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JP-7857377-B2 - Dynamic release tape for assembling individual components

JP7857377B2JP 7857377 B2JP7857377 B2JP 7857377B2JP-7857377-B2

Inventors

  • ヴァル・マリノフ
  • ユーリー・アタナソフ

Assignees

  • キューリック・アンド・ソファ・ネザーランズ・ベーフェー

Dates

Publication Date
20260512
Application Date
20241114
Priority Date
20190215

Claims (20)

  1. The invention provides a dynamic release tape, wherein the dynamic release tape comprises (a) a flexible support layer and (b) a dynamic release structure disposed on the flexible support layer. The aforementioned dynamic peeling structure is An absorption layer configured to generate gas in response to light irradiation, A foamed layer, different from the absorbent layer, is disposed on the absorbent layer and is configured to mechanically react to the gas generated by the absorbent layer. A device equipped with the following features.
  2. The apparatus according to claim 1, wherein the dynamic release tape has sufficient rigidity to allow individual components to be laser-transferred from the dynamic release tape.
  3. The apparatus according to claim 1, wherein the dynamic release tape has sufficient rigidity to maintain a substantially planar configuration during laser transfer of individual components from the dynamic release tape.
  4. The apparatus according to claim 1, wherein the flexible support layer comprises a polymer.
  5. The apparatus according to claim 1, wherein the dynamic peel structure includes a plurality of layers.
  6. The apparatus according to claim 1, wherein the absorbent layer is an absorbent adhesive layer disposed on the flexible support layer , and is further configured to adhere to the flexible support layer.
  7. The apparatus according to claim 1, wherein the dynamic release structure comprises (a) an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer, and (b) an active layer structure disposed on the adhesive layer.
  8. The apparatus according to claim 7 , wherein the active layer structure comprises (a) the absorbent layer disposed on the adhesive layer and (b) the foamed layer.
  9. The process includes the step of forming a dynamic release structure on a flexible support layer to form a dynamic release tape, The step of forming the dynamic peel structure is, The steps include forming an absorption layer configured to generate gas in response to light irradiation, A step of forming a foamed layer on the absorbent layer, wherein the foamed layer is configured to mechanically react to the gas generated by the absorbent layer. Methods that include ...
  10. The method according to claim 9 , wherein the step of forming the dynamic peel structure includes the step of forming a plurality of layers on the flexible support layer.
  11. The method according to claim 9, wherein the step of forming the absorbent layer is a step of forming an absorbent adhesive layer on the flexible support layer, wherein the absorbent adhesive layer is further configured to adhere to the flexible support layer.
  12. The step of forming the dynamic peel structure is, A step of forming an adhesive layer on the flexible support layer, wherein the adhesive layer is configured to adhere to the flexible support layer, The method according to claim 9 , comprising the step of forming an active layer structure on the adhesive layer.
  13. The step of forming the aforementioned active layer structure is, The steps include forming the absorbent layer on the adhesive layer, The steps of forming the foamed layer on the absorbent layer and The method according to claim 12, including the method described in claim 12 .
  14. A dynamic peeling device, Flexible support layer, A dynamic release structure disposed on the flexible support layer, comprising: (a) an adhesive layer disposed on the flexible support layer and configured to adhere to the flexible support layer; and (b) an active layer structure disposed on the adhesive layer . The aforementioned active layer structure is An absorption layer disposed on the aforementioned adhesive layer, configured to generate gas in response to light irradiation, A foamed layer, different from the absorbent layer, is disposed on the absorbent layer and is configured to mechanically react to the gas generated by the absorbent layer. A dynamic peeling device equipped with the following features.
  15. The dynamic peeling apparatus according to claim 14 , wherein the dynamic peeling structure comprises a component adhesive layer.
  16. The steps include providing individual components attached to a dicing tape, The steps include: transferring the individual components from the dicing tape to the dynamic release tape so as to form an individual component assembly including (a) a flexible support layer and (b) a dynamic release structure disposed on the flexible support layer; A method comprising the step of directly placing the flexible support layer of the individual component assembly onto a support plate of a component transfer system.
  17. The method according to claim 16 , wherein the step of transferring the individual components to the dynamic release tape includes the step of adhering the individual components to the component adhesive layer of the dynamic release structure.
  18. The method according to claim 16 , wherein the dynamic release structure of the dynamic release tape comprises a plurality of layers.
  19. The method according to claim 18 , wherein the step of transferring the individual components from the dicing tape to the dynamic release tape includes the step of bonding the wafer to the component adhesive layer.
  20. The method according to claim 16 , wherein the step of directly placing the flexible support layer on the support plate includes the step of directly attaching the flexible support layer to the support plate.

