JP-7857448-B1 - Reversing device and plating production line

JP7857448B1JP 7857448 B1JP7857448 B1JP 7857448B1JP-7857448-B1

Abstract

[Problem] To provide a reversing device and a plating production line. [Solution] The inversion device is used in a plating production line, which includes two horizontal plating devices. The inversion device is installed between the two horizontal plating devices and includes a machine frame, a feeding mechanism and an inversion mechanism installed on the machine frame. The feeding mechanism has a horizontal transport surface for horizontally placing circuit boards. A circuit board plated by one horizontal plating device enters the horizontal transport surface and is transported horizontally through the feeding mechanism to the other horizontal plating device. During transport, the inversion mechanism flips the circuit board on the horizontal transport surface so that the plating transport mechanisms of the two horizontal plating devices each sandwich the circuit board on its opposing sides, and also swaps the positions of the two opposing sides of the circuit board. This makes the plating layer of the circuit board, which has been plated twice by the two horizontal plating devices, more uniform and effectively improves the production quality of the circuit board. [Selection Diagram] Figure 4

Inventors

陳徳和

Assignees

東莞宇宙電路板設備有限公司

Dates

Publication Date: 20260512
Application Date: 20250124
Priority Date: 20241104

Claims (10)

A reversing device used in a plating production line, The plating production line includes a horizontal plating apparatus, the horizontal plating apparatus includes a plating transport mechanism and a plating cylinder, the plating transport mechanism is used to plate the circuit board by moving it within the plating cylinder with its sides sandwiched between them, and the reversing apparatus is provided between two of the horizontal plating apparatuses and includes a machine frame, a feeding mechanism and a reversing mechanism provided on the machine frame. At both ends of the feeding mechanism closest to the two horizontal plating apparatuses, a first horizontal plane and a second horizontal plane are provided, respectively. The first horizontal plane is used to receive the plated circuit board from one of the horizontal plating apparatuses, and the feeding mechanism transports the circuit board to the second horizontal plane, thereby allowing the circuit board to enter horizontally from the second horizontal plane into the other horizontal plating apparatus. The inversion mechanism is characterized in that it is used to flip the circuit board in the feeding mechanism such that the plating transport mechanisms of the two horizontal plating apparatuses each sandwich the circuit board on opposite sides.
The reversing mechanism includes a drive assembly, a rotating shaft, and a clamping assembly. The reversing device according to claim 1, wherein the clamping assembly is provided on the rotating shaft, the rotating shaft is driven and connected to the drive assembly, the clamping assembly is provided with an insertion groove for inserting a circuit board, and the drive assembly is used to rotate the rotating shaft so that the clamping assembly reverses the circuit board.
The aforementioned clamping assembly is It includes a plurality of locking blocks arranged at intervals along the longitudinal direction of the rotation axis, each of which has a locking groove. The reversing device according to claim 2, characterized in that a plurality of the locking grooves communicate with each other to form the insertion groove.
The clamping assembly further includes a plurality of first guide wheels arranged at intervals on the rotating shaft and provided at the bottom of the locking groove for sliding contact with the side of the circuit board, The reversing device according to claim 3, characterized in that a plurality of locking blocks and a plurality of first guide wheels are provided on opposite sides of the rotating shaft.
The reversing device according to claim 2, characterized in that the drive assembly includes a drive motor, a transmission belt, and a transmission wheel, one end of the rotating shaft is connected to the transmission wheel, the transmission belt is fitted to the transmission wheel and the drive motor, and the drive motor rotates the transmission wheel via the transmission belt, thereby rotationally driving the rotating shaft.
The inversion device according to any one of claims 1 to 5, characterized in that the feeding mechanism includes a first transport line and a second transport line provided at intervals, the first transport line and the second transport line transport circuit boards along a first direction, and the inversion mechanism is provided between the first transport line and the second transport line to invert the circuit boards in the first transport line to the second transport line.
The aforementioned feeding mechanism is To push the circuit board in the first transport line to the reversing mechanism, a first push assembly is provided on the first transport line, The reversing device according to claim 6, further comprising a second push assembly provided on the second transport line for pushing a circuit board on the second transport line and moving it along the first direction.
The feeding mechanism further includes a third transport line and a fourth transport line, wherein the fourth transport line extends along the transport direction of the first transport line, the second push assembly is used to push the circuit board in the second transport line to the third transport line, and the third transport line is provided along a second direction for transporting the circuit board in the second transport line to the fourth transport line, with the first direction and the second direction being at an angle. The reversing device according to claim 7, characterized in that the third transport line is docked to the second transport line and the fourth transport line and is provided to be vertically movable along the third direction in order to rise to push up the circuit board in the second transport line or to lower to place the circuit board in the third transport line onto the fourth transport line.
The aforementioned feeding mechanism is To push the circuit board in the third transport line along the second direction to the fourth transport line, a third push assembly is provided on the third transport line, The fourth push assembly further includes a fourth push assembly for pushing a circuit board in the fourth transport line along the first direction and for adjusting the pitch between two adjacent circuit boards, and/or the feeding mechanism further includes a positioning assembly provided on the fourth transport line, wherein the third push assembly pushes a circuit board located on the third transport line to move it along the second direction and bring it into contact with the positioning assembly, characterized in that the reversing device according to claim 8.
It is a plating production line, Two horizontal plating machines, A plating production line characterized by including a reversing device according to claim 1, which is provided between two of the horizontal plating devices.

