1 performs a method for determining probing parameters used when testing a device under test and obtains the results, A semiconductor device characterized in that the contact pad is made to receive mechanical and electrical contact performed based on the above result.
A method for generating virtual mark images, used to generate virtual mark images that represent a part of a probe system, The probe system is A substrate having one or more devices to be measured, The system comprises a probe configured for performing tests on the device under measurement, The aforementioned method, A step of using an optical image forming apparatus to acquire a current probe system image which includes an image of at least a part of the probe and an image of at least a part of the substrate, Using a control device, a step of generating a virtual mark image based at least partially on the current probe system image, The step includes displaying the virtual mark image using a display device, The aforementioned virtual mark image includes a display of the probe contact position or a display of the probe target position. The probe contact position is the position where the tip of the probe is expected to begin contacting the contact pad of the device under measurement. The generation method is characterized in that the probe target position is the position where the probe tip of the probe is expected to stop after sliding over the contact pad of the device under measurement.
A method for generating a virtual mark image according to claim 15, The control device is characterized by obtaining the other of the slip distance value and the probing stroke value based on one of the slip distance value and the probing stroke value, and a dataset showing the relationship between the slip distance and the probing stroke, and obtaining the probe contact position based on the slip distance value and the probe target position.
A method for generating a virtual mark image according to claim 15, The control device acquires the other of the slip distance value and the probing stroke value based on one of the slip distance value and the probing stroke value, and a dataset showing the relationship between the slip distance and the probing stroke, acquires a relative target position based on the slip distance value and the current probe position, and the current probe position is the current position of the probe tip, and the relative distance between the relative target position and the current probe position is equal to the slip distance value.
A method for generating a virtual mark image according to claim 15, In the current probe system image, the device under measurement is clearer than at least the tip of the probe. The step of generating a virtual mark image includes the step of generating a virtual alignment mark, The generation method is characterized in that the virtual alignment marks indicate the probe contact positions.
A method for generating a virtual mark image according to claim 15, In the current probe system image, at least the tip of the probe is clearer than the device being measured. The step of generating a virtual mark image includes the step of generating a virtual alignment mark, The aforementioned virtual alignment marks display the relative target position. A generation method characterized in that the relative relationship between the relative target position and the current position of the probe tip is equal to the relative relationship between the probe target position and the probe contact position.
A method for generating a virtual mark image according to claim 18 or 19, The step of generating a virtual alignment mark involves determining the relative position of the virtual alignment mark with respect to the probe tip of the probe, The generation method is characterized in that the step of generating a virtual mark image is to modify the virtual mark image based on the relative position of the virtual alignment mark with respect to the probe tip of the probe, which has been determined, so that the virtual mark image includes the virtual alignment mark.

Description

This invention relates to a technique for performing inspection and measurement using a probe assembly, and more particularly to a method for determining probing parameters used when a probe system tests a device under test, a method for operating a probe system using the same method, a probe system, a computer-readable non-temporary recording medium, a method for testing an unpackaged semiconductor device, a method for manufacturing a tested semiconductor device, a tested semiconductor device, and a method for generating a virtual mark image. As shown in Figures 1A and 1B, conventionally, when testing a device under test using a probe assembly, the device under test is placed on a chuck, and the probe assembly and the chuck move relative to each other until the probe tip 11 of the probe 10 of the probe assembly makes initial contact with the contact pad 12 of the device under test. At this time, the probe tip 11 of the probe 10 is located at the initial contact position P1 (see Figures 1A and 1B). Subsequently, the probe assembly and the chuck move relative to each other over a predetermined distance (probing stroke (overdrive) OD) in the vertical direction (i.e., the Z-axis). Normally, the chuck moves upward from the contact height and approaches the probe assembly, so that the probe tip 11 of the probe 10 and the surface of the contact pad 12 of the device under test receive force and make secure contact with each other. Simultaneously, the probe tip 11 of the probe 10 deflects (i.e., moves along the X or Y axis), travels a predetermined distance (skate distance, SD) across the surface of the contact pad 12, and stops at the final contact position P2, thereby generating a probe mark on the surface of the contact pad 12. The length of the probe mark is equal to the skate distance, SD. For the probe assembly to exhibit good test performance for the device under test and to maintain that performance consistently, it is usually desirable that consistent probe marks be generated in each test. That is, accurate initial contact position P1, final contact position P2, and skate distance SD are required. Currently, before starting a test, it is necessary to first find the appropriate probing stroke OD using a calibration board. This process is very inconvenient and time-consuming. For example, there is at least a difference in material between the calibration board and the device under test during actual operation. Therefore, even if the appropriate probing stroke OD is obtained on the calibration board, it is difficult to guarantee that the probe tip 11 of the probe 10 will stop at a predetermined final contact position P2 when applied to the device under test. If the device under test is the calibration reference (test circuit) of the calibration board, it is usually not possible to know the initial contact position P1 at which the probe tip 11 of the probe will stop at the predetermined final contact position P2 without performing calibration tests of the probing stroke OD on that calibration reference (test circuit). This process is not only inconvenient and time-consuming, but repeated operation can also cause wear and damage to the probe or calibration reference. Furthermore, errors may occur in the calibration results of the probing stroke OD, which can result in the final contact position P2 during actual testing being inaccurate and leading to incorrect test results. An accurate final contact position P2 is particularly important in high-frequency testing. More specifically, once the probing stroke OD is acquired, this setting is uniformly applied to all devices under test on the circuit board. Therefore, it is not practical to individually adjust and set the probing stroke OD for each device under test so that the probe tip 11 of the probe 10 stops at the desired final contact position P2 in order to obtain good test results. Furthermore, when performing tests, it is necessary to confirm, using an image forming apparatus (e.g., a microscope), whether the position where the probe tip 11 of the probe 10 is initially in contact with the contact pad 12 of the device under test is the desired initial contact position P1. However, because the field of view (FOV) of the image forming apparatus is narrow, even when the probe tip 11 of the probe 10 and the contact pad 12 of the device under test are on the same plane, they generally cannot be seen clearly at the same time, except when the probe tip 11 of the probe 10 and the contact pad 12 of the device under test are in contact. Therefore, even if the desired initial contact position P1 is known, it is difficult to accurately position the probe tip 11 of the probe 10 to the desired initial contact position P1. As a result, it is difficult to produce consistent probe marks, and it is difficult to maintain and achieve consistent good test performance of the device under test using the probe assembly. This is a side view showing the state in which the tip of the p