Search

KR-102959279-B1 - Bonding Apparatus with ACF Using one or more of Ultrasonic and Heat

KR102959279B1KR 102959279 B1KR102959279 B1KR 102959279B1KR-102959279-B1

Abstract

The present invention relates to an ACF bonding device using one or more of ultrasound and heat, which improves durability and shortens the bonding time required for bonding between bonded objects. The device comprises: a tool horn formed to transmit one or more of heat and ultrasound to the bonded objects while a laminate containing the bonded objects is pressurized so that the bonded objects are bonded together; an ultrasound generating unit that receives electrical energy from the outside and transmits ultrasound vibrating in a direction parallel to a first direction to the tool horn; and one or more heater units inserted into the tool horn in the first direction and receiving electrical energy from the outside to transmit heat to the tool horn.

Inventors

  • 정성원
  • 신승환
  • 김병호
  • 정재은

Assignees

  • 주식회사 태일테크

Dates

Publication Date
20260507
Application Date
20230104

Claims (9)

  1. A tool horn formed to transmit one or more of heat and ultrasound to the joined parts while a laminate containing the joined parts is pressed so that the joined parts are joined to each other; An ultrasonic generator that receives electrical energy from an external source and transmits ultrasonic waves vibrating in a direction parallel to the first direction to the tool horn; and It includes one or more heater parts that are inserted into the tool horn in the first direction and receive electrical energy from the outside to transfer heat to the tool horn; The above heater part A heater that is extended in the first direction and inserted into the tool horn, and generates heat using supplied power; and It includes a heater fixing part formed to be coupled to the tool horn and to support one end of a heater inserted into the tool horn in the first direction; The above heater and the above tool horn are a bonding device using one or more of heat and ultrasound that do not come into contact with each other.
  2. delete
  3. In paragraph 1, One side of the tool horn is provided with an insertion hole extending in the first direction so as to insert the heater part, and The above insertion hole is A first insertion hole formed on one surface of the above tool horn; and A bonding device using one or more of heat and ultrasound, characterized by including a second insertion hole that is in communication with the first insertion hole and has a cross-sectional area smaller than that of the first insertion hole.
  4. In paragraph 3, The heater fixing part is received in the first insertion hole, and its outer surface contacts the inner surface of the first insertion hole. A bonding device using one or more of heat and ultrasound, characterized in that the heater is supported by the heater fixing part and accommodated in the second insertion hole with a certain gap.
  5. In paragraph 4, The above heater fixing part is A head portion having a heater insertion hole into which the heater is inserted and a support hole into which a support member capable of pressurizing and supporting the heater is inserted, which intersects the heater insertion hole; and A bonding device using one or more of heat and ultrasound, characterized by including a horn insertion part that is formed extending from the head part and is received in the first insertion hole.
  6. In paragraph 5, The above-mentioned insertion part A first insertion leg whose outer surface contacts the inner surface of the first insertion hole, and whose inner surface contacts and supports a heater; and A bonding device using one or more of heat and ultrasound, characterized by including a second insertion leg that is spaced apart from the first insertion leg, has an outer surface that contacts the inner surface of the first insertion hole, and has an inner surface that contacts and supports a heater.
  7. In paragraph 1, A bonding device using one or more of heat and ultrasound, characterized in that the above-mentioned bonded material is formed to extend in a second direction intersecting the first direction.
  8. delete
  9. A tool horn formed with a horn tip at the lower center, and configured to transmit one or more of heat and ultrasound to the workpiece while a laminate including the workpiece is pressurized through the horn tip; Ultrasonic oscillator that generates electrical energy for generating ultrasound; A converter that converts electrical energy provided by an ultrasonic oscillator into mechanical energy to generate ultrasonic waves in the vertical direction; A booster having an upper end coupled to the converter and a lower end coupled to the tool horn, which amplifies the ultrasonic waves provided from the converter and transmits the ultrasonic waves in the vertical direction to the tool horn; A pair of heater parts inserted into the upper portions of both ends of the tool horn in a longitudinal direction parallel to the vertical direction, receiving power from the outside to transfer heat to the tool horn; A temperature sensor unit positioned between the above pair of heater units to measure the ambient temperature of the horn tip; and A control unit that controls the heater unit and the ultrasonic oscillator based on information including the temperature measured by the temperature sensor unit; The above heater part A heater that is formed to extend in the longitudinal direction and inserted into the tool horn, and generates heat using supplied power; and It includes a heater fixing part formed to be coupled to the tool horn and to support one end of a heater inserted longitudinally into the tool horn; The above heater and the above tool horn are a bonding device using one or more of heat and ultrasound that do not come into contact with each other.

