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KR-102960759-B1 - Maintenance method and manufacturing method of electronic components

KR102960759B1KR 102960759 B1KR102960759 B1KR 102960759B1KR-102960759-B1

Abstract

The maintenance method is a maintenance method for a cutting device. The cutting device is configured to manufacture electronic components by cutting a package substrate and to perform an external inspection of the electronic components based on first image data. The first image data is generated by capturing an electronic component placed on a table with a camera. This maintenance method includes a step of capturing a standard test specimen placed on a table with a camera and generating a second image data, a step of calculating the length of the standard test specimen based on the second image data, and a step of comparing the calculated length of the standard test specimen with a reference value regarding the length of the standard test specimen stored in the cutting device, and determining whether adjustment for an external inspection is necessary based on the comparison result.

Inventors

  • 나카무라 카즈미
  • 오제키 다카토시
  • 사카타 고키
  • 후지와라 나오미
  • 와타나베 하지메

Assignees

  • 토와 가부시기가이샤

Dates

Publication Date
20260507
Application Date
20220530
Priority Date
20210909

Claims (6)

  1. It is a maintenance method for a cutting device, and The above cutting device is configured to manufacture an electronic component by cutting a package substrate and to perform an appearance inspection of the electronic component based on first image data. The above first image data is generated by capturing the electronic component placed on the table with a camera, and The above maintenance method is, A step of capturing a standard test specimen placed on the table above with the camera and generating second image data, and A step of calculating the length of the standard test specimen based on the second image data, and A step of comparing the calculated length of the standard test specimen with a reference value regarding the length of the standard test specimen stored in the cutting device, and determining whether adjustment is necessary for the appearance inspection based on the comparison result; If it is determined that adjustment for the above-mentioned appearance inspection is necessary, the method includes a step of performing the adjustment for the above-mentioned appearance inspection. A maintenance method comprising a step for performing adjustment for the above-mentioned external inspection, wherein the step for performing adjustment to bring the relative inclination between the table and the camera into a predetermined range.
  2. In paragraph 1, A maintenance method in which the adjustment for the above-mentioned appearance inspection is the calibration of the camera or the resetting of parameters regarding the above-mentioned appearance inspection.
  3. In paragraph 2, The above calibration is a maintenance method including calculating the pixel size of the camera.
  4. In paragraph 2 or 3, A maintenance method in which the above parameters include parameters for lighting that irradiates light onto the table.
  5. delete
  6. A method for manufacturing an electronic component using a maintenance method described in any one of paragraphs 1 to 3, and A method for manufacturing an electronic component, comprising the step of manufacturing the electronic component by cutting the package substrate after using the above maintenance method.

Description

Maintenance method and manufacturing method of electronic components The present invention relates to a maintenance method and a method for manufacturing electronic components. Japanese Patent Publication No. 2019-201143 (Patent Document 1) discloses an inspection method for measuring the pixel size of an imaging means included in a processing device. In this inspection method, an inspection jig is used to measure the pixel size. On the surface of this inspection jig, a pattern and a two-dimensional barcode recording the width of the pattern are formed. In this inspection method, an image of the pattern formed on the surface of the inspection jig is taken, and the number of pixels corresponding to the width of the pattern is measured. Then, the pixel size is calculated by dividing the width of the pattern read from the two-dimensional barcode by the number of pixels corresponding to the width of the pattern (see Patent Document 1). Figure 1 is a plan view schematically showing a cutting device. Figure 2 is a side view schematically showing the spindle section. Figure 3 is a schematic diagram showing the inspection by the second optical inspection camera. Figure 4 is a diagram schematically showing the hardware configuration of a computer. FIG. 5 is a schematic diagram showing a second optical inspection camera during the imaging of a calibration plate. FIG. 6 is a perspective view schematically showing an example of a correction jig. Figure 7 is a schematic diagram showing the plane of a correction plate. FIG. 8 is a schematic diagram showing a second optical inspection camera during imaging of a standard test specimen. FIG. 9 is a perspective view schematically showing an example of a maintenance jig. FIG. 10 is a schematic drawing showing an example of a pattern part. FIG. 11 is a schematic diagram showing an example of the shape of the lead face of a QFN package. FIG. 12 is a schematic diagram showing an example of the shape of the ball surface of a BGA package. FIG. 13 is a schematic drawing showing an example of the shape of the mold surface of a package. FIG. 14 is a flowchart showing the sequence of operations performed after the assembly of the cutting device. FIG. 15 is a flowchart showing the operation sequence performed during the maintenance timing of the cutting device. Hereinafter, an embodiment according to one aspect of the present invention (hereinafter also referred to as "the present embodiment") will be described in detail with reference to the drawings. In addition, identical or substantial parts in the drawings are denoted by the same reference numerals, and their descriptions are not repeated. Furthermore, each drawing is schematically drawn with objects appropriately omitted or exaggerated to facilitate understanding. [1. Composition] <1-1. Overall Configuration of the Cutting Device> FIG. 1 is a schematic plan view showing a cutting device (1) used in a maintenance method according to the present embodiment. The cutting device (1) is configured to reorganize a package substrate (object to be cut) into a plurality of electronic components (package components) by cutting the package substrate. In the package substrate, a substrate or lead frame on which a semiconductor chip is mounted is resin-sealed. Examples of package substrates include BGA (Ball Grid Array) package substrates, LGA (Land Grid Array) package substrates, CSP (Chip Size Package) package substrates, LED (Light Emitting Diode) package substrates, and QFN (Quad Flat No-leaded) package substrates. Additionally, the cutting device (1) is configured to inspect each of the reorganized electronic components. In the cutting device (1), an image of each electronic component is captured, and an inspection of each electronic component is performed based on the image. Inspection data is generated through the inspection, and each electronic component is classified as a "good product" or a "defective product." In this example, a package substrate P1 is used as the object to be cut, and the package substrate P1 is reorganized into a plurality of electronic components S1 by a cutting device (1). Hereinafter, among the two sides of the package substrate P1, the resin-sealed side is referred to as the mold side, and the side opposite to the mold side is referred to as the ball/lead side. As illustrated in FIG. 1, the cutting device (1) includes, as components, a cutting module A1 and an inspection and storage module B1. The cutting module A1 is configured to manufacture a plurality of electronic components S1 by cutting a package substrate P1. The inspection and storage module B1 is configured to inspect each of the manufactured plurality of electronic components S1 and then store the electronic components S1 in a tray. In the cutting device (1), each component is detachable and interchangeable with respect to other components. The cutting module A1 mainly includes a substrate supply unit (3), a positioning unit (4), a cutting table (5)