Description

Priority Claim This application claims priority to U.S. Patent Application No. 62/843,904, filed on 6 May 2019, and U.S. Patent Application No. 62/806,154, filed on 15 February 2019, both of which are incorporated herein by reference in their entirety. This specification generally relates to the assembly of individual components on a substrate. U.S. Patent Application Publication No. 2014/0238592International Publication No. 2018/231344 This is a diagram of the laser-assisted transfer process.This is a diagram of the laser-assisted transfer process.This is a diagram of a dynamic release tape with a support mounting device.This is a diagram of a dynamic release tape with a support mounting device.This is a diagram of a dynamic release tape with a support mounting device.This is a diagram of a system for laser-assisted transfer of individual components.This is a diagram of a system for laser-assisted transfer of individual components.This is a process diagram.This is a process diagram.This is a diagram of a multilayer dynamic release tape mounted on a support plate.This is a diagram of a multilayer dynamic release tape mounted on a support plate.This is a diagram of a multilayer dynamic release tape mounted on a support plate.This is a diagram of a multilayer dynamic delamination structure.This is a diagram of a multilayer dynamic delamination structure.This is a diagram of a multilayer dynamic delamination structure.This is a diagram of a dynamic release tape with a support mounting device. This specification describes a method for laser-assisted transfer of individual components from a thin, flexible dynamic release tape disposed on a support plate of a component transfer system. The dynamic release tape includes a multilayer dynamic release structure disposed on a support layer such as a backing. Each layer of the dynamic release structure can be specifically designed to target one or more functions of the dynamic release structure, such as adhesion, optical properties, or mechanical properties. Laser-assisted transfer of individual components from a dynamic release tape disposed on a carrier substrate is also described. Figures 1A and 1B illustrate a laser-assisted transfer process for high-throughput, low-cost, non-contact assembly of discrete components 102 onto a rigid or flexible substrate. The term discrete component generally refers to any unit that becomes part of a product or electronic device, e.g., an electronic, electromechanical, photovoltaic, photonic, or optoelectronic component, module, or system, e.g., any semiconductor material having a circuit formed on part of a semiconductor material. In some examples, the discrete component may be a light-emitting diode (LED). The discrete component can be ultrathin, i.e., with a maximum thickness of 50 μm or less, 40 μm or less, 30 μm or less, 25 μm or less, 20 μm or less, 10 μm or less, or 5 μm or less. The discrete component can be ultraminiature, i.e., with a maximum length or width dimension of 300 μm or less per side, 100 μm or less per side, 50 μm or less per side, 20 μm or less per side, or 5 μm or less per side. Individual components can be made ultra-thin and ultra-compact. Figures 1A and 1B show a portion of the support mount 100 of the component transfer system for laser-assisted transfer of individual components 102. The support mount 100 holds the flexible individual component assembly 108 in place for the laser-assisted transfer process. The support mount (described in more detail below) may include a rigid support plate 106 mounted on a frame (not shown, described in more detail below). The frame provides stability to the rigid support plate 106. In some examples, the frame may be manipulated, for example, for alignment purposes. The individual component assembly 108 can be attached to the support plate 106 by attractive force, tensile stress, or other means, as described in more detail below. The placement of the individual component assembly 108 on the support plate 106 is non-permanent, for example, so that the individual component assembly 108 can be removed from the support plate 106 after the laser-assisted transfer process is completed without damaging the support plate 106. By non-permanently mounting the individual component assemblies 108 onto the support plate 106, the support plate 106 becomes available for use in multiple transfer processes involving multiple individual component assemblies 108. The individual component assembly 108 includes a dynamic release tape 110 mounted on a wafer ring (not shown), to which individual components 102 are bonded. While only a single individual component 102 is shown here, multiple individual components 102 can also be bonded to the dynamic release tape 110 and transferred by a component transfer system. The dynamic release tape (e.g., tape 110) is a tape comprising a flexible support layer 112 and a dynamic release structure 114 disposed on the flexible support layer 112. The tape is a