JP-7857400-B2 - Phenol resin foam and its laminate

Inventors

• 宮田 成実
• 栗田 英徹

Assignees

• 旭化成建材株式会社

Dates

Publication Date

20260512

Application Date

20230420

Priority Date

20220422

Claims (5)

1. The hydrofluoroether represented by the following formula (Formula 1) is contained in an amount of 0.03 to 4.3% by mass relative to the phenolic resin foam. The foaming agent contains hydrofluoroolefin, The closed-cell ratio is 80% or more. A phenolic resin foam having an average cell diameter of 70 μm or more and 180 μm or less . (Formula 1): C a H b F c -O-C x H y F z (However, a, b, c, x, y, z are integers, and 2 ≤ a ≤ 7, 0 ≤ b ≤ 3, c = 2a + 1 - b, b ≤ 2a + 1, 1 ≤ x ≤ 3, 2 ≤ y ≤ 7, z = 2 × x + 1 - y, y ≤ 2x + 1)
2. The phenolic resin foam according to claim 1, wherein the hydrofluoroether represented by (Formula 1) is any of the following: methyl perfluoropropyl ether, methyl nonafluorobutyl ether, methyl nonafluoroisobutyl ether, ethyl nonafluorobutyl ether, ethyl nonafluoroisobutyl ether, 1,1,1,2,2,3,4,5,5,5-decafluoro-3-methoxy-4-(trifluoromethyl)-pentane, or 1,1,2,2-tetrafluoroethyl-2,2,2-trifluoroethyl ether.
3. The phenolic resin foam according to claim 1 or 2, wherein the foaming agent contains a hydrocarbon.
4. The phenolic resin foam according to claim 1 or 2, wherein the density is 10 kg/ m³ or more and 70 kg/ m³ or less.
5. A laminate of phenolic resin foam according to claim 1 or 2, wherein a surface material is provided on at least one of one side of the phenolic resin foam and the back surface of said side.

Description

Cross-reference of related applications This application claims priority to Japanese Patent Application No. 2022-071172, filed in Japan on April 22, 2022, and the entire disclosure of the earlier application is incorporated herein by reference. This invention relates to a phenolic resin foam and its laminate. Unlike fibrous materials such as glass wool and rock wool, foamed plastic insulation materials exhibit significantly higher insulation performance by incorporating gases with low thermal conductivity within their bubbles. Therefore, they are widely used in exterior wall materials such as metal siding, wall materials without partition panels, as well as in building materials such as ceiling materials, fire doors, and shutters. In recent years, concerns about global warming have made reducing greenhouse gas emissions an urgent priority. Among the various methods for reducing greenhouse gas emissions through energy conservation, high-performance insulation in buildings has attracted attention. Because higher insulation performance leads to greater energy savings, further improvements in insulation performance have been sought. Phenolic resin foam is a prime example of a foam with high thermal insulation performance. To improve thermal insulation performance, attempts have been made to reduce the size of the foam's bubbles, in addition to using gases with low thermal conductivity. Patent Document 1 discloses that a phenolic resin foam with high thermal insulation performance can be obtained by adding a fluoroether that has the effect of reducing the size of the bubbles in the phenolic resin foam, thereby reducing the size of the bubbles in the phenolic resin foam. Patent Document 2 also discloses that the thermal insulation of a phenolic resin foam can be improved by adding a powdered solidified phenolic resin to reduce the size of the bubbles in the phenolic resin foam. Japanese Patent Application Publication No. 11-140217Japanese Patent Publication No. 2017-210618 The embodiments for carrying out the present invention (hereinafter referred to as "this embodiment") will be described in detail below. It should be noted that the present invention is not limited to the following embodiments, and can be implemented with various modifications within the scope of its gist. Furthermore, in this specification, a "phenol resin composition" is used to describe a "phenol resin composition" to which a surfactant has been added, and a "foaming phenol resin composition" is used to describe a "phenol resin composition" to which a hydrofluoroether, foaming agent, foaming nucleating agent, and acid curing agent, etc., have been added to impart foaming properties or both foaming and curing properties. The resulting foam is also referred to as "phenol resin foam." <Phenolic resin foam> The phenolic resin foam of this embodiment is produced from a phenolic resin composition containing a hydrofluoroether, a foaming agent, and an acidic curing agent. The hydrofluoroether contained in the phenolic resin foam of this embodiment is represented by (Formula 2). Formula 2: C a H b F c -O-C x H y F z (However, a, b, c, x, y, z are integers, and 2 ≤ a ≤ 7, 0 ≤ b ≤ 3, c = 2a + 1 - b, b ≤ 2a + 1, 1 ≤ x ≤ 3, 2 ≤ y ≤ 7, z = 2 × x + 1 - y, y ≤ 2x + 1) Adding this hydrofluoroether to a phenolic resin or phenolic resin composition reduces the bubble diameter of the phenolic resin foam. Generally, the content is 0.03% to 4.3% by mass relative to the phenolic resin foam, preferably 0.1% to 3.8% by mass, more preferably 0.3% to 3.3% by mass, and most preferably 0.5% to 3.3% by mass. This hydrofluoroether may be a combination of two or more molecules corresponding to formula 2. If the hydrofluoroether content is 0.03% by mass or more, the thermal conductivity tends to be low. Also, if the hydrofluoroether content is 4.3% by mass or less, even when using a hydrofluoroether with a high boiling point, there is little concern that the thermal conductivity will increase or the rigidity of the phenolic resin will decrease due to an increase in the amount of hydrofluoroether liquefied in the foam. In this embodiment, in order to set the hydrofluoroether content in the phenolic resin foam within the above range (0.03% by mass to 4.3% by mass), the amount of hydrofluoroether added per 100 parts by mass of the phenolic resin composition is preferably 0.1 to 6.8 parts by mass, although this varies depending on the type of hydrofluoroether, its compatibility with the phenolic resin, and the foaming and curing conditions such as the foaming temperature and residence time during foam production. Hydrofluoroethers are thought to act as bubble nuclei in phenolic resins, increasing the number of bubbles in the foamed phenolic resin composition. This is thought to reduce the average bubble diameter of the phenolic resin foam, suppress radiant heat conduction, and lower the thermal conductivity of the phenolic resin foam. While there are no particular limitations