Description

ACF Bonding Apparatus Using one or more of Heat and Ultrasonic Bonding Apparatus with ACF Using one or more of Ultrasonic and Heat The present invention relates to an ACF bonding device using one or more of heat and ultrasound, wherein the durability and reliability are improved and the bonding time required for bonding between works is shortened. With recent industrial advancements, electronic devices are becoming more high-performance, low-power, and smart, while simultaneously undergoing miniaturization. In line with this trend, there has been a demand for technology to electrically bond microelectrodes of electronic components. Conventionally, as a method for electrically connecting microelectrodes of a connection part formed on an electronic component, a conductive or non-conductive adhesive was placed between a connection electrode formed on one electronic component and a connection electrode formed on another electronic component, and the conductive or non-conductive adhesive located between them was compressed and heated using a thermal compression head and then cured to electrically connect the two electronic components. Anisotropic conductive films (ACFs) are typically used as conductive adhesives. Anisotropic conductive films are polymer films that possess electrical anisotropy and adhesive properties, meaning they are conductive in the thickness direction and insulating in the direction parallel to the surface. They are usually composed of solder balls, which are conductive particles such as nickel, gold/polymer, or silver, and primarily thermosetting insulating resins. In a mounting method utilizing this, the film is positioned between upper and lower electrodes on a chip, circuit terminal, printed circuit board, flexible circuit substrate, or rigid substrate. When subjected to simultaneous heat and pressure, conductive particles dispersed within the anisotropic conductive film come into mechanical contact with the upper and lower electrodes, thereby establishing an electrical connection through which current flows. At this time, the applied heat causes the insulating resin to harden, resulting in strong adhesion. When anisotropic conductive films are used as conductive adhesives, conventional methods involved transferring heat to the anisotropic conductive film (ACF) through a tool horn to enable the film to reach the curing temperature required for curing. However, relying solely on this heat transfer method had drawbacks, such as the relatively long time required to reach the curing temperature. To improve this, ultrasound was transmitted to the anisotropic conductive film (ACF) through a tool horn to enable the ACF to reach the curing temperature required for curing. However, there was a problem with temperature variations within the tool horn. FIG. 1 is a perspective view showing a bonding device using ultrasound and heat according to one embodiment of the present invention. FIG. 2 is a partially cutaway perspective view showing a bonding device using ultrasound and heat according to one embodiment of the present invention illustrated in FIG. 1. FIG. 3 is a perspective view showing the arrangement of the tool joint and the joined workpiece. Figure 4 is a cross-sectional view showing a tool horn and a laminate. FIG. 5 is a perspective view showing a tool horn and a heater part and a temperature sensor part provided in the tool horn. FIG. 6 is an exploded perspective view showing the combined relationship between the tool horn, the heater part and the temperature sensor part provided in the tool horn. Figures 7 to 9 are drawings showing a tool horn. FIGS. 10 to 12 are drawings showing a heater fixing part. FIGS. 13 and FIGS. 14 are cross-sectional views showing a tool horn combined with a heater section and a temperature sensor section. The embodiments described below are presented as examples to aid in understanding the invention, and it should be understood that the invention may be implemented with various modifications different from the embodiments described herein. However, in describing the invention, detailed descriptions and specific illustrations of related known functions or components are omitted if it is determined that such detailed descriptions or specific illustrations might unnecessarily obscure the essence of the invention. Furthermore, the attached drawings are not drawn to actual scale to aid in understanding the invention, and the dimensions of some components may be exaggerated. The first and second terms used in this application may be used to describe various components, but the components should not be limited by the terms. The terms are used solely for the purpose of distinguishing one component from another. Furthermore, the terms used in this application are used merely to describe specific embodiments and are not intended to limit the scope of the rights. The singular expression includes the plural expression unless the context clearly indicates otherwise. Terms