Description

This invention relates to the technology of circuit board plating, and more particularly to a reversing device and a plating production line. The primary plating effect of conventional PCB substrates is not ideal, requiring secondary and tertiary plating. While the primary and secondary plating are thin, uniform plating is required on the substrate surface. Therefore, a horizontal plating method is employed for both primary and secondary plating. To maximize the plating effect, the substrate is flipped over and the clamping points or edges are swapped. Generally, the plating is thicker closer to the clamping points or edges due to higher current. Flipping the substrate over is necessary because the chemical solution environment differs between the upper and lower surfaces. Conventional flipping devices have low positioning accuracy, slow and complex flipping steps, and low efficiency, affecting the plating quality of the circuit board. To more clearly illustrate embodiments of the present invention or technical solutions in the prior art, the drawings that may be used in the description of embodiments or the prior art are briefly described below. Clearly, the drawings described below represent only a few embodiments of the present invention, and those skilled in the art can obtain other drawings based on the structures shown in these drawings without expending any creative effort. This is a schematic diagram of the structure of one embodiment of the inversion device provided by the present invention. This is a schematic diagram of the internal structure of one embodiment of the inversion device provided by the present invention. This is a schematic diagram of the assembly structure of the feed mechanism and the reversing mechanism in one embodiment of the reversing device provided by the present invention. This is a schematic diagram of the partial structure of the feed mechanism and the reversing mechanism in one embodiment of the reversing device provided by the present invention. This is a schematic diagram showing how a feeding mechanism in one embodiment of the reversing device provided by the present invention transports a circuit board. This is a schematic diagram of the structure of the reversing mechanism in one embodiment of the reversing device provided by the present invention. This is a schematic diagram of the structure of the rotating shaft and clamping assembly in one embodiment of the reversing device provided by the present invention. This is a schematic diagram of the structure of the first push assembly in one embodiment of the reversing device provided by the present invention. This is a schematic diagram of a partial structure of one embodiment of a plating production line provided by the present invention. The realization of the objectives, functional features, and advantages of the present invention will be further described with reference to the drawings and the embodiments. The following, in conjunction with the accompanying drawings of the embodiments of the present invention, clearly and completely describes the technical solutions in the embodiments of the present invention. Clearly, the embodiments described are only a subset of the embodiments of the present invention, not all embodiments. All other embodiments that can be obtained by those skilled in the art without creative work based on the embodiments of the present invention are within the scope of the protection of the present invention. In the embodiments of this invention, if there are directional indicators such as (up, down, left, right, front, back, etc.), these indicators are used solely to describe the relative positional relationships and motion conditions between each component in a specific posture. When that specific posture changes, the directional indicators also change accordingly. Furthermore, in the embodiments of the present invention, if there are descriptions such as "first," "second," etc., these descriptions are used solely for descriptive purposes and cannot be understood as indicating or implying relative importance or implicitly indicating the number of technical features described. Therefore, features limited as "first" or "second" may explicitly or implicitly include at least one other feature. Also, in the case of "and/or" or "and/or" appearing throughout the text, their meaning includes three parallel solutions, and, taking "A and/or B" as an example, includes solution A, or solution B, or a solution that satisfies both A and B simultaneously. Furthermore, while technical solutions between each embodiment can be combined, this must be based on what a person skilled in the art could achieve. If a combination of technical solutions results in a contradiction or is unrealistic, such a combination of technical solutions should be considered nonexistent and outside the scope of protection required by the present invention. The primary plating effect of conventional PCB substrates is not ideal, requ